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11.
12.
目的探讨水﹑气﹑土壤中多环芳烃检测标准(HJ 478-2009﹑HJ 647-2013、HJ 784-2016)的正确出峰时间和顺序。方法用高效液相色谱来对苊烯、芴、苊、?、苯并(a)蒽进行定性分析,并与3个标准中的出峰顺序进行比较。结果苊烯、苊、芴、苯并(a)蒽、?的出峰时间分别为6.450、7.923、8.233、17.760、18.740min,与标准HJ478-2009﹑HJ647-2013的出峰顺序存在差异。结论在使用标准HJ478-2009﹑HJ647-2013、HJ 784-2016同时测定16种多环芳烃时,多环芳烃的出峰顺序及时间应以HJ 784-2016为准。  相似文献   
13.
Anup Bhat B  Harish SV  Geetha M 《ETRI Journal》2021,43(6):1024-1037
Mining high utility itemsets (HUIs) from transaction databases considers such factors as the unit profit and quantity of purchased items. Two-phase tree-based algorithms transform a database into compressed tree structures and generate candidate patterns through a recursive pattern-growth procedure. This procedure requires a lot of memory and time to construct conditional pattern trees. To address this issue, this study employs two compressed tree structures, namely, Utility Count Tree and String Utility Tree, to enumerate valid patterns and thus promote fast utility computation. Furthermore, the study presents an algorithm called single-phase utility computation (SPUC) that leverages these two tree structures to mine HUIs in a single phase by incorporating novel pruning strategies. Experiments conducted on both real and synthetic datasets demonstrate the superior performance of SPUC compared with IHUP, UP-Growth, and UP-Growth+ algorithms.  相似文献   
14.
This paper reviews recent studies, that not only includes both experiments and modeling components, but celebrates a close coupling between these techniques, in order to provide insights into the plasticity and failure of polycrystalline metals. Examples are provided of studies across multiple-scales, including, but not limited to, density functional theory combined with atom probe tomography, molecular dynamics combined with in situ transmission electron miscopy, discrete dislocation dynamics combined with nanopillars experiments, crystal plasticity combined with digital image correlation, and crystal plasticity combined with in situ high energy X-ray diffraction. The close synergy between in situ experiments and modeling provides new opportunities for model calibration, verification, and validation, by providing direct means of comparison, thus removing aspects of epistemic uncertainty in the approach. Further, data fusion between in situ experimental and model-based data, along with data driven approaches, provides a paradigm shift for determining the emergent behavior of deformation and failure, which is the foundation that underpins the mechanical behavior of polycrystalline materials.  相似文献   
15.
This paper discusses the compressive performance of perforated brick masonry after fire exposure. Compressive strength tests of the mortar, clay perforated brick, and perforated brick masonry specimens were performed in accordance with ISO834 fire tests of different durations. The temperature distribution of the masonry materials and specimens was simulated using the finite element software ABAQUS, with the thermal parameters of masonry materials recommended by European standard Eurocode 6 and related literature. The compressive strength reduction factors of mortar and clay perforated brick exposed to different fire durations were calculated via the layered method suggested by European standard Eurocode 1. In addition, the compressive strength reduction factors after cooldown were obtained from the experimental data of the masonry materials, and by considering further reductions in the compressive strength after cooling from high temperatures. Experimental data of the masonry specimens were compared with the numerical results obtained using the reduction factors proposed in this work. The comparison revealed an overall acceptable approximation. Thus, the method presented in this paper can be used to evaluate the residual capacity of masonry structures after fire.  相似文献   
16.
Reactive hot pressing was utilized to synthesize and densify four ZrB2 ceramics with impurity contents low enough to avoid obscuring the effects of dopants on thermal properties. Nominally pure ZrB2 had a thermal conductivity of 141 ± 3 W/m K at 25 °C. Additions of 3 at% of Ti, Y, or Hf decreased the thermal conductivity by 20 %, 30 %, and 40 %, respectively. The thermal conductivity of (Zr,Hf)B2 was similar to ZrB2 synthesized from commercial powders containing the natural abundance of Hf as an impurity. This is the first study to demonstrate that Ti and Y additions decrease the thermal conductivity of ZrB2 ceramics and report intrinsic values for thermal conductivity and electrical resistivity of ZrB2 containing transition metal additions. Previous studies were unable to detect these effects because the natural abundance of Hf present masked the effects of these additions.  相似文献   
17.
