Fatigue crack growth analysis of welded aluminium RHS T-joints with manipulated residual stress level

The fatigue life of a welded aluminium T‐joint made from beams with rectangular hollow section (RHS) has been predicted using a crack propagation analysis and compared with experimental results from joints with different residual stress levels. To include the effect of the residual stresses, the stress ratio was calculated at the weld toe and, via Walker's equation, introduced into the analysis. How to obtain the Walker exponent has been discussed in detail. The introduction of a stress ratio at the weld toe provides good agreement between the experimentally and analytically found S–N curves. The effect of the residual stress was successfully included in the analysis.     

Control of Titanium Alloy Thin Plate Welding Distortion by Trailing Peening

The technology of trailing peening is a kind of promisingly bran-new technology which can be used to control weldingstress and distortion of Ti alloy thin plate. Control of TC4 Ti alloy thn plate welding stress and distortion underthe condition of convent     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

An efficient return algorithm for non-associated plasticity with linear yield criteria in principal stress space

An efficient return algorithm for stress update in numerical plasticity computations is presented. The yield criterion must be linear in principal stress space and can be composed of any number of yield planes. Each of these yield planes may have an associated or non-associated flow rule. The stress return and the formation of the constitutive matrix is carried out in principal stress space. Here the manipulations simplify and rely on geometrical arguments. The singularities arising at the intersection of yield planes are dealt with in a straightforward way also based on geometrical considerations. The method is exemplified on non-associated Mohr–Coulomb plasticity throughout the paper.     

Local dynamics in epoxy coatings containing iron oxide nanoparticles by dielectric relaxation spectroscopy

Nanocomposites of photocurable epoxy resin and epoxy‐modified iron oxide magnetic nanoparticles were analyzed by dielectric relaxation spectroscopy to study the local dynamics at temperatures well below the glass‐transition temperature. Two secondary processes were detected, β and γ processes, but the second one was just detected at lower temperatures in the high‐frequency part of the spectra and moved out of the frequency range at higher temperatures. Data were fitted to the Havriliak–Negami and Arrhenius models, and the obtained parameters were analyzed. Relaxation times of the β secondary relaxation did not change with the nanoparticle content, but the relaxation strength increased. The increase could not be explained when we took into account the molecular origin of the relaxation. The presence of ferromagnetic nanoparticles enhanced the internal field and increased the relaxation strengths. Transmission electron microscopy images showed that the nanoparticles were well dispersed in the matrix, without magnetic agglomerates. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

On the microhardness testing of electrically stressed poly(phenylene oxide): Polystyrene blends

Microhardness measurements have been performed on untreated (virgin) and electrically stressed, solvent‐cast laboratory‐prepared samples of pure poly(phenylene oxide) (PPO), pure polystyrene (PS), and PPO : PS polyblends with different weight proportions. Results of such measurement on untreated polyblend sample show that microhardness (H_v) increases with increase in the content of PS up to 10 wt %, which attributed to the existence of homogeneous phase morphology. However, this feature is not observable in samples containing higher content of PS. Electrical stress is found to modify considerably the mechanical property of polymer. The effect of electric field on the microhardness of such samples (PPO : PS :: 90 : 10) has been characterized by the existence of a peak. Trapping of charge carriers in electrically stressed samples imparts hardening to the polyblend up to an applied step field of 190 kV/cm. However, the excessive charging beyond this step field value destroys this characteristic. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Changes in the thermomechanical behavior of epoxy glasses under the state of strain aging

Changes in thermomechanical behavior with structural relaxation taking place in epoxy glasses were studied. Differential scanning calorimetry measurements and thermostimulated strain recovery tests were performed for specimens deformed and then aged under fixed strain. In the course of heating, the specimens started to absorb thermal energy, whereas plastic strain was still stable. At higher temperatures, plastic strain started recovery, which was accompanied by exothermic behavior of the specimen. With an increase in the aging duration, the endothermic peak signified and moved to a higher temperature. These results indicated that the longer the aging duration was, the harder the plastic strain and strain energy were frozen in the glassy structure. This freeze‐strain phenomenon was observed for crosslinked epoxy glass, as well as polymeric glasses with linear molecular structures, aged under strain. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Numerical Study of Scale Effects of Ultra-Thin Nickel Beams

Recent experiments have shown that metallic materials display significant size effects when the characteristic length scale of non-uniform plastic deformation is close to a micron. Couple stress plasticity has been developed to explain such phenomena by Fleck and Hutchinson. The mechanical behaviors of ultra-thin nickel beams in different boundary conditions were studied with the hybrid element developed for couple stress plasticity before. Strong scale effects are found when the beam's thickness is close to the material characteristic length scale. Such phenomena will disappear if the beam' s thickness is greatly larger than the material characteristic length scale. The scale effect is the beams inherent property and it does not change with the change of support conditions.     

Stress in Dairy Farming and the Adoption of New Technology.

Previous studies have identified a number of different farm stressors and have reported gender and age differences in levels of stress. This study aimed to determine stress experienced by New Zealand dairy farmers, particularly in relation to adoption of new technology and its relationship to age and gender. Measures of farm stress and adoption of technology were completed by 985 dairy farmers. The highest levels of stress were reported for time pressures, machinery breakdown, weather, and government policies. Stress related to new technologies occurred rarely. Women reported more stress and higher levels of stress for understanding new technologies. There was also an increase in severity of stress with age related to new technologies. Overall, stress levels were moderate and may reflect favorable economic conditions. The findings suggest a need to tailor stress interventions to meet specific needs. (PsycINFO Database Record (c) 2010 APA, all rights reserved)