Templated Pt-Sn electrocatalysts for ethanol, methanol and CO oxidation in alkaline media

In this work, we have investigated an aerosol-derived templated electrocatalyst for electro-oxidation of small organic molecules in alkaline media. Templated Pt-Sn electrocatalysts are compared to templated Pt catalysts both synthesized in an aerosol synthesis technique. In this synthesis approach, mono-disperse silica nanoparticles are used to template the metallic precursors. Structural and compositional analysis of the nanostructured materials are performed by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction (XRD) and BET surface area measurements. The aerosol-derived templated electrocatalysts are examined in conjunction with an anion exchange ionomer for ethanol, methanol and CO oxidation in alkaline media. The electrochemical studies include cyclic voltammetry, chronoamperometry and voltammetric adsorption of adsorbed CO.     

Tb~(3+)掺杂Gd_2Sn_2O_7纳米荧光材料的制备与光学性能

采用共沉淀-水热法合成Tb3+掺杂Gd2Sn2O7纳米荧光材料,并采用X射线衍射(XRD)、扫描电镜(SEM)、透射电镜(TEM)、傅里叶变换红外光谱(FT-IR)、拉曼光谱(Raman)和荧光光谱对合成产物的晶体结构、颗粒尺寸、形貌和光学性能进行研究。研究结果表明水热合成产物为单一相立方烧绿石结构Gd2Sn2O7:Tb3+晶体,产物由尺寸约为50~70 nm的一次纳米颗粒团聚而成的不规则球。激发光谱和发射光谱测试结果表明,Gd2Sn2O7:Tb3+样品可以被379 nm的紫外光有效地激发而发射出纯度高的Tb3+离子特征的绿光,在高浓度Tb3+掺杂时可观察到Tb3+发光浓度猝灭现象。在样品的激发光谱中观察到不同激发带的猝灭浓度并不相同,并对其原因进行了分析。     

Sn/C复合材料的制备及其电化学性能

以煤焦油沥青为碳源、三丁基氯化锡(TBTC)为锡源,采用压力下聚合手段原位合成出Sn/C复合材料,并对它的电化学性能进行了研究。通过SEM、XRD、恒电流充放电测试等手段研究了不同Sn含量的Sn/C复合材料的形态、结构及其电化学行为,结果表明TBTC对沥青的热缩聚反应有显著的催化作用,热聚产物中吡啶不溶物(PI)组分的含量由未添加时的35.5%逐渐提高至添加量为25%时的60.3%;进一步热处理后,Sn/C复合材料中的锡由原来的SnS转化为金属锡的形式存在;其首次循环效率随着热处理温度的提高而增加,而首次充放电容量随着TBTC添加量的增加先增加后减少,在10%时达到最大的比容量值,首次充放电容量分别为674mAh/g和465mAh/g,第二次循环后,循环效率达到95%以上,是一种性能较佳的锂离子蓄电池负极材料。     

Sn和Zn对重芳烃轻质化NiMo/β催化剂性能的影响

以β分子筛为载体,采用等体积浸渍法制备了三种催化剂NiMo/β、SnNiMo/β和ZnNiMo/β,采用XRD、NH₃-TPD、H₂-TPR、H₂-TPD和TG-DTG对催化剂进行表征。结果表明,第三金属Sn和Zn的加入减弱了催化剂的酸性质,促进了Mo与载体之间的相互作用,提高了催化剂吸附H₂的能力,降低了反应过程的积炭量。采用某炼厂重整C₁₀₊重芳烃对三种催化剂进行评价,结果表明第三金属Sn和Zn的加入均显著提高了催化剂的稳定性和液收,且含Zn的催化剂具有最优的轻质化性能。     

Phase Equilibria of the Sn-Sb Binary System

Sn-Sb alloys are important high-temperature solders. However, inconsistencies are found in the available phase diagrams, and some phase boundaries in the Sn-Sb system have not been determined. Sn-Sb alloys were prepared, equilibrated at 160°C to 300°C, and the equilibrium phases and their compositions were determined. The β-SnSb phase has a very wide compositional homogeneity range, and its composition varies from Sn-47.0at.%Sb to Sn-62.8at.%Sb. There is no order–disorder transformation of the β-SnSb phase. There are three peritectic reactions in the Sn-Sb system, L + Sb = β-SnSb, L + β-SnSb = Sn₃Sb₂, and L + Sn₃Sb₂ = Sn, and their temperatures are 424°C, 323°C, and 243°C, respectively. Thermodynamic models of the Sn-Sb binary system were developed using the CALPHAD approach based on the experimental results of this study and the data in the literature. The calculated phase diagram and thermodynamic properties are in good agreement with the experimental determinations.     

Effect of Pulse-Plated Nickel Barriers on Tin Whisker Growth for Pure Tin Solder Joints

We investigate the influence of pulse-plated Ni barriers, compared to direct current (DC)-plated Ni barriers, on the growth of Sn whiskers in laminated Cu/Ni/Sn samples. The results indicate that the pulse-plated Ni barriers exhibit much better resistance to Sn whisker growth than the DC-plated Ni barriers, i.e., when exposed to ambient of 60°C and 93% relative humidity (RH) for 40 days only a few small hillocks were observed as opposed to the long whiskers and large nodules of Sn for the DC-plated Ni barriers. The underlying mechanisms are addressed based on the texture characteristics of the plated Ni and Sn layers and the formation of intermetallic compounds.     

