Multidisciplinary approach for investigating the hot corrosion behavior of thermal barrier coatings

Herein, we propose a new multidisciplinary approach for investigating the corrosion behavior of thermal barrier coatings, combining the thermal-gradient mechanical fatigue method with hot corrosion tests. Corrosive salts (Na₂SO₄; V₂O₅) of varying concentrations (10−20 mg/cm²) were deposited on the surface of yttria-stabilized zirconia (YSZ) coatings to evaluate the microstructural changes occurring during the reaction, via thermal graded mechanical fatigue tests. The tests were conducted at a surface temperature of 1150 °C in 10 min cycles and underwent applied uniaxial tensile loads. The corrosion tests show that the ZrV₂O₇ plays an important role as an intermediate in the collapse of the lamellar structures during the reaction, which results from the repetitive precipitation of V₂O₅ and m-ZrO₂ from the ZrV₂O₇. The microstructure of corroded YSZ coatings exhibited a different degradation mechanism under a thermomechanical environment, compared with the testing under isothermal atmospheric conditions.     

Indentation method for fracture resistance determination of metal/ceramic interfaces in thick TBCs

The indentation technique has been used to measure the adhesion of plasma- sprayed ceramic coatings on metals intended for thick thermal barrier coating ( TTBC) applications. This approach provides the adhesion value as the critical strain energy release rate,Gc, of the interface, which also takes into account any residual stresses. The theoretical background of the method is outlined, and specific examples are reported with respect to the effect of substrate temperature on the metal/ceramic adhesion of thick TBCs.     

Image-based extended finite element modeling of thermal barrier coatings

Further advances in Thermal Barrier Coating (TBC) design are linked with the evolution of numerical models for TBCs. The present paper, therefore, enhances the idea of a currently available FEM package (OOF) that has been designed for microstructural level simulations. The approach of Extended FEM (XFEM) is incorporated in an in-house developed program to account for the existence of cracks in TBCs; both for stress-strain analysis and for heat transfer analysis. The new XFEM program is then employed to carry out the analyses of a YSZ deposit and a multilayered TBC to predict the effective Young's moduli, the overall thermal conductivities, and to assess the fracture behavior of the coating.     

碳基钨涂层在退火过程中的组织和结构变化

用真空等离子体喷涂(VPS)技术在C／C复合材料基体上制备了厚度为0．5mm的钨(W)涂层，涂层的表面通过物理气相沉积(PVD)预沉积钨、铼(Re)多层作为碳(C)的扩散势垒。涂层经过1200℃--2000℃的电子束退火，其微观结构和化学构成发生变化。经测量涂层的再结晶温度约为1400℃，再结晶的活性能为63kJ／mol。当退火温度高于1300℃时，涂层表面的多层W、Re结构将由于W、Re和C之间的相互扩散而发生改变，并在1600℃以上退火lh后由于脆性碳化钨在界面的形成而完全失效，碳化钨层的厚度将随着退火漏度的升高和退火时间的延长而迅速增加。     

稀土硅铁对TBCs梯度热障涂层组织与性能影响的研究

通过低压等离子喷涂技术在Ni基合金表面制备了Y2O3－CeO2-TZP/NiCoCrAlY梯度热障涂层，采用光学显微镜、X射线衍射仪、扫描电镜、电子探针等方法研究了稀土硅铁对Y2O3－CeO2-TZP/NiCoCrAlY梯度热障涂层的组织和性能的影响。结果表明，在涂层中加入适量的稀土硅铁，能改善涂层的组织结构，提高其抗热震性能和抗高温氧化性能。     

Properties of Induction Plasma Sprayed Iron Based Nanostructured Alloy Coatings for Metal Based Thermal Barrier Coatings

Metal-based thermal barrier coatings (MBTBCs) have been produced using high frequency induction plasma spraying (IPS) of iron-based nanostructured alloy powders. The study of MBTBCs has been initiated to challenge issues associated with current TBC materials such as difficult prediction of their “in-service” lifetime. Reliability of TBCs is an important aspect besides the economical consideration. Therefore, the study of MBTBCs, which should posses higher toughness than the current TBC materials, has been initiated to challenge the mechanical problems of ceramic-based TBCs (CBTBCs) to create a new generation of TBCs. The thermal diffusivity (TD) (α) properties of the MBTBCs were measured using a laser flash method, and density (ρ) and specific heat (C _p) of the MBTBCs were also measured for their thermal conductivity (k) calculation (k = αρ C _p).     

