16MnR钢高温疲劳裂纹扩展行为试验研究

对16MnR钢在常温、150℃、300℃和425℃下的疲劳裂纹扩展速率进行了测试和分析,得到了四种温度下的疲劳裂纹扩展规律。结果表明：该材料在150℃和300℃的疲劳裂纹扩展速率比常温和425℃时低,425℃时疲劳裂纹扩展速率最高。     

微乳法合成磷酸钙纳米纤维及其机理探讨

分别以非离子表面活性剂（C₁₂E₈）和阳离子表面活性剂（CTAB）为模板剂,在反微乳体系中制备了磷酸钙纳米纤维.在水/C₁₂E₈/环己烷体系中纤维长约为325 nm,宽约为13 nm,为无定形态;在水/CTAB/环己烷体系中纳米纤维的长度>500 nm,宽度约为14 nm,结晶较完全.两种表面活性剂的作用机理完全不同：在非离子表面活性剂体系中,表面活性剂主要起到“微反应器”的作用;而在阳离子表面活性剂中,表面活性剂主要起到“生长引导剂”作用.     

Allelopathic Effects of Volatile Monoterpenoids Produced by <Emphasis Type="Italic">Salvia leucophylla</Emphasis>: Inhibition of Cell Proliferation and DNA Synthesis in the Root Apical Meristem of <Emphasis Type="Italic">Brassica campestris</Emphasis> Seedlings

Salvia leucophylla, a shrub observed in coastal south California, produces several volatile monoterpenoids (camphor, 1,8-cineole, -pinene, -pinene, and camphene) that potentially act as allelochemicals. The effects of these were examined using Brassica campestris as the test plant. Camphor, 1,8-cineole, and -pinene inhibited germination of B. campestris seeds at high concentrations, whereas -pinene and camphene did not. Root growth was inhibited by all five monoterpenoids in a dose-dependent manner, but hypocotyl growth was largely unaffected. The monoterpenoids did not alter the sizes of matured cells in either hypocotyls or roots, indicating that cell expansion is relatively insensitive to these compounds. They did not decrease the mitotic index in the shoot apical region, but specifically lowered mitotic index in the root apical meristem. Moreover, morphological and biochemical analyses on the incorporation of 5-bromo-2-deoxyuridine into DNA demonstrated that the monoterpenoids inhibit both cell-nuclear and organelle DNA synthesis in the root apical meristem. These results suggest that the monoterpenoids produced by S. leucophylla could interfere with the growth of other plants in its vicinity through inhibition of cell proliferation in the root apical meristem.     

来流对Al-Cu合金三维树枝晶生长的影响

建立了模拟二元合金树枝晶生长的三维元胞自动机模型,以Al-4%Cu(质量分数)为模型合金,模拟了合金过冷熔体中树枝晶的生长过程,研究了来流对枝晶生长的影响.结果表明,来流对合金过冷熔体中三维树枝晶生长影响显著,迎流侧枝晶尖端生长速度随来流速度的增大而增大,枝晶尖端半径随来流速度的增大而减小;随着来流速度的增大,枝晶尖端选择参数减小;在给定过冷度条件下,随界面能各向异性的增大,来流对枝晶尖端选择参数的影响增强;对于给定的合金(或界面能各向异性),来流对枝晶尖端选择参数的影响随着过冷度的增大而增强.     

三维枝晶生长数值模拟及实验验证(英文)

建立了用于模拟立方晶系合金三维枝晶生长的改进元胞自动机模型。该模型将枝晶尖端生长速率、界面曲率和界面能各向异性的二维方程扩展到三维直角坐标系,从而能够描述三维枝晶生长形貌演化。应用本模型模拟在确定温度梯度和抽拉速度条件下三维柱状晶生长过程的一次臂间距调整机制和不同择优取向柱状晶之间的竞争生长。使用NH4Cl?H2O透明合金进行凝固实验,模拟结果和实验结果吻合较好。     

Analysis of grain growth process in melt spun Fe-B alloys under the initial saturated grain boundary segregation condition

A grain growth process in the melt spun low-solid-solubility Fe-B alloys was analyzed under the initial saturated grain boundary (GB) segregation condition. Applying melt spinning technique, single-phase supersaturated nanograins were prepared. Grain growth behavior of the single-phase supersaturated nanograins was investigated by performing isothermal annealing at 700 °C. Combined with the effect of GB segregation on the initial GB excess amount, the thermo-kinetic model [Chen et al., Acta Mater. 57 (2009) 1466] was extended to describe the initial GB segregation condition of nanoscale Fe-B alloys. In comparison of pure kinetic model, pure thermodynamic model and the extended thermo-kinetic model, an initial saturated GB segregation condition was determined. The controlled-mechanism of grain growth under initial saturated GB segregation condition was proposed using two characteristic annealing times (t₁ and t₂), which included a mainly kinetic-controlled process (t ≤ t₁), a transition from kinetic-mechanism to thermodynamic-mechanism (t₁ < t < t₂) and pure thermodynamic-controlled process (t ≥ t₂).     

