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991.
A novel method was developed to realize the situ accumulation of carbon nanofibers (CNFs) in the carbon fiber reinforced polymer composites (CFRPs) to construct the multi-scale reinforcement for improving the interlaminar properties. In this method, the prepreg was sealed by the nanomicroporous nylon membrane, and the excess resin was extracted from the prepreg by the vacuum-assisted method. It was found that the use of nylon membrane resulted in effective CNFs accumulation, especially in the interlayer by scanning electron microscopy. Short-beam strength tests and the end-notched flexure tests were conducted respectively to evaluate the interlaminar properties of CFRPs under shear loading. The results indicated that the interlaminar shear strength (ILSS) and the Mode II interlaminar fracture toughness (GIIC) of CFRPs made by the filtering membrane-assisted method remarkably increased compared with those prepared without using filtering membrane.  相似文献   
992.
Unidirectional flax fiber reinforced composites (FFRC) were made by hot press. Effects of processing parameters, including curing pressure, time and temperature on the distribution, shape and content of the voids formed during the manufacturing process of FFRC were investigated. The voids were characterized with the aid of ultrasonic C-scan and optical microscopy. Tensile and interlaminar shear properties of FFRC containing different content and shape of the voids were tested. The results showed that the voids were easily trapped in both the intralaminar and inside the flax yarns of FFRC due to the distinct structural characteristics of flax fibers. The relationships between voids and mechanical properties of the composites were established.  相似文献   
993.
A new method for fabricating glass fiber composite sandwich panel with pyramidal truss cores was developed based on the vacuum assisted resin transfer molding technology. The microstructure and organizations of fabricated sandwich panels were examined by the scanning electron microscope. The out-of-plane compressive tests of composite sandwich panels were performed throughout the temperature range from −60 °C to 125 °C. Then the effects of temperature on the compressive strength, compressive modulus and failure mechanism were investigated and analyzed. Our results indicated that cryogenic temperature resulted in the increasing of the compressive modulus and strength, while high temperature caused the degradation of the compressive modulus and strength. The effect of temperature on failure mode of composite sandwich panel was also observed. Analytical expressions were presented to predict the compressive modulus and strength of composite sandwich panels at different temperatures.  相似文献   
994.
C/SiC composite sandwich structure with stitched lattice core was fabricated by a technique that involved polymer impregnation and interweaving. The mechanical behaviors of C/SiC composite sandwich structure were investigated at room temperature. The out-of-plane compressive strength was 20.97 MPa while modulus was 1473.55 MPa. The microstructural evolution on compression fracture surfaces of the stitching yarns was investigated by scanning electron microscopy, and the damage pattern of fibers on compression fracture surface was presented and discussed. Under an in-plane compression loading, the C/SiC composite sandwich structure displayed a linear-elastic behavior until failure. The peak strength and average modulus are 165.61 MPa and 19.74 GPa, respectively. The failure of the specimen was dominated by the fracture of the facesheet.  相似文献   
995.
The hybrid filler of hollow glass microspheres (HGM) and nitride particles was filled into low-density polyethylene (LDPE) matrix via powder mixing and then hot pressing technology to obtain the composites with higher thermal conductivity as well as lower dielectric constant (Dk) and loss (Df). The effects of surface modification of nitride particles and HGMs as well as volume ratio between them on the thermal conductivity and dielectric properties at 1 MHz of the composites were first investigated. The results indicate that the surface modification of the filler has a beneficial effect on thermal conductivity and dielectric properties of the composites due to the good interfacial adhesion between the filler and matrix. An optimal volume ratio of nitride particles to HGMs of 1:1 is determined on the basis of overall performance of the composites. The thermal conductivity as well as dielectric properties at 1 MHz and microwave frequency of the composites made from surface-modified fillers with the optimal nitride to HGM volume ratio were investigated as a function of the total volume fraction of hybrid filler. It is found that the thermal conductivity increases with filler volume fraction, and it is mainly related to the type of nitride particle other than HGM. The Dk values at 1 MHz and microwave frequency show an increasing trend with filler volume fraction and depend largely on the types of both nitride particles and HGMs. The Df values at 1 MHz or quality factor (Q × f) at microwave frequency show an increasing or decreasing trend with filler volume fraction and also depend on the types of both nitride particle and HGM. Finally, optimal type of HGM and nitride particles as well as corresponding thermal conductivity and dielectric properties is obtained. SEM observations show that the hybrid filler particles are agglomerated around the LDPE matrix particles, and within the agglomerates the smaller-sized nitride particles in the hybrid filler can easily form thermally conductive networks to make the composites with high thermal conductivity. At the same time, the increase of the value Dk of the composites is restricted due to the presence of HGMs.  相似文献   
996.
