THE FRACTURE MECHANISM OF 475°C EMBRITTLEMENT IN A DUPLEX STAINLESS STEEL

The mechanism of “475°C embrittlement” of a duplex stainless steel was investigated using finite element modelling of the stress distribution at brittle fracture initiation. Brittle fracture initiated at a critical shear stress, which increased with ferrite hardness. The fracture stress was affected by the duplex microstructure. Fracture was nucleated by deformation twins, which were identified using electron back-scatter diffraction. The ductile-to-brittle fracture transition was sensitive to age-hardening and could be described simply by the effect of age-hardening and test temperature on the yield stress.     

用Labwindows/CVI开发量块自动鉴定系统

本文介绍了用虚拟仪器软件Labwindows/CVI平台开发基于R2 32串口的量块自动鉴定系统 ,并给出了示例。     

TMS320C55x嵌入式实时多任务操作系统DSP/BIOSⅡ

DSP／BIOS是运行在数字信号处理器（DSP）中的一个小型韧件，它的软件部件不仅能使开发者实时监测和控制程序执行和程序变量，而且可以对实时多线程系统进行合理的时间规划。文章对DSP／BIOSⅡ的基本特征与应用作了介绍。     

内含低噪声可编程增益放大器的24位∑-Δ模数转换器AD1555/AD1556

美国ADI公司推出的24位∑-Δ模数转换器AD1555/AD1556内含可编程增益放大器,可用于低频、大动态范围的测量,并可实现模拟输入线性输出,AD1555/AD1556有五种不同的增益设定.将AD1555和AD1556数字滤波器/抽样器结合使用可组成高性能的模数转换器,因而可广泛应用于地震数据探测系统和自动测试装置.     

HIPS-g-MA共聚物对HIPS/PC共混物相容性、形态和拉伸性能的影响

研究了HIPS／PC共混物的相容性及HIPS－MA对HIPS（30）／PC（70）共混物的相容性、形态和拉伸性能的影响。DSC研究结果表明，HIPS／PC共混物中PS的玻璃化转变温度（Tg)不随组成而变化，而PC的Tg随其质量分数的降低逐渐向低温移动，说明HIPS／PC是部分相容体系。通过DSC、扫描电镜形态观察和拉伸性能测试结果发现，当HIPS－g-MA的含量低于7．5％时，共混物的相容性改善不明显，当其含量达到7．5％时，对共混物有明显的乳化作用，说明饱和的界面浓度在7．5％左右。HIPS－g-MA接枝共聚物在HIPS（30）／PC（70）共混物中的增容作用可能是酯交换反应原位生成的嵌段共聚物所致。     

纳米材料对PBT合成的催化性能研究

用溶胶－凝胶法制备TiO2及TiO2/SiO2复合纳米材料，作为PBT（聚对苯二甲酸丁二酯）合成的催化剂，与现在普通使用的催化剂钛酸丁酯进行了比较和研究。结果发现，TiO2/SiO2复合纳米材料催化性能最好，纳米TiO2次之。     

Adsorption of 117mSn(Ⅳ)-EDTMP on hydroxyapatite and collagen

Some organic phosphines labeled with 117mSn(Ⅳ) have been provedpromising for imaging and pain palliation of bone tumor. In this paper, a prelimi-nary investigation on the adsorption characteristics of EDTMP (ethelenediaminete-tramethylene phosphoric acid) labeled with 117mSn(Ⅳ) on HA(hydroxyapatite) andcollagen, and an investigation on the adsorption mechanism of 117mSn(Ⅳ)-EDTMPon HA was presented.``     

Disparity field and depth map coding for multiview 3D image generation

In the present paper techniques are examined for the coding of the depth map and disparity fields for stereo or multiview image communication applications. It is assumed that both the left and right channels of the multiview image sequence are coded using block- or object-based methods. A dynamic programming algorithm is used to estimate a disparity field between each stereo image pair. Depth is then estimated and occlusions are optionally detected, based on the estimated disparity fields. Spatial interpolation techniques are examined based on the disparity/depth information and the detection of occluded regions using either stereoscopic or trinocular camera configurations. It is seen that the presence of a third camera at the transmitter site improves the estimation of disparities, the detection of occlusions and the accuracy of the resulting spatial interpolation at the receiver. Various disparity field and depth map coding techniques are then proposed and evaluated, with emphasis given to the quality of the resulting intermediate images at the receiver site. Block-based and wireframe modeling techniques are examined for the coding of isolated depth or disparity map information. Further, 2D and 3D motion compensation techniques are evaluated for the coding of sequences of depth or disparity maps. The motion fields needed may be available as a byproduct of block-based or object-based coding of the intensity images. Experimental results are given for the evaluation of the performance of the proposed coding and spatial interpolation methods.     

助剂对Pd/树脂醚化催化剂催化性能的影响 Ⅰ.铝助剂的影响

研究了不同助剂对Ｐｄ／树脂醚化催化剂在临氢条件下对催化裂化汽油Ｃ５馏份与甲醇和Ｈ２反应的催化性能的影响。结果表明，在Ｐｄ／树脂醚化催化剂中引入Ｚｒ、Ｔｉ、Ｂ、Ｓｎ和Ａｌ等助剂后，都能改善催化剂的醚化、双键异构和二烯烃选择性加氢活性，其中以Ａｌ、Ｓｎ为最好。Ａｌ助剂的体积质量和负载方式对Ｐｄ－Ａｌ／树脂醚化催化剂的活性有影响。ＢＥＴ方法和Ｘ－射线荧光光谱分析（ＸＦＳＡ）表明，Ａｌ助剂对Ｐｄ－Ａｌ／树脂醚化催化剂的表面积、孔结构和Ｐｄ离子交换量影响较小。     

高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用

介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。