Effects of Ga and Sn on the electrochemical behavior of Mg–6Al–1Zn as anode materials

The microstructure and electrochemical behavior of Mg–6Al–1Zn, Mg–6Al–1Zn–1Ga, Mg–6Al–1Zn–1Sn, and Mg–6Al–1Zn–0.5Sn–0.5Ga as anode materials in a 3.5 wt% NaCl solution are compared systematically. The results show that Sn alloying refines the second-phases of Mg–6Zn–1Al by promoting tiny granular Mg₁₇Al₁₂ phases containing Sn, and inspires their disperse distribution. However, the Ga results in the formation of semicontinuous reticular Ga containing Mg₁₇Al₁₂ phases. The comparison of discharge tests indicates that Mg–6Al–1Zn–1Sn has the highest discharge activity, and Mg–6Al–1Zn–1Ga displays the largest hydrogen evolution corrosion resistance in 3.5 wt% NaCl solution at 298 K. The synergy of Ga and Sn can shorten discharge activation time and promote low discharge potential. In addition, the utilization efficiencies of the alloys decrease as follows: Mg–6Al–1Zn–1Ga > Mg–6Al–1Zn–0.5Sn–0.5Ga > Mg–6Al–1Zn–1Sn > Mg–6Zn–1Al. This study illustrates that the Mg–6Al–1Zn–0.5Sn–0.5Ga alloy has acceptable utilization efficiency and desirable electrochemical activity, which implies that doping Ga and Sn obtains a balance between discharge activity and utilization efficiencies.     

Electrodeposited and characterization of Ag–Sn–S semiconductor thin films

Thin film of silver tin sulfides (Ag–Sn–S) has been deposited on indium tin oxide coated glass (ITO) substrates using potentiostatic cathodic electrodeposition technique. New procedure for the growth of Ag–Sn–S film is presented. An electrolyte solution containing Silver Nitrate (AgNO₃), Tin(II) Chloride (SnCl₂) and Sodium Thiosulfate (Na₂S₂O₃)in acidic solution (pH ~2) and at temperature of the bath 55 °C were used for the growth of Ag–Sn–S thin film. Prior to the deposition, a cyclic voltammetry technique was performed in binary (Ag–S, Sn–S) and ternary (Ag–Sn–S) systems. This study was carried out to examine the behavior of electroactive species at the electrode surface. Based on these results, the cathodic applied potential was fixed at −1000 mV versus Ag/AgCl to obtain a uniform and good adhesion of ternary thin film. After that, structural, morphological and optical performances of films have been investigated. The X-ray diffraction patterns of the samples demonstrate the presence of the orthorhombic phase of Ag₈SnS₆ at applied potential of −1000 mV versus Ag/AgCl. Based on the scanning electron microscopy (SEM), it was found that the surface morphology and grain size were strongly influenced by the presence of Sn and/or Ag in the electrolyte bath. The band gaps of binaries and ternary compound are evaluated from optical absorption measurements. Band gap of Ag₈SnS₆ determined from transmittance spectra is in the range 1.56 eV. Flat-band potential and free carrier concentration have been determined from Mott–Schottky plot and are estimated to be around 0.18 V and 2.21×10¹⁴ cm⁻³ respectively. The photoelectrochemical test of Ag₈SnS₆ was studied and the experimental observations are discussed in detail.     

Microstructure and properties of open-cell Ni–Sn–P alloy foams prepared by electroless plating

In this study, open-cell Ni–Sn–P alloy foams were prepared by electroless plating. The influence of tin content on the surface morphology and properties of Ni–Sn–P alloy foams were investigated. The surface structure of Ni–Sn–P alloy foams became more uniform and compact with the increase of Sn content. The X-ray diffraction result showed that Ni–Sn–P alloy foams gradually transformed from an amorphous structure into crystallization with the increase of heat-treatment temperature. The introduction of Sn significantly enhanced the corrosion resistance of Ni–P coatings in 3.5 wt% NaCl solution, the corrosion current density decreased from 5.022 to 0.805 μA/cm² and the corrosion potential shifted positively from −0.423 to −0.294 V after adding 5.96 wt% Sn to Ni–P coatings. However, the corrosion resistance of Ni–Sn–P foams was deteriorated after heat treatment. Adding Sn to the Ni–P system slightly weakened the compressive strength of Ni–P binary foams. Nevertheless, significant improvement in the antioxidant performance of Ni–Sn–P alloy foams was indicated by the reduction of the mass change rate in that the mass change rate of Ni–P foams obviously reduced from 5.15% to 0.25% after adding 5.96 wt% Sn.     

Effects of alternative electromagnetic field on surface tension and filling ability of molten metal

Surface tension and filling ability of molten metal play an important role on the shaping of the molten metal. The surface tension was calculated from wetting angles of the molten metal by the sessile drop method. The specimen for filling ability was designed and the filling ability experiments under the alternative electromagnetic field were performed. The results show that the intensity and frequency of the alternative electromagnetic field have significant effects on the surface tension of the molten metal. The surface tension of Al-6% Si alloy decreases with increasing the intensity of the electromagnetic field. For pure Sn, the surface tension decreases gradually when the frequency of electromagnetic field is reduced. The filling ability is improved by applying the alternative electromagnetic field.