Adsorption properties of oxygen and methane on Ga-ZSM-5; the origin of the selectivity of NOx reduction using methane

The adsorption properties of oxygen and methane on Ga-ZSM-5 and Cu-ZSM-5 catalysts were examined by a TPD method to clarify the extraordinary selectivity of HC-SCR using methane on Ga-ZSM-5. It was observed that Ga-ZSM-5 did not adsorb oxygen but adsorbed methane dissociatively, while on Cu-ZSM-5 oxygen was dissociatively adsorbed and reacted with adsorbed ethylene.     

磁性生物吸附剂对Cu2+吸附性能的研究

以环氧氯丙烷为交联剂,用壳聚糖、纳米磁粉悬浮液(Fe3O4)和纯菌丝体制备了磁性生物吸附剂,用XRD对该吸附剂进行了结构表征.研究了溶液pH、吸附时间和Cu2 初始浓度对其吸附性能的影响,结果表明,在pH为5～5.5,Cu2 初始质量浓度为0.1 g/L,吸附时间为8 h的条件下,它的Cu2 去除率为88.73%,吸附容量为16.530 mg/g.该磁性生物吸附剂经5次重复使用后,对Cu2 去除率仍然达到79%以上,具有良好的重复使用性.     

表面活性剂(PVA)浓度对电子束制备纳米铜的影响

在水溶液中,常温常压下使用聚乙烯醇(PVA)为表面活性剂,用电子束辐照方法可以成功制备纳米铜粉。利用紫外可见分光光度计(UV)和激光粒度衍射仪(LSPSDA)考察了表面活性剂浓度对纳米铜粒径分布和团聚的影响。在一定范围内随着PVA浓度的增大纳米铜的粒径减小到13nm。X射线衍射(XRD)和透射电子显微镜(TEM)结果表明PVA浓度为0.88g/100mL,pH值在5~9之间时,能得到纯的纳米铜,其粒径分布为15~40nm。     

Corrosion inhibition of copper in near neutral aqueous solutions by gamma-pyrodiphenone

The inhibition effect of gamma-pyrodiphenone (PD) on copper corrosion in near neutral sulphate solutions was investigated. Weight loss and polarization measurements show a high inhibition efficiency (>96%) of PD on copper corrosion at extremely low concentrations. PD suppresses active copper dissolution and oxygen reduction. The potentiodynamic cathodic reduction measurements showed an inhibition of oxide formation and stabilization of the Cu2O oxide in the presence of PD. XPS measurements suggested that the high inhibition effect of PD on copper corrosion is due to the adsorption of PD molecules, as a first stage, and the formation of a film with a polymer-like structure by coordination of PD with Cu2O on prolonged exposure.     

绿色盐水介质铜缓蚀剂的研究

以葡萄糖酸钙、钼酸钠、苯并三氮唑(BTA)、聚天冬氨酸、十二烷基葡萄糖苷、添加剂等合成了盐水介质铜缓蚀剂并用腐蚀失重法进行了评价.在22.5%盐水介质中,葡萄糖酸钙∶钼酸钠:苯并三氮唑∶聚天冬氨酸∶十二烷基葡萄糖苷=0.6∶1.0∶0.2∶0.3∶0.05,50℃时,铜缓蚀率可达98.5%以上.     

硅通孔化学机械平坦化中铜去除的电化学与选择性研究

利用极化曲线测量法研究了甘氨酸和过氧化氢浓度及pH对硅通孔(TSV)化学机械平坦化(CMP)中铜腐蚀的影响。结果表明:甘氨酸对铜的腐蚀随其浓度增大而增强;随着过氧化氢浓度增大,铜腐蚀电位逐渐增大;在p H为10时铜的腐蚀效果最佳。CMP实验表明,在不同浓度的甘氨酸和过氧化氢之下,抛光速率可调,达1.9~5.8μm/min,铜表面粗糙度为5~29 nm,铜钽去除速率比为20~50。     

滴定分析法测定铜的改进

提出在ＮＨ４ＨＦ２介质中，有ＳＣＮˉ存在下，以Ｉˉ３—淀粉为指示剂，硫代硫酸钠滴定铜的分析方法     

Pd deposited on Cu(110): a highly performant catalyst for the 1,3-butadiene hydrogenation reaction

The catalytic properties, with respect to the 1,3-butadiene hydrogenation reaction, of strained Pd films on Cu(110) (lattice mismatch 8%) has been probed as a function of the film thickness. The characterization of the adlayer has been made by the combined use of STM with LEED and AES. For deposits below 10¹⁵ Pd/cm² (i.e., about 1 ML) the catalytic activity is near zero. This is the consequence of the formation of a Pd–Cu surface alloy with tendency for Cu to migrate/segregate to the surface. The catalytic activity suddenly increases to reach a maximum value for about 3 ML; the activity is then one order of magnitude higher than that of the pure Pd(110) surface. This is the consequence of the presence of a strained Pd overlayer, with Pd surface atoms having very unusual geometry, and hence very peculiar electronic and chemical properties. The catalytic activity then decreases as the Pd coverage is increased, and tends to values near that of the pure Pd(110). Gradual relaxation of the film geometry towards that of the normal fcc Pd structure probably exists.     

Electrochemical investigations of copper behaviour in different cupric complex solutions: Voltammetric study

The electrochemical behaviour of copper has been investigated in different cupric complex solutions by cyclic voltammetry. In pyridinic and picolinic solutions the reduction of cupric complex occurred in two stages leading to Cu(I) and Cu(0), respectively. The electrodeposited copper is oxidized in two steps leading to Cu(I) and Cu(II) as in ammoniacal cupric complex solutions. In glycine, alanine, sulfamic acid and ethylenediamine solutions, the cuprous complex is an intermediate in the cupric complex reduction but it is not detected during the oxidation of the electrodeposited copper in these solutions. In EDTA and triethanolamine solutions, the cuprous complex is not observed. The rate of copper etching was determined in pyridinic and ammoniacal cupric solutions and was shown to be faster in ammoniacal cupric solutions than in the pyridinic solutions.     

Modelling of copper etching in aerated chloride solutions

The effect of dissolved oxygen on the rate of chemical etching of copper by acidic cuprous chloride solution was investigated numerically for the case of a rotating disc electrode (RDE). Copper dissolution in aerated acidic cupric chloride solutions of composition 3.5M CuCl2 + 0.5M HCl + 0.5M KCl and 3.5M CuCl2+0.5M HCl was investigated with consideration of the instantaneous homogeneous reaction 4CuCl32-+4H++O2rlhar4CuCl 3-+2H2O which takes place within the mass transport boundary layer. It was assumed that CuCl32- and O2 react instantaneously, resulting in the formation of a reaction plane which separated the mass transport boundary layer into two regions: a region adjacent to the electrode where oxygen was depleted, and a region adjacent to the bulk where CuCl32- was absent. A one-dimensional mathematical model was developed to predict the position of the reaction plane. The model accounted for diffusion, migration and fluid flow generated by an RDE and included nine species and five heterogeneous electrochemical reactions. The homogeneous redox reaction served to regenerate the chemical etchant solution and thus enhance the etch rate. With increasing oxygen concentration and rotation rate the reaction plane was found to move closer toward the electrode and thus the etch rate of copper increased. Addition of KCl increased the Cl- content in solution so as to shift the reaction plane toward the bulk.