High cycle fatigue behaviour of Ti–6Al–4V alloy at elevated temperatures

High cycle fatigue behaviour of Ti–6Al–4V alloy was studied at 623 K and 723 K. Fatigue strength decreased at elevated temperatures compared with at ambient temperature. In the short life regime, fatigue strength was lower at 723 K than at 623 K, but in the long life regime it was nearly the same at both temperatures. At elevated temperatures, cracks were generated earlier at applied stresses below the fatigue limit at ambient temperature, indicating lowered crack initiation resistance. Small cracks grew faster at elevated temperatures than at ambient temperature, which became more noticeable with increasing temperature. After allowing for the elastic modulus, small cracks still grew faster at elevated temperatures.     

Critical transistors nexus based circuit-level aging assessment and prediction

Accurate age modeling, and fast, yet robust reliability sign-off emerged as mandatory constraints in Integrated Circuits (ICs) design for advanced process technology nodes. In this paper we introduce a novel method to assess and predict the circuit reliability at design time as well as at run-time. The main goal of our proposal is to allow for: (i) design time reliability optimization; (ii) fine tuning of the run-time reliability assessment infrastructure, and (iii) run-time aging assessment. To this end, we propose to select a minimum-size kernel of critical transistors and based on them to assess and predict an IC End-Of-Life (EOL) via two methods: (i) as the sum of the critical transistors end-of-life values, weighted by fixed topology-dependent coefficients, and (ii) by a Markovian framework applied to the critical transistors, which takes into account the joint effects of process, environmental, and temporal variations. The former model exploits the aging dependence on the circuit topology to enable fast run-time reliability assessment with minimum aging sensors requirements. By allowing the performance boundary to vary in time such that both remnant and nonremnant variations are encompassed, and imposing a Markovian evolution, the probabilistic model can be better fitted to various real conditions, thus enabling at design-time appropriate guardbands selection and effective aging mitigation/compensation techniques. The proposed framework has been validated for different stress conditions, under process variations and aging effects, for the ISCAS-85 c499 circuit, in PTM 45 nm technology. From the total of 1526 transistors, we obtained a kernel of 15 critical transistors, for which the set of topology dependent weights were derived. Our simulation results for 15 critical transistors kernel indicate a small approximation error (i.e., mean smaller than 15% and standard deviation smaller than 6%) for the considered circuit estimated end-of-life (EOL), when comparing to the end-of-life values obtained from Cadence simulation, which quantitatively confirm the accuracy of the IC lifetime evaluation. Moreover, as the number of critical transistors determines the area overhead, we also investigated the implications of reducing their number on the reliability assessment accuracy. When only 5 transistors are included into the critical set instead of 15, which results in a 66% area overhead reduction, the EOL estimation accuracy diminished with 18%. This indicates that area vs. accuracy trade-offs are possible, while maintaining the aging prediction accuracy within reasonable bounds.     

基于改进的BASS模型的服装产品生命周期研究

为提高服装的销售预测准确度,通过产品的生命周期曲线模型,使得服装销售预测的定性分析与定量预测有机地结合在一起。针对目前服装产品生命周期曲线模型的局限性,引入改进的BASS模型,对服装产品生命周期进行研究。通过销售实例探讨改进的BASS模型用于描述服装生命周期的可行性,建立了以改进的BASS模型为基础的服装产品生命周期模型,并利用该模型对服装销售量做预测,取得了比其他模型更高的精度。     

AGING BEHAVIOUR OF PARTICULATE REINFORCED ALUMINUM ALLOY MATRIX COMPOSITES

The process of aging precipitation in SiC_p/6061 and Al_2O_3/6061 composites were investigated. Hardness testing, differential scanning calorimetry(DSC) and transmission electron microscopy were employed. Results showed that the precipitation phase form directly along dislocation lines in the composites because the particles produce high densities of dislocations which makes vacancy densities in the composites decrease, and the main precipitation phase at peak hardness was β′ phase.     

