Effects of Sn doping on the manufacturing,performance and carbon deposition of Ni/ScSZ cells in solid oxide fuel cells

This work demonstrates the effect of tin (Sn) doping on the manufacturing, electrochemical performance, and carbon deposition in dry biogas-fuelled solid oxide fuel cells (SOFCs). Sn doping via blending in technique alters the rheology of tape casting slurry and increases the Ni/ScSZ anode porosity. In contrast to the undoped Ni/ScSZ cells, where open-circuit voltage (OCV) drops in biogas, Sn–Ni/ScSZ SOFC OCV increases by 3%. The maximum power densities in biogas are 0.116, 0.211, 0.263, and 0.314 W/cm² for undoped Ni/ScSZ, undoped Ni/ScSZ with 3 wt% pore former, Sn–Ni/ScSZ and Sn–NiScSZ with 1 wt% pore former, respectively. Sn–Ni/ScSZ reduces the effect of the drop in the maximum power densities by 26%–36% with the fuel switch. A 1.28–2.24-fold higher amount of carbon is detected on the Sn–Ni/ScSZ samples despite the better electrochemical performance, which may reflect an enhanced methane decomposition reaction.     

Organic Cation‐Dependent Degradation Mechanism of Organotin Halide Perovskites

The applications of organotin halide perovskites are limited because of their chemical instability under ambient conditions. Upon air exposure, Sn²⁺ can be rapidly oxidized to Sn⁴⁺, causing a large variation in the electronic properties. Here, the role of organic cations in degradation is investigated by comparing methylammonium tin iodide (MASnI₃) and formamidinium tin iodide (FASnI₃). Through chemical analyses and theoretical calculations, it is found that the organic cation strongly influences the oxidation of Sn²⁺ and the binding of H₂O molecules to the perovskite lattice. On the one hand, Sn²⁺ can be easily oxidized to Sn⁴⁺ in MASnI₃, and replacing MA with FA reduces the extent of Sn oxidation; on the other hand, FA forms a stronger hydrogen bond with H₂O than does MA, leading to partial expansion of the perovskite network. The two processes compete in determining the material's conductivity. It is noted that the oxidation is a difficult process to prevent, while the water effect can be largely suppressed by reducing the moisture level. As a result, FASnI₃‐based conductors and photovoltaic cells exhibit much better reproducibility as compared to MASnI₃‐based devices. This study sheds light on the development of stable Pb‐free perovskite optoelectronic devices through new material design.     

In对Sn9Zn钎料润湿性能的影响

为了提高Sn9Zn共晶钎料的钎焊性能,通过合金化的方法添加了少量元素In,制备了Sn9Zn-xIn钎料。从钎料合金的熔化特性、润湿特性、界面显微结构和母材粗糙度这四个方面评价了不同In含量对Sn9Zn钎料润湿性能的影响。试验结果表明:少量元素In的添加可以降低钎料的熔点;随着In含量的增加,钎料的润湿力增大,润湿时间缩短,润湿性有明显提高;In含量增加,润湿界面层中Cu5Zn8化合物层厚度增加;对母材表面进行毛化处理,通过改变母材表面的微观几何结构,增大钎料与母材的相对接触面积,从而改善钎料的润湿性能。     

Mechanical stability for nanostructured Sn- and Si-based anodes

The most promising materials that can be used as anodes in next generation rechargeable Li batteries are Sn and Si. Upon lithiation, however, both Sn and Si experience a 300% volume expansion, which results in significant fracture, and therefore their commercial use is inhibited. Extensive experimental research has yielded that embedding or attaching Si or Sn nanoparticles in a carbon/graphite matrix diminishes their mechanical damage and allows for electrochemical stability. The present study will show that linear elasticity can predict the capacity retention of such nanocomposites by predicting their mechanical stability upon Li-insertion. In particular (i) a previously developed theoretical model will be related to experimental observations on Si/sol-gel-graphite nanocomposite anodes, (ii) electron microscopy images will be presented on the fracture of cycled SnO₂/C nanopowders, and a theoretical model will be applied to predict the SnO₂ particle dimensions that will limit such fracture.     

