轮式工程机械的行驶平稳性

根据振动理论建立了振动力学模型,并用等效刚度方法分析研究了弹性悬挂轮式工程机械行驶平稳性和振动特性。     

基于支持向量机的岩爆识别模型

岩爆的发生受多种因素的影响,这些因素关系错综复杂,以不同的特征和组合对岩爆产生综合影响,为科学、充分地利用现有的有限工程资料,本文从地下洞室围岩最大切向应力、岩石的单轴抗压强度和抗拉强度以及岩石冲击倾向指数四个主要因素出发,提出了基于支持向量机的岩爆识别模型,较好地解决小样本、非线性、高维数、局部极小点等的实际问题。     

Automated fluorimetry in quality control of pasteurized and ultra-high temperature-treated starch soup

Automated monitoring of the microbiological quality of heat-processed foods by the resazurin reduction test was applied to microtitration plate incubator-fluorimeter technology. The appearance and disappearance of the fluorescing peak of resorufin was monitored on microtitration trays. Pasteurized or ultra-high temperature-treated starch-based soup was used as the model food system. Bacillus subtilis spores (ultra-high temperature treatment) and vegetative cells of Enterococcus faecalis (pasteurization) were inoculated into the soup before the heat treatment at levels which resulted in some survival. The timing of appearance of maximum fluorescence correlated with the number of bacteria in pre-incubated samples. Automated resazurin-reduction fluorimetry was compared with conventional plating, turbidometry and microcolony count by the direct epifluorescent filter technique. The results of the resazurin test correlated well with those of all the other methods tested. Fluorimetry had the advantage that the results could be read within 1–5h and the reproducibility was superior to the other methods.     

触摸输入技术探析

本文扼要概述触摸输入的４种技术，及其应用与性能比较。     

球铁管表面喷锌机的设计与研究

球铁管是我国“九五”和“十五”期间大力推广和发展的项目 ,在大量的设计和应用基础上 ,对球铁管生产使用的重要设备之一———表面喷锌机进行了系统的研究与分析 ,提出了相关的设计思想和方法。对于提高表面喷锌机的使用性能和生产效率具有重要意义     

Rapid analysis of polymer homologues and additives with SFE/SFC-MS coupling

A rapid and easy analysis method for polymers is presented. The method involves sample preparation by SFE, separation of the extracted compounds by SFC and simultaneous quantitative detection by FID, as well as identification of unknowns by MS. The applications illustrate how structural research work and routine polymer analysis can be done with this time saving method.     

基于"替换法"的汉字加、解密实现技术

文章讨论的基于“替换法”的汉字信息加、解密实现技术,改变了传统的汉字加密结果,使加密后的密文仍是可以识别和再利用的汉字,发送者可以在任何可编辑汉字的通讯设备上发送和接收密文,确保中文信息传输过程中的安全性。加、解密算法实现的代码语言为VFP6.0。     

包装机中塑料薄膜常热式热封参数的实验研究

文中通过对包装机中常热式热封过程的分析及有效的实验，获得较为可靠的热封实验数据，并利用专业统计软件spss对实验数据进行处理，得到包装机中塑料薄膜的封口强度与操作参数之间的关系，为设计人员提供了一种获得最优操作参数的有效方法。     

High‐pressure processing effects on the mechanical,barrier and mass transfer properties of food packaging flexible structures: a critical review

Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd.     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.