Thermal Shock Property of Al/Ni-ZrO_2 Gradient Thennal Barrier Coatings

THERMAL BARRIER COATINGS can holdbackintrusion of high temperature,high heat to increaseapplied temperature and life of substrate metal parts,and have been applied on heat position of rocket,satellite,aero engine and gas engine"31.But thermalstresses are produced during thermal shock due tomismatch of thermal properties between ceramiccoatings and substrate metal,therefore thermal shockproperties of coatings are very poor.Gradient thermalbarrier coatings make materials gradually chang…     

Copper diffusion into silicon substrates through TaN and Ta/TaN multilayer barriers

A study of copper (Cu) diffusion into silicon substrates through Ta nitride (TaN) and tantalum (Ta/TaN) layers was investigated based on an experimental approach. TaN _x and Ta/TaN _x thin films were deposited by radiofrequency sputtering under argon (Ar) and Ar-nitrogen (N) plasma. The influence of the N₂ partial pressure on the microstructure and the electrical properties is reported. X-ray diffraction patterns showed that the increase of the N₂ partial pressure, from 2 to 10.7%, induces a change in the composition of the δTaN phase, from TaN to TaN_1.13, as well as an evolution of the dominant crystallographic orientation. This composition change is related to a drastic increase of the electrical resistivity over a N₂ partial pressure of 7.3%. The efficiency of TaN layers and Ta/TaN multilayer diffusion barriers was investigated after annealing at temperatures between 600 and 900 °C in vacuum. Secondary ion mass spectrometry profiles showed that Cu diffuses from the surface layer through the TaN barrier from 600 °C. Cu diffusion mechanisms are modified in the presence of a Ta sublayer. This article was presented at the Multicomponent-Multiphase Diffusion Symposium in Honor of Mysore A. Dayananda, which was held during TMS 2006, the 135th Annual Meeting and Exhibition, March 12–16, 2006, in San Antonio, TX. The symposium was organized by Yongho Sohn of the University of Central Florida, Carelyn E. Campbell of National Institute of Standards and Technology, Richard D. Sisson, Jr., of Worcester Polytechnic Institute, and John E. Morral of Ohio State University.     

扩散阻挡层对Cu-Zr纳米合金膜电阻率与残余应力的影响

用磁控溅射和离子束溅射共沉积的方法分别在以单晶硅为基体的TiN,TaN,ZrN扩散阻挡层上沉积了Cu-Zr合金膜,膜在400℃氮气中退火1h.结果表明扩散阻挡层对膜的晶体取向、电阻率和残余应力有很大影响.沉积态的膜具有强的（111）取向,且峰型严重展宽;退火后峰型明显锐化,出现（200）等晶体取向;对应TiN,TaN;ZrN三种扩散阻挡层,膜的电阻率在沉积态时分别达108,327和478μΩ·cm,退火后降至正常的数个μΩ·cm;扩散阻挡层亦可明显降低膜的残余应力,无扩散阻挡层时膜的退火应力达475MPa,有ZrN扩散阻挡层后退火应力降至149MPa.     

喷涂距离对热障涂层拉伸强度的影响

用等离子喷涂方法，在不同的喷涂距离（d）下制备出ZrO2陶瓷涂层，通过涂层的拉伸实验、X射线衍射和扫描电镜分析，研究了喷涂距离对涂层拉伸强度（σ）的影响规律。结果表明：d=70、80mm时，σ较高，最高可达9．14MPa；d〈70mm时，粘接层的氧化明显加剧，热生长氧化物的量明显增加，降低了ZrO2涂层与粘接层之间的结合强度，导致σ下降；d〉80mm时，随着喷涂粒子的速度降低，撞击到喷涂表面后不能完全铺展，导致σ下降。