Organic field-effect transistor with extended indium tin oxide gate structure for selective pH sensing

In this study, organic field-effect transistors (OFETs) with extended gate structure were fabricated for selective pH sensing applications. Indium tin oxide (ITO) was used as extended gate electrode as well as an active layer for H⁺ sensing. The threshold voltage of the fabricated ion-selective OFET was varied by the changes in the electrochemical potential at the ITO electrode surface upon its exposure to buffer solutions with variable pH values. The sensor showed excellent linearity and a high sensitivity of 57–59 mV/pH in the pH range of 2–12. The selectivity of the ITO sensing layer to H⁺ ions was also investigated by measuring the interfering effect of Ca²⁺ and K⁺ ions in the buffer pH solutions. The results showed that the Ca²⁺ and K⁺ ions weakly interfere with the selective pH sensing of the ITO-extended gate OFET sensor device.     

利用FN电流估计薄栅MOS结构栅氧化层的势垒转变区的宽度

通过数值求解整个势垒的薛定谔方程 ,发现 FN电流公式中的 B因子强烈依赖势垒的转变区的宽度 ,而 C因子则弱依赖于势垒的转变区的宽度 .给出了一种利用 WKB近似所得的处理电子隧穿存在转变区势垒的过程 ,并得到一个 FN电流的分析表达式 .它可用来估计薄栅 MOS结构的栅氧化层的势垒转变区的宽度 .在转变区的宽度小于 1nm时 ,它与数值求解薛定谔方程的结果吻合得很好 ,表明该方法可以用来估计势垒转变区的宽度 .实验的结果表明 B因子随温度有较大的变化 ,这个结果验证了该方法的部分预测结果     

Low Power High-Speed Neuron MOS Digital-to-Analog Converters with Minimal Silicon Area

Digital-to-analog converts utilizing neuron MOS-transistors were designed. Different DACs were implemented and characterized in order to compare various topologies. Criteria to select structures were low power, fast performance and minimal silicon area. A basic 8-bit version is implemented with only one neuron MOS-transistor and eight capacitors. The silicon area of this D/A converter is only 0.04 mm² and the power consumption is 8.4 mW with conversion speed of 200 MS/s. An enhanced 8 and 10 bit versions utilizing neuron PMOS transistor and some extra circuitry are also proposed and tested. The silicon area of the enhanced 10 bit circuit is only 0.03mm² while the performance is as good as in the case of the basic version. The measured differential nonlinearity is 0.38 LSB and integral nonlinearity is 0.55 LSB for the enhanced 10 bit structure.     

薄栅SiO2击穿特性的实验分析和机理研究

该文利用衬底热空穴（SHH）注入技术分别控制注入到薄栅氧化层中的热电子和热空穴的数量,定量研究了热电子和热空穴注入对薄栅氧化层击穿的影响,提出了薄栅氧化层的经时击穿是由热电子和热空穴共同作用导致的新观点,并对薄栅氧化层的经时击穿建立了一个新的物理模型。     

一种双路图像融合实时处理系统的设计

提出了一种关于双路图像融合实时处理系统的设计,介绍了融合处理系统的总体架构和系统的功能。对系统的硬件设计和软件设计分别进行了说明,硬件设计对电源设计、采集模块设计和处理模块设计进行了详细阐述;软件部分细致分析了现场可编程门阵列(FPGA)的设计和数字信号处理器(DSP)的设计。最后对处理系统进行了测试,表明该设计满足实时处理的需求。同时,可对系统进行扩展,实现更多路图像的融合处理。     

Ka波段GaN HEMT功率器件

设计了Ka波段GaN功率高电子迁移率晶体管(HEMT)外延材料及器件结构,采用AlN插入层提高了二维电子气(2DEG)浓度.采用场板结构提高了器件击穿电压.采用T型栅工艺实现了细栅制作,提高了器件高频输出功率增益.采用钝化工艺抑制了电流崩塌,提高了输出功率.采用通孔工艺减小源极寄生电阻,通过优化钝化层厚度减小了寄生电容,提高了器件增益.基于国产SiC外延材料及0.15 μm GaN HEMT工艺进行了器件流片,最终研制成功Ka波段GaN HEMT功率器件.对栅宽300 μm器件在29 GHz下进行了微波测试,工作栅源电压为-2.2V,源漏电压为20 V,输入功率为21 dBm时,器件输出功率为30 dBm,功率增益为9 dB,功率附加效率约为43％,功率密度达到3.3 W/mm.     

ZFSD5600/22/35型组合式端头支架研究

ZFSD560 0 /2 2 /35型组合式端头支架属于原煤炭部“九五”重点科研攻关项目“坚硬厚煤层综放开采关键技术研究”第三子专题主要研究内容之一。它是针对大同坚硬厚煤层综放设备配套大、配套空间有限 ,设计的一种新型组合式端头支架 ,该支架首次实现了与转载机互为联动功能 ,它的研究使用成功 ,为我国综放开采端头支护提供了一种新架型。     

Electrochemically induced asymmetrical etching in InAlAs/InGaAs heterostructures for MODFET gate-groove fabrication

We have achieved a self-controlled asymmetrical etching in metalorganic chemical vapor deposition-grown InAlAs/InGaAs heterostructures, which can be suitable for fabricating modulation-doped field-effect transistors (MODFETs) with gate-groove profiles for improved performance. The technology is based on electrochemical etching phenomena, which can be effectively controlled by using different surface metals for ohmic electrodes. When surface metals of Pt and Ni are deposited on the source and the drain, respectively, the higher electrode potential of Pt results in slower etching on the source side than on the drain side. Thus, asymmetry of gate grooves can be formed by wet-chemical etching with citric-acid-based etchant. This represents a new possibility to conduct “recess engineering” for InAlAs/InGaAs MODFETs.     

8～12GHz低噪声PHEMT单片集成电路

描述了以ＰＨＥＭＴ为有源器件的８～１２ＧＨｚ宽带低噪声单片电路的设计及制造，获得了满意的结果。其性能为ｆ＝８～１２ＧＨｚ，Ｇａ＝１７．４～１９．５ｄＢ，Ｆｎ＝１．８４～２．２０ｄＢ；ｆ＝８～１４ＧＨｚ，Ｇａ＝１７．４～１９．９ｄＢ，Ｆｎ＝１．８４～２．５ｄＢ