高兼容性低成本无铅材料开发与应用

现今市面上主流的无铅材料多是中Tg和高Tg的产品,高的Tg的预示着高成本;目前全球经济持续低迷,给PCB行业也带来了不小的冲击,迫使各PCB厂家积极寻求低成本高性能的替代材料。CCL供应商推出的PN固化、添加无机填料的普通Tg无铅兼容材料无疑成为一大亮点,成为有效提升客户产品性价比和竞争力的首选。此类型材料除满足一般传统多层板的要求,在HDI板、高多层及厚铜板方面表现同样优秀,文章将逐一说明,以供大家参考和借鉴。     

Effect of Sb implantation on copper silicides formation and morphology after annealing of Cu/Si structures

In this work, the solid state reaction between a thin film of copper and silicon has been studied using Rutherford backscattering spectroscopy, X-ray diffraction, scanning electron microscopy and microprobe analysis. Cu films of 400 and 900 Å thicknesses are thermally evaporated on Si(1 1 1) substrates, part of them had previously been implanted with antimony ions of 5×10¹⁴ or 5×10¹⁵ at. cm⁻² doses. The samples are heat-treated in vacuum at temperatures in the range 200–700 °C for various times. The results show the growth and formation of Cu₃Si and Cu₄Si silicides under crystallites shape dispatched on the sample surface, independently of the implantation dose. On the other hand, it is established that the copper layer is less and less consumed as the antimony dose increases, resulting in the accumulation of Sb⁺ ions at silicide/Si interface and in the silicide layer close to surface. The exposure of samples to air at room temperature shows the stability of Cu₄Si phase whereas the Cu₃Si silicide disappears to the benefit of the silicon dioxide formation. The observed phenomena are discussed.     

硫酸铜镀液镀铜机理概述

概述了硫酸盐镀铜的基本原理以及镀液组分的作用机理,同时给出电镀铜厚与电镀参数之间的依赖关系,对生产有一定的指导意义,希望能为新工艺的开发提供理论依据。     

勃姆石在覆铜板中的应用研究

勃姆石有好的耐热性和低的硬度,本文对比了勃姆石和氢氧化铝对覆铜板耐热性和阻燃性的影响,并研究勃姆石不同添加量对覆铜板剥离强度、吸水率、热膨胀系数和介电性能的影响。     

Electrical and optical properties of deep ultraviolet transparent conductive Ga2O3/ITO films by magnetron sputtering

Ga2O3/ITO films were prepared by magnetron sputtering on quartz glass substrates. The transmittance and sheet resistance of ITO films and Ga2O3/ITO films were measured by using a double beam spectrophotometer and four point probes. The effect of the ITO layer and Ga2O3 layer thickness on the electrical and optical properties of Ga2O3/ITO bi-layer films were investigated in detail. Ga2O3 (50 nm)/ITO (23 nm) films exhibited a low sheet resistance of 323 Ω/□ and high deep ultraviolet transmittance of 77.6% at a wavelength of 280 nm. The ITO layer controls the ultraviolet transmittance and sheet resistance of Ga2O3/ITO films. The Ga2O3 layer thickness has a marked effect on the transmission spectral shape of Ga2O3/ITO films in the violet spectral region.     

Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper

Abrasive particles used in chemical mechanical planarization (CMP) of copper often agglomerate and cause scratches on the finished surface. Abrasive-free CMP offers a feasible solution to this problem, and our present work examines four dicarboxylic acids (oxalic, malonic, succinic and glutaric, with increasing carbon chain lengths) as possible complexing agents for such a chemically dominated CMP process. At pH 3.0-4.0, oxalic and malonic acids are most effective for abrasive-free Cu removal. The rates of Cu dissolution and polish (with or without abrasives) are correlated with pH dependent distributions of mono-anionic (for oxalic and malonic) and neutral (for succinic and glutaric) acid species. The surface morphologies of a Cu wafers obtained by abrasive-free CMP in these acids also are more defect free and flat compared to those obtained using abrasives.     

Plasma etching of copper films at low temperature

Experimental verification of a low temperature (<20 °C), reactive plasma etch process for copper films is presented. The plasma etch process, proposed previously from a thermochemical analysis of the Cu-Cl-H system, is executed in two steps. In the first step, copper films are exposed to a Cl₂ plasma to preferentially form CuCl₂, which is volatilized as Cu₃Cl₃ by exposure to a H₂ plasma in the second step. Plasma etching of thin films (9 nm) and thicker films (400 nm) of copper has been performed; chemical composition of sample surfaces before and after etching has been determined by X-ray photoelectron and flame atomic absorption spectroscopies.     

Effect of Bi doping on the properties of CdSe thin films for optoelectronic device applications

CdSe and Bi (1%, 2%, 3%) doped CdSe thin films were deposited on the glass substrates using thermal evaporation technique. Effect of Bi doping on the structural, optical, electrical and photo response properties of CdSe thin films were investigated. The X-ray diffraction studies reveals that undoped and Bi doped CdSe films are polycrystalline in nature with hexagonal crystal structure along (002) direction. No significant changes are observed in the lattice parameters or the grain size indicating minimum lattice distortion. The optical band gap of undoped CdSe film was estimated to be 1.67 eV. Replacement of cadmium by bismuth results in an increase in the electrical conductivity of doped films. Doping with bismuth is found to improve the photo sensitivity of CdSe thin films.