The effect of additives on the thermal stability of poly(vinyl chloride)

The effect of a range of organic additives on the thermal stability of poly(vinyl chloride), both with and without a chloroparaffin extender, was studied using a number of experimental techniques. Of the additives used the best overall balance was provided by pentaerythritol, which increased stability when the extender was present and had no effect when it was absent. The congo red test emerged as the most suitable technique, being consistent and inexpensive and able to screen several additives simultaneously. Isothermal differential thermal analysis correlated with the congo red test but required more expensive equipment, was time-consuming and demanded good mixing of the poly(vinyl chloride) compound to give reproducible results. Thermogravimetry was not sufficiently sensitive and the heat stability test was the least useful of all.     

Thermally stimulated shrinkage forces in oriented polymers: 1. Temperature dependence

Temperature dependences of shrinkage forces appearing in oriented polymer samples when heated at constant length were recorded for polycarbonate, polyethylene terephthalate, polyethylene and polypropylene. The influence of various processing conditions on thermally stimulated shrinkage forces is demonstrated. A four-state model is proposed which qualitatively describes the temperature dependences of shrinkage forces in amorphous polymers.     

Thermal degradation of cinnamoylated poly(vinyl alcohol)

Thermogravimetry and pyrolysis in combination with gas chromatography and infrared spectroscopy were the experimental techniques applied to the thermal degradation of cinnamoylated poly(vinyl alcohol) samples, constituted from vinyl alcohol-vinyl cinnamate photocrosslinkable copolymers. The thermal decomposition products include gases, liquids and solids. The gases are formed from saturated and unsaturated volatile hydrocarbons C₁? C₄, carbon monoxide and carbon dioxide. The liquid fraction includes aromatic hydrocarbons and some oxygenated organic compounds. The solid product identified in the greatest amount was cinnamic acid. The content in the thermal decomposition products varies considerably both with copolymer composition and temperature.     

Development of nano indium tin oxide (ITO) grains by alkaline hydrolysis of In(III) and Sn(IV) salts

Indium tin oxide (ITO) nano powders of different compositions (In: Sn = 90: 10, 70: 30 and 50: 50) were prepared by heat treatment (300-450°C) of mixed hydroxides of In(III) and Sn(IV). The hydroxides were obtained by the reaction of aq. NH₃ with mixed aq. solutions of In(NO₃)₃ and SnCl₄. FTIR and TG/DTA studies revealed that powders existed as In(OH)₃H₂O—SnO₃H₂H₂O in the solid state and then they transformed to In₂O₃—SnO₂ via some metastable intermediates after 300°C. Cubic phase of In₂O₃ was identified by XRD for the oxides up to 30% of Sn. Particle size measurements of the solid dispersed in acetone and SEM study for microstructure showed that the oxides were in the nano range (55-75 nm) whereas the size range determined from Debye-Scherrer equation were 11–24 nm.     

水性聚氨酯电导率与聚沉值的研究

研究了软（硬）段含羧基的水性阴离子纳米聚氨酯体系的n(NCO)/n(OH)比值，COOH的质量分类，反离子各类，合成方法与电导率关系及产生的原因；探讨了该体系的n(NCO)/n(OH)值，COOH的质量分数，合成方法与临界聚沉值（Cc.c)的关系和规律。并分析，比较了软（硬）段含羧基的水性阴离子聚氨酯体系电导率与Cc.c二者关系，得出了随COOH的质量分数升高，二者变化相同，随n(NCO)/n(OH)比值升高,二者变化相反的结论。     

纳米4-H碳化硅薄膜的掺杂现象

对纳米晶SiC薄膜进行了P和B的掺杂,B掺杂效率比P高,其暗电导预前因子与激活能遵守Meyer-Neldel规则,并有反转Meyer-Neldel规则出现.掺杂效率比非晶态碳化硅薄膜高是纳米碳化硅薄膜的特点之一.非晶态中的隧穿和边界透射对输运有一定贡献.     

Stability of Standard Electrolytic Conductivity Solutions in Glass Containers

The stability of solutions having an electrolytic conductivity, κ, of 5 μS/cm to 100 000 μS/cm packaged in glass screw-cap bottles, glass serum bottles, and glass ampoules was monitored for 1 year to 2 years. The conductivity was determined by measuring the ac resistance of the solution. Mass loss was also monitored for solutions packaged in bottles. The solutions were prepared using KCl in water (κ ≥100 μS/cm) or KCl in 30 % (by mass) n-propanol 70 % (by mass) water (κ ≤ 15 μS/cm). The conductivity changes were compared by packaging type and by nominal κ. The main causes of the κ changes are evaporation (screw-cap bottles) and leaching (screw-cap bottles, serum bottles, and ampoules). Evaporation is determined from mass loss data; leaching occurs from the glass container with no change in mass. The choice of optimal packaging, which depends on the conductivity level, is the packaging in which κ changes the least with time. Ampoules are the most suitable packaging for standards having nominal κ values of 500 μS/cm to 100 000 μS/cm. Screw-cap bottles are most suitable for standards having a nominal κ of 5 μS/cm to 100 μS/cm.     

Development of High Thermal Conductivity Aluminum Nitride Ceramic

AIN ceramics with densities varying from 3.18 to 3.30 g/cm³ and room-temperature thermal conductivities varying from 88 to 193 W/m K were produced. Different sintering conditions, packing powders, AIN powder sources, carbon additive, and sintering times were evaluated, and the key processing parameters which cause the differences in density and thermal conductivity were identified. SEM, TEM, and EDS were used to characterize the correlation between thermal conductivity, microstructure, and processing parameters. The important parameters which control the thermal conductivity of AIN ceramics are discussed.     

金属PTC陶瓷复合材料结构及其导电机理

研究了金属ＰＴＣ陶瓷复合材料的电学性能和其材料组分。结果表明，掺入金属的ＰＴＣ陶瓷材料经氮气中烧结，然后在空气中进行热处理，材料表面形成高势垒层，金属ＰＴＣ陶瓷复合材料的室温电阻较ＰＴＣ的陶瓷高。样品之中存在大量不同类型的极化，在低温时样品电阻较高，温度增加后，大量各种类型离子极化出现，在变价金属铁的变价导电作用下，削弱表面势垒，使金属ＰＴＣ陶瓷复合材料电阻降低，表现出ＮＴＣ现象。在电场作用下，正负电荷、晶粒畸变和空位缺陷等产生空间电荷极化使金属ＰＴＣ陶瓷复合材料有较高介电常数。介电损耗（ｔｇδ）频谱和介电δ温度谱上都出现一个介电峰，其主要原因是跃迁极化，金属阳离子由一个位置跃迁到另一个位置，在介电损耗所对应的频率和温度时出现跃迁极化率最大     

聚氧化乙烯—聚磷酸钠共混物的钠离子导电性

研究了聚氧化乙烯-聚磷酸钠共混物的钠离子导电性和低分子量多缩乙二醇对共混物导电性的改进作用。结果表明,降低多缩乙二醇的分子量以及增加其含量都有利于提高共混物的离子导电率。增塑剂改进共混物导电性的实质是提高共混物的非晶相含量,共混物内钠离子传导发生在非晶区,聚合物链段运动是离子传导的主要推动力。