Polyvinyl chloride (PVC) is the most popular insulating material for electric wiring instruments. However, an exothermic reaction above 150 °C may cause deterioration of the insulating properties of PVC. Therefore, it is important to clarify the heat degradation in PVC, not only to investigate the ignition of electrical wiring products but also to use electrical products safely. It is known that ultraviolet (UV) irradiation causes chemical deterioration of PVC and an increase in its conductivity. Generally, it has been thought that the electrical breakdown properties, electrical conduction, and insulating performance are affected by space charge accumulation in an insulating material. A high temperature pulsed electroacoustic (PEA) system usable up to 250 °C has been developed, and the PEA system can measure the space charge distribution and conduction current in the high temperature range simultaneously. In this investigation, the space charge distribution and conduction current were measured up to electrical breakdown in a non‐UV irradiated sample (normal PVC) and in 353 nm and 253 nm UV‐irradiated PVC samples in the range from room temperature to 200 °C in a DC electric field. In the short wavelength UV irradiated PVC sample (253 nm, 300 h), a deterioration of breakdown strength at 90 °C to 150 °C and negative packet‐like charges were observed at 60 °C and 100 °C, a positive charge accumulated in front of both the anode and cathode above 90 °C, and a higher electric field near the cathode side because the positive charge of the cathode side was greater.  相似文献   
18.
为了实现对微小环片零件的自动化装配,搭建了自动装配系统.通过4根直线导向轴与4个直线轴承来提高系统的导向精度和刚度.采用直线导轨进行各装配作业模块之间的切换,保证了微小环片零件的自动装配与取出.在环片的装配方向上,螺旋升降机和光栅尺实现环片的位置精度控制.在Lab VIEW编程环境中,采用分层软件架构和模块化控制思想,避免了不必要的数据循环检测与丢失,能够达到环片组件的装配精度要求.控制系统分为系统初始化模块、参数设置模块、装配模块和取出模块,自动装配系统通过各个模块间的相互交流配合完成装配任务.采用本文中自动装配系统装配环片的实验结果表明,环片零件装配的最大位置误差为26μm,垂直度误差为17μm,平均装配时间为75 s/片,可满足环片组件所需的精度要求.  相似文献   
19.
针对在军棋博弈不完全信息对弈中,面对棋子不同价值、不同位置、不同搭配所产生的不同棋力,传统的单子意图搜索算法,不能满足棋子之间的协同性与沟通性,同时也缺乏对敌方的引诱与欺骗等高级对抗能力。本文提出一种结合UCT搜索策略的高价值棋子博弈方法,实现高价值棋子协同博弈的策略。实战经验表明:高价值多棋子军棋协同博弈策略优于单棋子军棋博弈策略。  相似文献   
20.
Porous polyimide (PI) films with low dielectric constants and excellent thermal properties have been a pressing demand for the next generation of high-performance, miniature, and ultrathin microelectronic devices. A series of novel porous PI films containing fluorenyl-adamantane groups were prepared successfully via thermolysis of poly(ethylene glycol) (PEG) added in the PI matrix. The cross-sectional morphologies of porous PI films showed closed pores with diameters ranging from 135 to 158 nm, which were uniform and regular in shape without interconnectivity. These porous PI films exhibited excellent thermal properties with a glass-transition temperature at 376 °C whereas the 5% weight loss temperature in air excess of 405 °C due to enhanced rigidity afforded by fluorenyl-adamantane groups. Accompanied by thermolysis content of PEG increasing from 0 to 20 wt %, the density of porous PI films decreased, and the corresponding porosity grew significantly from 0 to 11.48%. Depending on porosity, the dielectric constant and dielectric loss of porous PI films significantly declined from 2.89 to 2.37 and from 0.050 to 0.021, respectively. These excellent properties benefit the as-prepared porous PI films for application as interlayer dielectrics, integrated circuit chips, or multichip modules in microelectronic fields. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47313.  相似文献   
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