首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   107854篇
  免费   8509篇
  国内免费   6563篇
电工技术   3510篇
技术理论   3篇
综合类   6144篇
化学工业   25738篇
金属工艺   11792篇
机械仪表   5215篇
建筑科学   3342篇
矿业工程   2532篇
能源动力   2533篇
轻工业   7305篇
水利工程   1266篇
石油天然气   3165篇
武器工业   821篇
无线电   11524篇
一般工业技术   17491篇
冶金工业   4309篇
原子能技术   1326篇
自动化技术   14910篇
  2024年   382篇
  2023年   1807篇
  2022年   3364篇
  2021年   3913篇
  2020年   3084篇
  2019年   2787篇
  2018年   2576篇
  2017年   3235篇
  2016年   3814篇
  2015年   4513篇
  2014年   5960篇
  2013年   6134篇
  2012年   6844篇
  2011年   9242篇
  2010年   7168篇
  2009年   7714篇
  2008年   6764篇
  2007年   7365篇
  2006年   6218篇
  2005年   5325篇
  2004年   4343篇
  2003年   3936篇
  2002年   3248篇
  2001年   2188篇
  2000年   2036篇
  1999年   1647篇
  1998年   1323篇
  1997年   1035篇
  1996年   960篇
  1995年   721篇
  1994年   681篇
  1993年   500篇
  1992年   420篇
  1991年   327篇
  1990年   271篇
  1989年   212篇
  1988年   145篇
  1987年   120篇
  1986年   123篇
  1985年   80篇
  1984年   58篇
  1983年   48篇
  1982年   56篇
  1981年   43篇
  1980年   55篇
  1979年   36篇
  1978年   11篇
  1977年   21篇
  1976年   19篇
  1974年   15篇
排序方式: 共有10000条查询结果,搜索用时 0 毫秒
201.
本文研究了纤维体积分数对三维编织芳纶纤维增强铸性尼龙(简称K3D/MCPA)复合材料力学性能的影响。研究表明,K3D/MCPA复合材料有优异的抗冲击性能,冲击强度比三维编织芳纶纤维增强铸性尼龙(简称C3D/MCPA)和纯基体均有大幅度的提高,且随着纤维体积的提高而升高。K3D/MCPA复合材料剪切强度随纤维体积比的增大而增大,其纵向剪切强度低于纯基体和C3D/MCPA复合材料,但其横向剪切强度高于它们。K3D/MCPA复合材料弯曲强度与弯曲模量随纤维体积比的提高而提高,但与相同体积比的C3D/MCPA相比,K3D/MCPA的弯曲强度与弯曲模量均较低。  相似文献   
202.
氧气生产单位保用户用气一旦出现较为紧张的局面时,如何正确处理保安全生产运行、保用户生产、安排抢修时间三者之间的关系,值得关注与研究。  相似文献   
203.
Ni interlayers were introduced prior to dissimilar friction welding of Ti6Al4V base material to three cemented carbide substrates. The fracture strength of Ti6Al4V/(WC-6 wt% Co) welds were poor and were markedly improved when 20-µm thick Ni interlayers were introduced prior to dissimilar friction welding. These results were only produced when the (WC-6 wt% Co) cermet was electroplated prior to friction welding. When the Ti6Al4V alloy was electroplated prior to friction welding, fractured WC particles and cracking were observed in the (WC-Co) carbide substrate. The fracture strengths of Ti6Al4V/(WC-11 wt% Co) and Ti6Al4V/(WC-24 wt% Co) welds were not improved when 20-µm thick Ni interlayers were introduced prior to friction welding. During mechanical testing, the Ni layer retained at the dissimilar joint interface created a region of weakness.  相似文献   
204.
三维地质模型在濮城油田的应用   总被引:2,自引:2,他引:0  
以濮城油田东区沙二下油藏为研究对象,在储层流动单元细分、微构造、沉积微相、测井曲线二次处理、储层非均质研究、储层动态解释等研究基础上,以数据库为支撑,应用三维可视化技术,建立了研究区油藏三维可视化地质模型。其成果应用于油藏的调整井位设计,并且实现了油藏精细描述—油藏精细数值模拟一体化,效果良好。  相似文献   
205.
Computational models and electrophysiological data suggest that the CA3 subregion of the hippocampus supports the formation of arbitrary associations; however, no behavioral studies have been conducted to test this hypothesis. Rats with neurotoxin-induced lesions of dorsal dentate gyrus (DG), CA3, or CA1 were tested on object-place and odor-place paired-associate tasks to test whether the mechanism that supports paired-associate learning is localized to the CA3 subregion of the dorsal hippocampus or whether all hippocampal subregions contribute to paired-associate learning. The data indicate that rats with DG or CA1 lesions learned the tasks as well as controls; however, CA3-lesioned rats were impaired in learning the tasks. Thus, the CA3 subregion of the dorsal hippocampus contains a mechanism to support paired-associate learning. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
206.
结合广东潮州高级中学的实际情况,介绍了高中校园一卡通系统的设计和应用.  相似文献   
207.
A modified method is discussed that is based on Farooque and Deshpande's method to obtain polymer–polymer interaction parameters using inverse gas chromatography (IGC) data. In the Farooque and Deshpande method, the ratio of the difference of probe–polymer interaction parameters between two polymers and the probe volume [(χ12 ? χ13)/V1] is used as the abscissa. In the modified method, the ratio [(?2χ12 + ?3χ13)/V1] is used as the abscissa. Experimental data previously reported for a poly(?‐caprolactone)‐polyepichlorohydrin (PCL/PECH) blend and a poly(ethyl acrylate)‐poly(vinyl propionate) (PEA/PVPr) blend are analyzed. It is found that the slopes obtained by the new method had smaller deviations from the theoretical values than the Farooque and Deshpande method. The standard deviations of both slopes and intercepts obtained from the new method are also smaller. Using the new method, the polymer–polymer interaction parameters obtained from the intercept are negative numbers for the PCL/PECH system and very small positive numbers for PEA/PVPr. Explanations are given for the probe and concentration dependency of the polymer–polymer interaction parameters that are generally observed in IGC studies. A new method for selecting the best probe for calculating the interaction parameter is discussed. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 671–680, 2003  相似文献   
208.
苯乙烯与1-(2-叔丁基过氧异丙基)-3-异丙烯基苯(D120)能进行自由基共聚合反应,聚合后过氧基团以侧基的形成被保留在共聚物大分子链上,凝胶色谱分析发现,随原料单体中D120比例增加,共聚物的分子量减小,分子量分布变窄,DSC分析发现共聚物中过氧基团的分解温度随D120结构单元含量的增加而下降,但仍高于D120单体过氧基团的分解温度,苯乙烯与D120的竞聚率为:rD120=0.700,rSt=0.714。  相似文献   
209.
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on inter-wafer via/contact and orientation of each wafer embedded in the layout. We have implemented the layout methodology in 3DMagic. Availability of 3DMagic has led to interesting research with a wide range of layout-specific circuit evaluation, from performance comparison of 2D and 3D circuits to layout-specific reliability analyses in 3D circuits. Using 3DMagic, researchers have designed and simulated an 8-bit encryption processor mapped into 2D and 3D FPGA layouts. Moreover, the layout methodology is an essential element of our ongoing research for the framework of a novel Reliability Computer Aided Design tool, ERNI-3D.  相似文献   
210.
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号