Numerical simulation of critical current performance in Nb3Sn strand subjected to periodic bending deformation

In the ITER Engineering Design Activity (EDA), four NB₃Sn model coils were developed and successfully tested. However, it was revealed that the critical current of the conductor degraded with the increase of electromagnetic force. One of the explanations of this phenomenon is a strand bending caused by enormous electromagnetic force. The authors therefore developed a simulation code using the distributed circuit model to investigate dependency of the critical current performance on the periodic bending deformation. The simulation results were in good agreement with the experiments. The dependence of the critical current on the periodic transverse load, temperature, periodic load pitch, thickness of Ta barrier which prevents Cu stabilizer from being contaminated by Sn, twist pitch of the strand, and RRR of the bronze matrix was investigated using the developed code. The results showed that the critical current degraded less with decreasing the pitch of the transverse load and increasing the Ta barrier thickness. It suggests that the shorter cabling pitch and the larger bending stiffness prevent the critical current degradation. © 2010 Wiley Periodicals, Inc. Electr Eng Jpn, 171(3): 7–15, 2010; Published online in Wiley InterScience ( www.interscience.wiley.com ). DOI 10.1002/eej.20923     

Whisker formation on a thin film tin lithium-ion battery anode

Tin (Sn) is a candidate material for anodes (negative electrodes) of lithium-ion batteries because of its high theoretical energy capacity. In this paper, we report an observation of Sn-whisker growth on Sn-thin films after lithiation and delithiation. The compressive stress generated by electrochemical lithiation of the Sn-thin films is likely the driving force for the growth of the Sn whiskers. Attention should therefore be paid to the issue of Sn-whisker growth for Sn-based electrodes since Sn whiskers may penetrate through the separator, and short-circuit the electrochemical cell.     

Interpolymer radical coupling: A toolbox complementary to controlled radical polymerization

The current review focuses on the relevance and practical benefit of interpolymer radical coupling methods. The latter are developing rapidly and constitute a perfectly complementary macromolecular engineering toolbox to the controlled radical polymerization techniques (CRP). Indeed, all structures formed by CRP are likely to be prone to radical coupling reactions, which multiply the available synthetic possibilities. Basically, the coupling systems can be divided in two main categories. The first one, including the atom transfer radical coupling (ATRC), silane radical atom abstraction (SRAA) and cobalt-mediated radical coupling (CMRC), relies on the recombination of macroradicals produced from a dormant species. The second one, including atom transfer nitroxide radical coupling (ATNRC), single electron transfer nitroxide radical coupling (SETNRC), enhanced spin capturing polymerization (ESCP) and nitrone/nitroso mediated radical coupling (NMRC), makes use of a radical scavenger in order to promote the conjugation of the polymer chains. More than a compilation of macromolecular engineering achievements, the present review additionally aims to emphasize the particularities, synthetic potential and present limitations of each system.     

The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

The formation of Ag₃Sn plates in the Sn-Ag-Cu lead-free solder joints for two different Ag content solder balls was investigated in wafer level chip scale packages (WLCSPs). After an appropriate surface mount technology reflow process on a printed circuit board, samples were subjected to 150°C high-temperature storage (HTS), 1,000 h aging, or 1,000 cycles thermal cycling test (TCT). Sequentially, the cross-sectional analysis was scrutinized using a scanning electron microscope/energy dispersive spectrometer (SEM/EDX) to observe the metallurgical evolution of the amount of the Ag₃Sn plates at the interface and the solder bulk itself. Pull and shear tests were also performed on samples. It was found that the interfacial intermetallic compound (IMC) thickness, the overall IMC area, and the numbers of Ag₃Sn plates increase with increasing HTS and TCT cycles. The amount of large Ag₃Sn plates found in the Sn-4.0Ag-0.5 Cu solder balls is much greater than that found in the Sn-2.6Ag-0.5Cu solder balls; however, no significant difference was found in the joint strength between two different Ag content solder joints.     

Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

The intermetallic compounds formed in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped η-Cu₆Sn₅ and continuous planar η-(cu_0.9Ni_0.1)₆Sn₅ intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional ε-Cu₃Sn intermetallic layer is formed at the interface between the η-Cu₆Sn₅ and Cu pads after aging at 150°C, while the same type of intermetallic formation is inhibited in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. In addition, the coarsening of Ag₃Sn precipitates also abates in the solder matrix of the Sn3Ag0.5Cu0.06Ni0.01Ge packages, which results in a slightly higher ball shear strength for the specimens.