中热固相法制备掺杂钛的钒酸锂正极材料

以Li2CO3和V2O5为原料,用中热固相法制备了掺杂Ti4+的锂离子电池正极材料Li1.1V3―yTiyO8(y=0.05、0.1、0.2),并对其电化学性能进行了研究。研究表明,掺杂Ti能够很好地改善中热固相法产品的电化学性能,且当y=0.1时,Li1.1V3―yTiyO8循环性能最好,首次放电比容量高达250.9 mAh/g。     

Theoretical calculations of the surface tension of Ag(1−x)-Cu(x) liquid alloys

The surface tension of silver-copper binary liquid alloys is calculated, in the frame work of Eyring theory. The calculations were made for different compositions (mole fraction, x_Cu = 0, 0.2, 0.4, 0.6, 0.8 and 1), in the temperature range 1100-1800 K. The surface tension decreases with temperature increase, at a fixed copper fraction x_Cu, and increases with increasing copper content. The calculated results are appropriately compared with existing literature data.     

Salt Concentration Effects in Planar Light‐Emitting Electrochemical Cells

Incorporation of ions in the active layer of organic semiconductor devices may lead to attractive device properties like enhanced injection and improved carrier transport. In this paper, we investigate the effect of the salt concentration on the operation of light‐emitting electrochemical cells, using experiments and numerical calculations. The current density and light emission are shown to increase linearly with increasing ion concentration over a wide range of concentrations. The increasing current is accompanied by an ion redistribution, leading to a narrowing of the recombination zone. Hence, in absence of detrimental side reactions and doping‐related luminescence quenching, the ion concentration should be as high as possible.     

梭形线圈制动绕线架的改进

简要介绍了一种适用于中小型高压电机定子梭形线圈绕制的制动绕线架,它在生产过程中起了减少铜扁线绝缘损伤的作用,并能提高生产效率.     

纳米硅胶体铅酸善电池

从原理上分析了纳米气相二氧化硅胶体铅酸蓄电池的特性,介绍了一种研究成果,应用于铅蓄电池的硅胶体的制造原理和方法。主要是利用表面化学的基本原理和电化学动力学催化的基本方法,应用纳米气相SiO2溶胶的半导体掺杂电化学界面催化理论和纳米气相二氧化硅的表面改性理论,对纳米气相二氧化硅的表面改性,应用湿法改性：用有机改性,填加偶联剂和高分子表面活性剂和分散剂,如萘黄酸甲醛缩合物、聚丙稀酸、乙二醇、丙稀酸等。用无机改性,填加硼、磷、锡、硒等元素的化合物,都能达到改性的目的。使铅酸蓄电池具有克服了三种早期容量损失达到长寿命、大容量等优良的特性。     

半导体中子嬗变掺杂中的诱生缺陷

讨论了半导体材料中子嬗变掺杂（ Ｎ Ｔ Ｄ） 诱生缺陷的三种原因,即快中子辐射损伤、原子蜕变β辐射及γ辐射反冲造成的位移损伤。简述了由它们引起的缺陷的特性、常用的鉴别手段及相应的退火方法     

Cu丝超声球焊及楔焊焊点可靠性及失效机理研究

Cu丝由于具有优良的导热性能、机械性能以及低成本等优点使得用铜丝替代传统的Au丝和Al丝已经成为半导体工艺发展的必然方向.综述了Cu丝超声球焊以及楔焊焊点可靠性问题,对焊点的各种失效模式与机理进行探讨.     

树脂塞孔研磨过程中镀覆孔拐角露铜的探究

文章通过对树脂塞孔和树脂研磨的设计、制作和过程管控等方面进行优化,改善树脂塞孔板的金属化孔口铜厚不足及基材缺陷问题,防止后续镀铜后镀层分离报废产生,从而改善产品品质,提高客户满意度.