Polyhedral oligomeric silsesquioxane grafting thermally conductive silicon carbide particle (POSS-g-SiCp) fillers, are performed to fabricate highly thermally conductive ultra high molecular weight polyethylene (UHMWPE) composites combining with optimal dielectric properties and excellent thermal stabilities, via mechanical ball milling followed by hot-pressing method. The POSS-g-SiCp/UHMWPE composite with 40 wt% POSS-g-SiCp exhibits relative higher thermal conductivity, lower dielectric constant and more excellent thermal stability, the corresponding thermally conductive coefficient of 1.135 W/mK, the dielectric constant of 3.22, and the 5 wt% thermal weight loss temperature of 423 °C, which holds potential for packaging and thermal management in microelectronic devices. Agari’s semi-empirical model fitting reveals POSS-g-SiCp fillers have strong ability to form continuous thermally conductive networks.  相似文献   
997.
The addition of fibres to a brittle matrix is a well-known method to improve the flexural strength. However, the success of the reinforcements is dependent on the interaction between the fibre and the matrix. This paper presents the mechanical and microstructural properties of PVA and basalt fibre reinforced geopolymers. Moreover low density and thermal resistant materials used as insulating panels are known be susceptible to damage due to their poor flexural strength. As such the thermal and fire resistance properties of foamed geopolymers containing fibre reinforcement were also investigated.The results highlight that the presence of PVA fibres greatly increased the flexural strength and the toughness of the geopolymer composite, while the presence of basalt fibres improved the flexural behaviour of the composite after high temperature exposure.  相似文献   
998.
酒钢成功实践了采用微合金V生产Ф32mm HRB500E带肋钢筋。利用V的析出、固溶强化和细晶强化的机理,在HRB400E的基础上通过成分和工艺的调整成功开发了HRB500E。Ф32mm HRB500E性能指标较国标有一定余量,Rel平均高出约40 MPa,Rm平均高出60 MPa,A%平均高出6%,Agt%平均高出3%,强屈比及屈标比均符合国标要求。  相似文献   
999.
载铜多壁碳纳米管的抗菌活性研究   总被引:1,自引:0,他引:1  
采用溶胶-凝胶法在多壁碳纳米管(MWCNTs)表面负载纳米铜,制备复合抗菌材料MWCNTsCu。X射线能量色散谱(EDS)、透射电子显微镜(TEM)表征结果表明,纳米铜成功地负载在MWCNTs表面,纳米铜分散良好。以大肠杆菌为目标,评价了MWCNTs-Cu对水中细菌的抗菌活性,探讨了其抗菌机理。研究结果表明,MWCNTs-Cu对大肠杆菌表现出很强的抗菌性,其中,MWCNTs对大肠杆菌有强吸附性,纳米铜起主要杀菌作用。  相似文献   
1000.
CCD应用的关键问题之一就是驱动电路的设计。以TCD1209D为例,设计并实现了一种CCD驱动模块。通过对TCD1209D芯片的时序分析,在ISE12.4开发平台上,运用Verilog HDL语言设计了TCD1209D的驱动逻辑电路,并构建了TCD1209D驱动模块的硬件电路。最后将设计的逻辑电路下载到XILINX公司的XC3S500E芯片上进行验证与实现。测试结果表明驱动电路能驱动TCD1209D正确工作并输出模拟图像信号。  相似文献   
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