铸造镍基K3合金的激光熔覆开裂及工艺研究

研究了铸造镍基Ｋ３合金的激光熔覆过程，分析了原始组织及激光熔覆工艺参数对熔覆裂纹形成的及作用；探讨了使用激光熔覆技术对损伤的Ｋ３合金叶片进行修复的可能性。研究结果表明，Ｋ３合金中沿界分布的低熔点共晶及碳化物是引起激光熔覆开裂的主要因素，采用较高的功率密度和较快的扫描速度进行激光熔覆，可减少热影响区范围，明显地抑制熔覆裂纹的产生。     

以应力分析为基础的汽包封头强度计算

本文介绍应力分析设计法的原理，通过有限元计算得到汽包封头的温度场、应力场，并以应力分析为基础对汽包封头强度作了校核。     

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.     

Mortar finite element discretization for the flow in a nonhomogeneous porous medium

Darcy’s equations model the flow of a viscous incompressible fluid in a rigid porous medium. One of the parameters of the system depends on the permeability of the medium and, when this medium is not homogeneous, the variations of the parameter could be very high. To handle this phenomenon, we propose a discretization of the model that relies on the mortar finite element method. Indeed, the idea is to construct a decomposition of the domain such that the permeability is constant on each element of the partition and to use independent meshes on the different subdomains. We perform the a priori and a posteriori analysis of this discretization and present some numerical experiments which are in good coherency with the results of the analysis.     

天然高分子吸附剂研究Ⅱ．镍离子模板壳聚糖树脂的合成及特性

以镍离子为模板剂，合成了乙醇双环氧丙基醚交联的壳聚糖树脂，研究了其对Ｃｕ（Ⅱ）、Ｎｉ（Ⅱ）、Ｃｏ（Ⅱ）离子的吸附性能。结果表明，该法合成的树脂对Ｎｉ（Ⅱ）离子具有较强的“记忆”和“识别”能力，其对Ｃｕ（Ⅱ）、Ｎｉ（Ⅱ）、Ｃｏ（Ⅱ）的吸附量分别达２．２１、２．１３、１．４０ｍｍｏｌ／ｇ树脂。     

光纤智能复合材料

对光纤型智能复合材料的工作原理，性能特点和应用前景作了介绍，并讨论了制造成型的技术问题。     

颗粒增强TiAl基复合材料及其Si的韧化作用研究EI

运用ＸＤ工艺制备了颗粒增强ＴｉＡｌ基复合材料。增强颗粒均匀分布于ＴｉＡｌ基体中并细化ＴｉＡｌ合金。通过在ＴｉＢ_２／ＴｉＡｌ、ＴｉＣ／ＴｉＡｌ复合材料中加入适量的Ｓｉ，颗粒增强ＴｉＡｌ基复合材料的室温延性得到了改善。     

双噁唑啉化合物对PBT的增粘作用

以２．２＇－双（２－唑啉）和双（２－唑啉基）苯作扩链剂，用焙融挤出的方法，对聚对苯二甲酸丁二酯（ＰＢＴ）进行扩链，考察扩链剂的用量、反应时间和反应温度对ＰＢＴ的特性粘度及端羧基含量（ＣＶ）的影响。结果表明，当用２，２＇－双（２－唑啉）作扩链剂时，ＰＢＴ的特性粘度［η］从０．７９９提高到０．９２６ｄＬ／ｇ，ＣＶ降至５ｅｑ／１０￣６ｇ以下；当用双（２－　唑啉基）苯作扩链剂，［η］从０．７６３增至０．９２５ｄＬ／ｇ，ＣＶ降至１０ｅｑ／１０￣６ｇ以下，达到了较满意的扩链效果。     

PVC／NBR／HDPE共混体系相容性研究（Ⅰ）增容剂对力学性能的影响

采用丁腈橡胶（ＮＢＲ）及其氢化还原后产物（ＨＮＢＲ）为ＰＶＣ／ＨＤＰＥ共混体系的增容剂，研究了增容剂结构、用量及丙烯腈含量对共混体系相容性的影响。发现丁腈橡胶（ＮＢＲ２９及ＨＮＢＲ２９）对ＰＶＣ／ＨＤＰＥ体系有较好的增容作用，而ＮＢＲ４０及ＨＮＢＲ４０较差。当增容剂用量为２％，ＰＥ含量为８％～１２％时，共混物具有较好的相容性，力学性能得到改善。