卧式管内流体动力自动清洗螺旋纽带的结构关系研究

本文提出了卧式冷凝管内流体动力自动清洗螺旋纽带结构优化目标。对管内插有自转式螺旋纽带的流体进行了运动分析，进而采用理论与试验测量相结合的办法，建立了插有自转式螺旋纽带的管中流体所受的清洗扭矩、流体阻力系数及对流体传热努塞尔准数与纽带结构参数的理论计算式，论述了电厂真空冷凝器污垢自动清洗纽带的结构优化研究的结果。     

一种不确定RFID数据流清洗策略

原始RFID数据流含有大量噪声且具有不确定性,必须在使用之前对其进行数据清洗,而清洗策略是清洗质量的保证。提出一种适合不确定RFID数据流的清洗策略。该清洗策略引入了最大熵原理,对待清洗的RFID元组的特征属性进行权重选择,并根据清洗节点的时间消耗以及误差进行清洗成本分析,决策出最佳的清洗方法。仿真实验结果表明,该清洗策略提高了不确定RFID数据流的清洗效率与精度。     

基于ARM的小型湖面漂浮物清扫机器人设计

结合当前机器人技术和嵌入式技术的融合发展,采用嵌入式Linux操作系统、WIFI和ARM11等,提出、研究并设计出了小型湖面漂浮物清扫机器人系统,详细阐述和给出了总体方案设计、硬件设计、软件设计等系统设计过程.该系统经实践验证:机器人能够顺利的实现前进、后退、转向和作业操作;系统具有操作简单、安全平稳、经济环保、适应性强等特点.     

Analysis and Reduction of Ultrasonic Pitting Defects on Hard Disk Surfaces

It has become of paramount importance to be able to perform failure analysis of defects on hard disk surfaces quickly and accurately. In this study, ultrasonic pitting defects on hard disk surfaces were investigated. A new electrical tagging pattern system, which directly translated the channel bits to magnetic transitions during writing of the magnetic pattern around a defect, was used in the failure analysis of magnetic recording disks to mark defective sectors. With the help of the Kerr magneto-effect, the defective sectors were effectively located for further failure analysis. Results of the failure analysis revealed that there was 30% to 40% loss of the recorded magnetic bit signal due to an increase in the gap between a recording head and a hard disk surface with ultrasonic pitting defects. The experiments performed indicated that low ultrasonic power for disk cleaning could reduce the ultrasonic pitting defects significantly. The maximum failure rate due to single-type ultrasonic pitting defects was reduced from 33.4% to 16.7%, while the maximum failure rate due to cluster-type ultrasonic pitting defects was reduced from 11.1% to 5%.     

等离子体清洗同步辐射光学元件

同步辐射光束线的光学元件的碳污染问题.它导致光学系统的光通量下降,尤其是在碳吸收边情况更加严重.因此在光束线运行一定的时间后,必须对光学元件的碳污染进行清洗以便保证其正常使用. 为此我们开发了一套射频等离子体原位光学元件清洗系统,以干燥的氧气和氩气为介质.在产生的等离子中存在大量的臭氧,与光学元件表面的碳反应,变成CO和CO_2气体,从而达到清洗的目的.实验证明等离子体清洗不但可有效清除碳污染,而且有利于光束线真空系统的超高真空环境的恢复,为光束线的维护提供了方便.     

驻极体空气过滤材料消静电实验研究

选取4片不同级别的驻极体空气过滤材料,对滤料消除静电效应前后的计数效率和PM2.5净化效率等性能参数进行了试验研究,消静电方法采用的是异丙醇浸泡法,试验用气溶胶为KCl固态气溶胶。试验结果表明:采用异丙醇浸泡法能够在一定程度上消除驻极体过滤材料本身所带的静电;消除静电效应后滤料对不同粒径颗粒的计数效率均有所下降,特别是颗粒物粒径越小,过滤效率下降的幅度也越大;消静电后滤料对PM2.5的净化效率也有所下降。研究结果揭示了采用驻极体过滤材料制造而成的带静电过滤器在实际使用过程中可能存在的因静电消失后带来的效率下降风险,试验数据也能为将来空气过滤器国家相关标准的修订提供参考建议。     

射频等离子清洗系统设计

等离子清洗具有优越的环境特性和去污能力,但缓慢的清洗速度限制了等离子清洗技术的应用,近期等离子领域的研究及实践表明通过控制等离子体的生成条件和工艺气体可以显著提高等离子清洗的去污速度,从而为扩展等离子技术在工业中的应用提供可能。介绍了等离子清洗的原理和方法,分析了影响等离子清洗效果的因素,并完成了射频等离子清洗系统的设计。     

荫罩双层清洗黑化技术的开发及应用

着重论述了彩色显像管荫罩清洗黑化工序,如何通过改进设备,优化生产工艺,达到产量翻番的目的。     

A comparison of local phosphorescence detection and fluid dynamic gauging methods for studying the removal of cohesive fouling layers: Effect of layer roughness

The performance of industrial cleaning in place (CIP) procedures is critically important for food manufacture. CIP has yet to be optimised for many processes, in part since the mechanisms involved in cleaning are not fully understood. Laboratory tests have an important role in guiding industrial trials, and this paper introduces and compares two experimental techniques developed for studying CIP mechanisms: local phosphorescence detection (LPD), and scanning fluid dynamic gauging (sFDG).To illustrate the comparison, each technique is used to investigate the influence of soil topology on the cleaning of pre-gelatinised starch-based layers from stainless steel (SS 316) substrates by aqueous NaOH solutions at ambient temperature. The roughness of the soil surface is varied by incorporating zinc sulphide particles with different particle size distributions (range 1–80 μm) into the starch suspensions. The soil roughness increased with the use of larger particles, increasing the 3D arithmetic mean roughness (S_a) of the dry layers (range 0.37–3.33 μm). Rough layers were cleaned more readily than those containing small inclusions, with a good correlation between the cleaning rates observed during LPD and FDG measurements. The LPD technique, which is an instrumented CIP test, gives a better indication of the cleaning time, while sFDG measurements provide further insight into the removal mechanisms.     

硅研磨片超声波清洗技术的研究

介绍了硅研磨片清洗的重要性,分析了影响硅研磨片质量的主要因素,即金属杂质和各种污染物.重点分析了硅研磨片表面沾污的原因,并且通过大量的实验分析得到了活性剂和碱性清洗液、去离子水的最佳体积比是0.20:1.00:10.0,清洗的最佳时间为3 min～5 min和最佳温度范围为40℃～50℃.