On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material

Hypoeutectic Sn-Zn may be a better choice than the eutectic Sn-9Zn as a lead-free solder. We checked the non-equilibrium melting behaviors of a series of Sn-Zn alloys (2.5-9 wt.% Zn) by differential thermal analysis, and found that at a heating rate of 5 °C/min, Sn-6.5Zn behaves the same way as the eutectic Sn-9Zn in melting. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests indicated that Sn-6.5Zn has significantly better wettability to Cu than Sn-9Zn does. The reaction layers formed during the spreading tests were examined. For all samples with 2.5-9 wt.% Zn, two reaction layers are formed at the interface, a thick and flat Cu₅Zn₈ layer adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. The total thickness of the reaction layers between the alloy and Cu was found to remarkably decrease with decrease of the Zn concentration.     

基于嵌入式LINUX的异步事件驱动数据采集模型

提出了一种基于嵌入式Linux的高性能多路数据采集软件模型．该模型采用ACE设计模式提供的体系架构，实现了异步事件驱动的并发处理，能支持事件多路分离，异步操作结束会触发事件句柄，再调用回调函数完成相应的数据处理任务。由于对数据源事件的监测、数据读取、多事件的处理等操作是由操作系统完成．该模型可以有效避免多进程同步机制系统开销较大的问题，从而提高嵌入式系统的多路数据并发采集能力。     

Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples

The phase equilibria of the Sn-Cu-Au ternary, Ag-Sn-Cu-Au quaternary systems and interfacial reactions between Sn-Cu alloys and Au were experimentally investigated at specific temperatures in this study. The experimental results indicated that there existed three ternary intermetallic compounds (IMCs) and a complete solid solubility between AuSn and Cu₆Sn₅ phases in the Sn-Cu-Au ternary system at 200°C. No quaternary IMC was found in the isoplethal section of the Ag-Sn-Cu-Au quaternary system. Three IMCs, AuSn, AuSn₂, and AuSn₄, were found in all couples. The same three IMCs and (Au,Cu)Sn/(Cu,Au)₆Sn₅ phases were found in all Sn-Cu/Au couples. The thickness of these reaction layers increased with increasing temperature and time. The mechanism of IMC growth can be described by using the parabolic law. In addition, when the reaction time was extended and the Cu content of the alloy was increased, the AuSn₄ phase disappeared gradually. The (Au, Cu)Sn and (Cu_,Au)₆Sn₅ layers played roles as diffusion barriers against Sn in Sn-Cu/Au reaction couple systems.     

Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds

Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To determine if interfacial IMC is a requirement for whisker growth, bright Sn and a Sn-Cu alloy were electroplated on a tungsten (W) substrate that does not form interfacial IMC with the Sn or Cu. At room temperature, conical Sn hillocks grew on the pure Sn deposits and Sn whiskers grew from the Sn-Cu alloy electrodeposits. These results demonstrate that interfacial IMC is not required for initial whisker growth.     

Synthesis and materials characterization of Li2MnO3-LiCrO2 system nanocomposite electrode materials

A series of Li[Cr_xLi_(1−x)/3Mn_2(1−x)/3]O₂, (0.2 ≤ x ≤ 0.4) with nanocomposite structures was synthesized by a solution method with subsequent quenching. The sample structures were investigated by X-ray diffraction (Rietveld refinement), electron diffraction and HRTEM. According to co-indexed electron diffraction patterns and HRTEM images, Li[Cr_0.211Li_0.268Mn_0.520]O₂ was found to be composed of solid solution powders and Li[Cr_0.290Li_0.240Mn_0.470]O₂ and Li[Cr_0.338Li_0.225Mn_0.436]O₂ of nanocomposite powders indexed in monoclinic and hexagonal structure. Among the three compounds, the nanocomposite Li[Cr_0.290Li_0.240Mn_0.470]O₂ cathode prevented spinel-like structural transformation during cycling and delivered a good reversible capacity of about 195 mAh/g.     

Hydrothermal Synthesis and Characterization of a Novel Organic Inorganic Hybrid Compound [Co(dien)_2](dienH_3)(H_3O)_7[P_2Mo_5O_(23)]_2·14H_2O

A new compound,[Co(dien)2](dienH3)(H3O)7[P2Mo5O23]2·14H2O, has been hydrothermallly synthesized by using Na2MoO4,CoCl2, H3PO4 and dien, and structurally characterized by elemental analysis, X-ray powder diffraction analysis, SEM, IR and TG analysis. The results show that the compound is composed of a polyanion [P2Mo5O23]212- , complex [Co(dien)2]2 cation, protonated [dienH3]3 , and forteen crystallization water molecule.     

Ratio of Fe-Al compound at interface of steel-backed Al-graphite semi-solid bonding plate

The ratio of Fe-Al compound at the bonding interface of solid steel plate to Al-7graphite slurry was used to characterize the interfacial structure of steel-Al-7graphite semi-solid bonding plate quantitatively. The relationship between the ratio of Fe-Al compound at interface and bonding parameters (such as preheat temperature of steel plate, solid fraction of Al-7graphite slurry and rolling speed) was established by artificial neural networks perfectly. The results show that when the bonding parameters are 516 ℃ for preheat temperature of steel plate, 32.5% for solid fraction of Al-7graphite slurry and 12 mm/s for rolling speed, the reasonable ratio of Fe-Al compound corresponding to the largest interfacial shear strength of bonding plate is obtained to be 70.1%. This reasonable ratio of Fe-Al compound is a quantitative criterion of interfacial embrittlement, namely, when the ratio of Fe-Al compound at interface is larger than 70.1%, interfacial embrittlement will occur.     

纯棉复合组织织物上机工艺优化

为了在喷气织机上顺利生产不同浮长的复合组织织物,对所用经纱的强力、强力不匀率、千米细节提出了质量要求,并结合实例介绍了复合组织织物织造各工序的工艺实践。     

提高造纸用高岭土粘浓度及分散特性的研究

通过调节高岭土矿浆的pH值到8.5—9,使用6种分散剂单独或复配应用的方法,改变高岭土浆料的分散特性,提高粘浓度。结果表明:单独使用时,分散效果聚丙烯酸钠>萘磺酸钠>胶易素1>六偏磷酸钠>胶易素2>单宁酸;复配使用时,六偏磷酸钠与萘磺酸钠以质量比1∶1配合为最佳,可以将高岭土浆料粘浓度从69.7%提高至71.3%。     

氧化铁/绢云母复合光催化剂降解次甲基蓝

采用水热合成法，在绢云母表面沉淀一层氧化铁薄膜，制备成氧化铁/绢云母复合光催化剂。并以次甲基蓝为降解物，重点探讨了催化剂后处理方式、体系H2O2浓度和催化剂添加量对光催化效率的影响。结果证明，复合光催化剂煅烧前比煅烧后降解效果更好；体系H2O2浓度为0.5%、光催化剂用量为5 g/L时，降解效果最佳。