Microstructure and thermal behavior of Sn-Zn-Ag solders

The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis results indicate that Ag₅Zn₈ and AgZn₃ become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%. Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0% to 3.0%     

Synthesis and characterization of novel diimide–dinaphthols and resulting poly(urethane–imide)s

Novel diols containing imide groups were prepared via condensation of aromatic dianhydrides with 5‐amino‐1‐naphthol. The diimide–dinaphthols prepared were characterized by conventional methods and used to synthesize new poly(urethane–imide)s (PUIs). All the polymers were characterized and their physical properties, such as solubility, solution viscosity, thermal stability, and thermal behaviour were studied. The polymers obtained showed more thermal stability than typical polyurethanes because of the presence of the imide groups. Copyright © 2003 Society of Chemical Industry     

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu (SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si, Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also suppress void formation and coalescence at the Cu (substrate)/Cu₃Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results.     

列车客车用低温发热电缆地面辐射供暖系统的实验研究

对不同地板结构和不同导线间距下发热电缆地面辐射供暖系统的热工性能进行了测试分析，考察了系统的稳定性和可靠性，给出了综合比较结果，分析了影响发热电缆地面辐射供暖系统热工性能的主要因素及其影响规律。     

基于概念网络的文本信息监控技术

由于网上信息的迅速增长,文本信息监控已经成为网上信息管理中的热点研究课题。本文在模糊集和语义网络的理论基础上,构建了模糊值动态约束性概念网络,介绍了该概念网络的基本构建方法,并提出了基于概念网络的文本分析算法。     

Characterization of resol resins modified by the addition of PVC plastisols

Plastisols, which are a blend of poly(vinyl chloride) resin and a plasticizer (DEHP), were used as a toughening agent of a resol resin in order to improve the mechanical properties. It was not possible to formulate resol blends by adding more than 10 % of plastisol owing to a lack of apparent homogeneity in the systems, which also showed many air bubbles. The relationship between dynamic mechanical, mechanical and thermal properties and the amount of plastisol added was studied. It was determined from the infrared spectroscopy and dynamic mechanical results that the resol–plastisol blends seem to be formed by a reaction between the phenol and PVC giving a higher crosslinked structure. An improvement in the thermal resistance of the blends at lower temperatures was observed with an increase in the percentage of plastisol. Flexural analysis showed the elastic behaviour of the systems. However, it was not possible to observe the effect of the plasticizer (DEHP) owing to the low quantity of plastisol that was added to the resol. Copyright © 2004 Society of Chemical Industry     

Conducting composites of polythiophene and polyfuran with acetylene black

Conducting composites of polythiophene (PTP) and polyfuran (PF) with acetylene black (AB) were prepared via chemical oxidative polymerization of thiophene and furan in a suspension of AB in CHCl₃ at room temperature using anhydrous FeCl₃ as the oxidant. Formation of PTP and PF and their subsequent incorporation in PTP–AB and PF–AB composite systems were confirmed by FTIR analysis. Scanning electron microscope analysis showed the presence of compact clusters of particles in both composites. Transmission electron micrographs of PTP–AB and PF–AB composites showed formation of globular polymer encapsulated AB particles with average diameters of the order of ～100 nm in both systems. Thermogravimetric analysis revealed that the overall thermal stability varied in the order: AB > PTP–AB > PTP and AB > PF–AB > PF. DC conductivity values for the PTP–AB and PF–AB composites were of the order of 10^?2 and 10^?3 S cm^?1, respectively. Copyright © 2004 Society of Chemical Industry     

取向PET薄膜和容器热收缩的热机械分析

用TMA方法研究了双向拉伸PET膜和容器的热收缩特性,讨论了热收缩和分子结构的关系和各种影响因素。实验结果表明,TMA是研究和测试取向聚合物材料热收缩的简便有效方法。     

Role of Specimen Geometry in the Effect of Fiber Orientation on the Thermal Conductivity of a Uniaxial Carbon-Fiber-Reinforced Aluminoborosilicate Glass-Matrix Composite

A study concerning the effect of fiber orientation on the thermal conductivity of a uniaxial carbon-fiber-reinforced borosilicate glass was conducted. For thin specimens, and thick specimens with specimen sides cut parallel to the fiber direction, the dependence of thermal conductivity on fiber orientation showed excellent agreement with theoretical behavior predicted for a composite infinite in extent. In contrast, the thermal conductivity data for rectangular thick specimens fell well below the data for the thin and angled specimens. For fiber orientation of 45° and higher, at which the heat was directed toward the side of the specimen rather than across, the thermal conductivity values showed excellent agreement with theoretical behavior predicted for a finite composite strip with insulated sides.