Microstructural control of TiAl-Nb alloys by directional solidification

The lamellar microstructure of TiAl-Nb alloys with and without low boron additions is controlled using double directional solidification (DS). In alloys without the addition of boron, the β phase is seeded during double DS. Complete peritectic transformation occurs in both the dendritic and interdendritic regions, which can lead to the successful alignment of both the high-temperature α phase and the lamellar microstructures. Well-aligned lamellar microstructures can be easily achieved if the alloy composition is close to the peritectic point on the hypo-peritectic side. In alloys with low boron additions, however, the competitive growth of the α phase breaks the continuity of the lamellar microstructure in the region ahead of stable growth, which finally results in columnar grain coarsening and unsuccessful alignment of the lamellar microstructures.     

Role of Cu film texture in grain growth correlated with twin boundary formation

To understand the role of Cu film texture in grain growth at room temperature (RT) in relation to twin boundary formation Cu films were deposited on various barrier materials and the Cu film texture was investigated by X-ray diffraction. Cu grain growth was rapid on a barrierless SiO₂/Si substrate and very slow on a Ta barrier due to strong (1 1 1) texture. The growth rate and the average grain diameter after being kept at RT for up to ∼60 days were maximum at a (2 0 0)_Cu peak to (2 2 2)_Cu peak area ratio of ∼1.0, where {1 1 1}, {1 0 0} and {5 1 1} grains coexisted. Such coexistence of three or more orientations of grains is essential in facilitating Cu grain growth at RT. Similarly, the average twin boundary (TB) density was maximum when Cu grain growth was facilitated. TB formation in nano-sized Cu grains was not controlled by grain size, but due to grain growth. The TB could be annealing twins caused by irregularities in the stacking sequence during relatively fast grain growth. The Cu film texture is concluded to be determined at the beginning of deposition, and the wettability of various barrier materials by the Cu films plays a key role in determining the film texture.     

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering

This study investigates the concurrent nucleation, formation and growth of two intermetallic compounds (IMCs), Cu₆Sn₅ (η) and Cu₃Sn (ε), during the early stages of soldering in the Cu-Sn system. The nucleation, formation and growth of the IMC layers is simulated through a multiphase-field model [1] and [2] in which the concurrent nucleation of both IMC phases is considered to be a stochastic Poisson process with nucleation rates calculated from classical nucleation theory [3]. CALPHAD thermodynamic models are used to calculate the local contributions to the free energy of the system and the driving forces for precipitation of the IMC phases. The nucleation parameters of the η phase are estimated from experimental results [4] and those of the ε phase are assumed to be similar. A parametric investigation of the effects of model parameters (e.g. grain boundary (GB) diffusion rates, interfacial and GB energies) on morphological evolution and IMC layer growth rate is presented and compared with previous works in which nucleation was ignored [5]. In addition, the resulting growth rates are compared with the available literature and it is found that, for a certain range in the model parameters, the agreement is quite satisfactory. This work provides valuable insight into the dominant mechanisms for mass transport as well as morphological evolution and growth of IMC layers during early stages of Pb-free soldering.     

Stabilization and strengthening of nanocrystalline copper by alloying with tantalum

Nanocrystalline Cu-Ta alloys belong to an emerging class of immiscible high-strength materials with a significant potential for high-temperature applications. Using molecular dynamics simulations with an angular-dependent interatomic potential, we study the effect of Ta on the resistance to grain growth and mechanical strength of nanocrystalline Cu-6.5 at.% Ta alloys. Ta segregation at grain boundaries greatly increases structural stability and strength in comparison with pure copper and alloys with a uniform distribution of the same amount of Ta. At high temperatures, the segregated Ta atoms agglomerate and form a set of nanoclusters located at grain boundaries. These nanoclusters are capable of pinning grain boundaries and effectively preventing grain growth. It is suggested that the nanoclusters are precursors to the formation of larger Ta particles found in Cu-Ta alloys experimentally.