采用自动双探边器降低芯片漏测率

半导体芯片的检测是芯片生产企业生产过程中的重要环节，芯片在检测过程中，由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。本文介绍了利用双探边器解决由于硅圆片结构所造成的漏测的有效办法及具体操作方法。     

水量还原方法及合理性检查

文中详细地阐述了取河水、井水、水库水、跨流城引(排)水等不同情况进行还原的具体方法步骤。并对水量还原成果提出合理性检查措施。     

一种基于混沌同步的噪音衰减算法

论文提出了一种混沌通信系统的噪音衰减算法,该算法利用混沌同步现象在接收端获得正确的噪音估计值,从而从接收信号中滤除噪音恢复出正确的信号。通过数值仿真试验表明该方法是可行的。     

井下乳化/水热催化裂解复合降黏开采稠油技术研究

实验考察了胜利孤东稠油井下催化水热裂解和乳化/催化水热裂解降黏效果。所用催化剂为水溶性铁镍钒体系,Fe3+∶Ni2+∶VO4+=5∶1∶1,100 g稠油与30 g 0.5%催化剂水溶液在240℃反应24小时。原始黏度(50℃)11.0和8.36 Pa.s的两种稠油裂解并静置除水后,黏度降低76.2%和75.6%,室温放置60天后降黏率下降小于3个百分点,气相色谱显示裂解后轻组分明显增加,红外光谱显示稠油组分发生脱羧反应且芳环数减少。讨论了稠油催化水热裂解反应机理。所用化学助剂JN-A在油水中均可溶,耐温达250℃,耐矿化度达50 g/L,其水溶液以30∶100的质量比与稠油混合时形成低黏度的O/W乳状液。当水相含1.0%JN-A和0.5%催化剂时,两种稠油水热裂解后的反应混合物为O/W乳状液,黏度仅为319和309 mPa.s,静置除水后的稠油降黏率增加到86.5%和87.3%,其中的轻组分含量进一步增加。该井下乳化/催化水热裂解复合降黏法成功地用于孤东两口蒸汽吞吐井,稠油井作业后初期采出的原油黏度由~9 Pa.s降低到1 Pa.s左右,随采油时间延长而逐渐升高,约50天后超过4Pa.s。图2表6参5。     

Use of X-ray computed microtomography to understand why gels reduce relative permeability to water more than that to oil

X-ray computed microtomography (XMT) was used to investigate why gels reduce relative permeability to water more than that to oil in strongly water-wet Berea sandstone. XMT allows saturation differences to be monitored for individual pores during various stages of oil, water, and gelant flooding. The method also characterizes distributions of pore size, aspect ratio, and coordination number for the porous media. We studied a Cr(III) acetate–HPAM gel that reduced permeability to water (at S_or) by a factor 80–90 times more than that to oil (at S_wr). In Berea, the gel caused disproportionate permeability reduction by trapping substantial volumes of oil that remained immobile during water flooding (i.e., 43.5% S_or before gel placement versus 78.7% S_or after gel placement). With this high trapped oil saturation, water was forced to flow through narrow films, through the smallest pores, and through the gel itself. In contrast, during oil flooding, oil pathways remained relatively free from constriction by the gel.     

基于系统矩阵有序实Schur分解的模型降阶

对复杂高阶系统进行模型简化，为研究与设计系统提供了方便的条件。对系统模型的降阶是控制系统设计与仿真工作者的一个重要研究课题，对高阶复杂系统的分析、设计、仿真等具有重要的理论意义和工程实用价值。针对目前比较成熟的基于系统矩阵的有序实Schur分解方法，提出了采用时矩输出拟合来改善降阶系统输出响应逼近程度的改进方法，从而使简化模型具有输出误差更小、计算简便等优点，通过给出的实例仿真证实了这一点。     

Role of Perceived Importance in Intergroup Contact.

Furthering G. W. Allport's (1954) contentions for optimal contact, the authors introduce a new construct: the perceived importance of contact. They propose that perceived importance is the best proximal predictor of contact's reduction of prejudice. If individuals have opportunities for contact at work or in the neighborhood, their chances to have intergroup acquaintances and friends increase. Intergroup contact among acquaintances and friends can be perceived as more or less important, which in turn determines intergroup evaluations. A 1st study shows that the new measure of perceived importance is indeed distinct from established quantity and quality indicators. The results are cross-validated in a 2nd study that also sheds light on the meaning of importance. In 3rd and 4th studies, structural equation analyses and a meta-analysis support the hypotheses. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

一种制氢预转化催化剂还原的新方法

对上海高桥分公司2×10~4m~3/h(标准状态)制氢装置原设计的预转化催化剂还原流程进行了改进。先跳开预转化反应器,利用转化炉制取氢气,再用自产的高纯氢气代替重整氢,对预转化催化剂进行单独升温还原,避免了催化剂在还原初期因发生甲烷化反应而超温失活的问题,使催化剂具有更好的活性和稳定性。     

Signal Integrity: Fault Modeling and Testing in High-Speed SoCs

As we approach 100 nm technology the interconnect issues are becoming one of the main concerns in the testing of gigahertz system-on-chips. Voltage distortion (noise) and delay violations (skew) contribute to the signal integrity loss and ultimately functional error, performance degradation and reliability problems. In this paper, we first define a model for integrity faults on the high-speed interconnects. Then, we present a BIST-based test methodology that includes two special cells to detect and measure noise and skew occurring on the interconnects of the gigahertz system-on-chips. Using an inexpensive test architecture the integrity information accumulated by these special cells can be scanned out for final test and reliability analysis.     

Fastmet工艺评述

介绍了Ｆａｓｔｍｅｔ工艺及发展状况，并对工艺特点和指标进行了分析。使用冷固结含碳球团和转底炉使该工艺可直接采用粉矿和提高生产效率，但因硫含量高、铁品位低而产品质量较差。不过投资和生产成本与传统工艺比较却占有较大优势。