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201.
本文研究了纤维体积分数对三维编织芳纶纤维增强铸性尼龙(简称K3D/MCPA)复合材料力学性能的影响。研究表明,K3D/MCPA复合材料有优异的抗冲击性能,冲击强度比三维编织芳纶纤维增强铸性尼龙(简称C3D/MCPA)和纯基体均有大幅度的提高,且随着纤维体积的提高而升高。K3D/MCPA复合材料剪切强度随纤维体积比的增大而增大,其纵向剪切强度低于纯基体和C3D/MCPA复合材料,但其横向剪切强度高于它们。K3D/MCPA复合材料弯曲强度与弯曲模量随纤维体积比的提高而提高,但与相同体积比的C3D/MCPA相比,K3D/MCPA的弯曲强度与弯曲模量均较低。 相似文献
202.
氧气生产单位保用户用气一旦出现较为紧张的局面时,如何正确处理保安全生产运行、保用户生产、安排抢修时间三者之间的关系,值得关注与研究。 相似文献
203.
Influence of Ni Interlayers on the Mechanical Properties of Ti6Al4V/(WC-Co) Friction Welds 总被引:2,自引:0,他引:2
M. Shamanian M. Salehi A. Saatchi T. H. North 《Materials and Manufacturing Processes》2003,18(4):581-598
Ni interlayers were introduced prior to dissimilar friction welding of Ti6Al4V base material to three cemented carbide substrates. The fracture strength of Ti6Al4V/(WC-6 wt% Co) welds were poor and were markedly improved when 20-µm thick Ni interlayers were introduced prior to dissimilar friction welding. These results were only produced when the (WC-6 wt% Co) cermet was electroplated prior to friction welding. When the Ti6Al4V alloy was electroplated prior to friction welding, fractured WC particles and cracking were observed in the (WC-Co) carbide substrate. The fracture strengths of Ti6Al4V/(WC-11 wt% Co) and Ti6Al4V/(WC-24 wt% Co) welds were not improved when 20-µm thick Ni interlayers were introduced prior to friction welding. During mechanical testing, the Ni layer retained at the dissimilar joint interface created a region of weakness. 相似文献
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205.
Computational models and electrophysiological data suggest that the CA3 subregion of the hippocampus supports the formation of arbitrary associations; however, no behavioral studies have been conducted to test this hypothesis. Rats with neurotoxin-induced lesions of dorsal dentate gyrus (DG), CA3, or CA1 were tested on object-place and odor-place paired-associate tasks to test whether the mechanism that supports paired-associate learning is localized to the CA3 subregion of the dorsal hippocampus or whether all hippocampal subregions contribute to paired-associate learning. The data indicate that rats with DG or CA1 lesions learned the tasks as well as controls; however, CA3-lesioned rats were impaired in learning the tasks. Thus, the CA3 subregion of the dorsal hippocampus contains a mechanism to support paired-associate learning. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
206.
207.
Jan‐Chan Huang 《应用聚合物科学杂志》2003,90(3):671-680
A modified method is discussed that is based on Farooque and Deshpande's method to obtain polymer–polymer interaction parameters using inverse gas chromatography (IGC) data. In the Farooque and Deshpande method, the ratio of the difference of probe–polymer interaction parameters between two polymers and the probe volume [(χ12 ? χ13)/V1] is used as the abscissa. In the modified method, the ratio [(?2χ12 + ?3χ13)/V1] is used as the abscissa. Experimental data previously reported for a poly(?‐caprolactone)‐polyepichlorohydrin (PCL/PECH) blend and a poly(ethyl acrylate)‐poly(vinyl propionate) (PEA/PVPr) blend are analyzed. It is found that the slopes obtained by the new method had smaller deviations from the theoretical values than the Farooque and Deshpande method. The standard deviations of both slopes and intercepts obtained from the new method are also smaller. Using the new method, the polymer–polymer interaction parameters obtained from the intercept are negative numbers for the PCL/PECH system and very small positive numbers for PEA/PVPr. Explanations are given for the probe and concentration dependency of the polymer–polymer interaction parameters that are generally observed in IGC studies. A new method for selecting the best probe for calculating the interaction parameter is discussed. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 671–680, 2003 相似文献
208.
苯乙烯与1-(2-叔丁基过氧异丙基)-3-异丙烯基苯(D120)能进行自由基共聚合反应,聚合后过氧基团以侧基的形成被保留在共聚物大分子链上,凝胶色谱分析发现,随原料单体中D120比例增加,共聚物的分子量减小,分子量分布变窄,DSC分析发现共聚物中过氧基团的分解温度随D120结构单元含量的增加而下降,但仍高于D120单体过氧基团的分解温度,苯乙烯与D120的竞聚率为:rD120=0.700,rSt=0.714。 相似文献
209.
Syed M. Alam Donald E. Troxel Carl V. Thompson 《Analog Integrated Circuits and Signal Processing》2003,35(2-3):199-206
In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on inter-wafer via/contact and orientation of each wafer embedded in the layout. We have implemented the layout methodology in 3DMagic. Availability of 3DMagic has led to interesting research with a wide range of layout-specific circuit evaluation, from performance comparison of 2D and 3D circuits to layout-specific reliability analyses in 3D circuits. Using 3DMagic, researchers have designed and simulated an 8-bit encryption processor mapped into 2D and 3D FPGA layouts. Moreover, the layout methodology is an essential element of our ongoing research for the framework of a novel Reliability Computer Aided Design tool, ERNI-3D. 相似文献
210.