Effects of gold plating on the resistance to high temperature discoloration of the cavity for ceramic packages

The effects of thickness and types of gold plating on the resistance to high temperature discoloration of gold plating on cavity surface of ceramic package were investigated. It was found that the thicker gold plating, the less discoloration degree for ceramic packages. Non-cyanide gold plating performed better resistance to high-temperature aging than cyanide gold plating. The relationship between the gold plating thickness and the amount of diffused Ni to the gold plating of ceramic packages with Au/Ni and Au/Ni-Co platings after heating at 420℃for 15 min was also studied. When the gold plating thickness reach 2.0 μm and 1.6 μm for Au/Ni and Au/Ni-Co plating systems, respectively, no discoloration was observed on the gold plating surface of cavity, and the corresponding diffused Ni amounts (mass fraction) are 1.0% and 0.4%, while the diffused Co to the gold plating is 0.04%.     

Effects of γ/γ interfacial structures on continuous coarsening of lamellar microstructure in TiAl alloy during aging

The effects of γ/γ interfacial structures on continuous coarsening of the fully lamellar microstructure in Ti-48Al alloy aged at 1 150 ℃ were investigated by using transmission electron microscopy(TEM). Continuous lamellar coarsening can be achieved not only by migration of interface faults(such as ledges, edges and curved interfaces) but also by migration and decomposition of perfect γ/γ lamellar interfaces. Thermal grooves, initiative positions of interfacial dissociation, can frequently form at the triple point junctions between the 120°-rotational ordered γ domain boundaries within γ lamellae and the lamellar interfaces. During the early stage of aging at 1 150 ℃, the interface migration and dissociation took place preferentially at the 120°-rotational ordered lamellar interfaces. Comparing the relative thermal stability of the true-twin, pseudo-twin and 120°-rotational ordered γ/γ lamellar interfaces shows that the 120°-rotational ordered lamellar interface is the most unstable. The reason of this phenomenon was analyzed through the comparisons of the interfacial energies and atomic arrangements of the three types of γ/γ lamellar interfaces.     

核电站数字化反应堆保护系统停堆响应时间分析

为了评价出核电站数字化反应堆保护系统停堆响应的最大时间,根据数字化反应堆保护系统结构,分析出保护系统的响应过程须经过AI输入、IO总线通讯、CPU运算、网络通讯、DO输出处理。并基于DCS定周期扫描的运行方式,得出了各处理过程所需最大响应时间的计算方法,DCS停堆响应时间的评价值就是各部分最大响应时间的累加。最后提出了可缩短响应时间的改进方法。     

一种改进编码器角度解算过程的方法与实现

在机械电子一直是一个热门学科,其目的是通过软件控制机械操作来代替机械的哑巴解决方案。DS-25旋转电子编码器能够很好地与机械电子应用相匹配,其输出为两路标准的sine和cosine曲线,通过分析sine和cosine数值来计算编码器所对应的绝对角度位置。通过对DS-25的工作模式分析和实际应用情况提出角度解算的改进方案,该方案利用DS-25工作于粗略模式下测试到的角度值来推算精确模式下的信号周期,结合精确模式下测试到的角度值来计算编码器所对应的绝对角度。摒弃其原有的复杂查表过程进而节省电子表格的存储空间,在降低硬件成本的同时提升了软件灵活性。实验证明,算法的改进能够节省约2KB的存储空间,角度位置误差能控制在1‰以内。     

SBS改性沥青超热老化模式下氧化与挥发的贡献机理

利用宏观和微观分析相结合的方法,定量分析了SBS改性沥青超热老化模式下氧化与挥发的贡献机理。通过研究不同老化温度下常规三大指标,DSR流变车辙因子分别在空气氛和高纯氮气氛下老化的衰变规律,并结合傅里叶变换红外光谱微观表征手段,定量计算出SBS改性沥青超热老化过程中氧化与挥发的贡献率,得出SBS改性沥青在超热老化模式下,其老化机理是以SBS分子中的双键被氧化为主要因素,但随着超热老化温度升高,小分子挥发等非氧化因素逐渐成为超热老化的又一主要因素。宏观分析中,从普通老化的163℃到超热老化的198℃,氧化与挥发对SBS改性沥青针入度衰减的贡献率比由6∶4变为1∶1;对延度衰减的贡献率比由7∶3变为1∶1;对车辙因子的贡献率比由24∶1变为2∶1;而红外光谱微观分析中,氧化与挥发对SBS改性沥青超热老化后不饱和双键的衰减贡献率比由7∶3变为1∶1。