湿法磷酸选择性除杂制工业级磷酸二氢铵

以湿法磷酸为原料, 通过氟化钠选择性沉淀金属离子, 使其以NaMgAl（F, OH）₆·H₂O和XMgAlF₆（X=Na ⁺、K ⁺、NH₄ ⁺）非含磷沉淀析出, 再通氨中和制得工业级磷酸二氢铵。分析了氟化钠加入量对杂质脱除（Na、K、Al、Mg、Fe和Ca等金属阳离子）及液相氟残留的影响, 结果表明氟化钠与磷酸质量比（m_NaF/m）为2.5%时, 效果较好, 此条件下制得的磷酸二氢铵纯度和五氧化二磷收率分别达到98.53%和86.2%。     

等速升温流态化下CaO/生物质焦的SO2/NO联合脱除特性

燃煤锅炉污染物超低排放标准对电厂脱硫和脱硝系统提出了更高的要求。CaO作为脱硫剂可以实现循环流化床锅炉烟气中SO₂的高效脱除,焦炭作为还原剂直接还原NO,同时CaO的存在对焦炭还原NO起催化作用,可以实现燃煤烟气中SO₂/NO的联合脱除。为了探究连续温度变化对CaO/生物质焦联合脱硫脱硝性能的影响,在钙循环捕集CO₂技术背景下,研究了等速升温流态化下CaO/生物质焦的SO₂/NO联合脱除特性。探究了烟气中O₂和CO₂对CaO/椰壳焦脱除SO₂/NO的影响。结果表明,O₂通过对椰壳焦表面碳原子的活化作用降低了异相还原NO温度,在300~950℃等速升温过程中CaO/椰壳焦的NO脱除效率逐渐增加,780℃以上能实现100%脱硝。O₂也提高了CaO/椰壳焦的脱硫效率。CO₂与CaO的碳酸化反应以及与椰壳焦的气化反应对同时脱除SO₂/NO有明显抑制作用。O₂和CO₂共同作用下,在500~800℃内CaO/椰壳焦的脱硝效率随温度升高而增加,脱硫效率先降低后升高。NO促进了CaO/椰壳焦脱除SO₂,而SO₂对脱硝有抑制作用。800℃时CaO/椰壳焦同时脱除SO₂和NO的效率分别为97.7%和93.9%。     

RH精炼真空度对超低碳钢夹杂物去除的影响

 大尺寸非金属夹杂物是引起超低碳钢冷轧钢板表面线状缺陷的重要原因。以IF钢为例,铸坯中大尺寸夹杂物主要有3类,即结晶器保护渣卷入后被凝固坯壳捕获;连铸过程中钢水二次氧化产生且未上浮去除的;钢液中未充分去除的夹杂物在浸入式水口处粘连、堵塞,后续堵塞物脱落被凝固坯壳捕获。钢液一次脱氧生成的夹杂物中,不低于100 μm的夹杂物在RH处理过程中较容易去除,100 μm以下的夹杂物受钢液的流动影响较大,特别是不超过20 μm的夹杂物由于其上浮时间长、钢液流动的跟随性好,去除难度较大。RH是超低碳钢最重要的精炼设备,也是夹杂物去除的关键环节,研究RH去除20 μm夹杂物的新技术具有重要的意义。研究了RH脱碳结束加铝后真空度对夹杂物去除的影响,创新性提出了低真空度去除不超过20 μm夹杂物的新技术。研究结果表明,与高真空度处理工艺(常规工艺)相比,低真空度(压力5 kPa)处理的钢液中夹杂物数量降低更显著,中间包钢液总氧质量分数平均降低0.000 2%,钢液增氮水平相当。冷轧钢板因炼钢原因导致的线状缺陷降级率比常规工艺降低了29%。夹杂物在钢液中的跟随性理论分析表明,低真空度处理工艺下RH内钢液循环流量和钢液流速减小,降低了RH处理过程中夹杂物随钢液的跟随性,提高了不超过20 μm夹杂物的去除效率,有效改善了水口堵塞程度、提高了轧板表面质量。     

高温熔融-电感耦合等离子体原子发射光谱法测定含铁尘泥中5种有害元素

准确、快速地测定含铁尘泥中有害元素,对含铁尘泥节能降废项目研究及综合利用有着重要的指导意义。实验针对含铁尘泥试样因含碳量高,导致常规酸溶解方法如果不增加除碳步骤则很难完全分解试样的问题,采用高温熔融法将试样制成熔融液后倾倒于稀酸中溶解的方法,解决了碳含量高难溶解的问题。采用四硼酸锂-碳酸锂混合熔剂在高温下将试样熔融,熔融液高温倾倒于稀酸中制成澄清溶液,由于骤冷,试样炸裂成微小玻璃珠,无迸溅,操作简单,使得后续溶解过程快速完成,从而建立了电感耦合等离子体原子发射光谱(ICP-AES)测定P、Pb、K、Na、Zn共5种有害元素的方法。按照实验方法测定含铁尘泥中P、Pb、K、Na、Zn,测定值的相对标准偏差(RSD,n=9)在1.4%～5.7%之间,加标回收率在96%～110%之间。研究结果表明方法能够满足含铁尘泥样品中5种元素的定量分析要求。     

Fabrication of composite wire of lead coated on glass fiber by extrusion

1　INTRODUCTIONCoatingglassfiberwithleadproducesakindofnewcontinuouscomposite ,whichcanfindwideap plicationsinmanydifferentfields ,especiallyinthebatteryoftheEVsandHEVsthathasalreadybecomethemostimportantgoalinmostcountries[13] .Withakindofspecialtechnologythiskindofnewcompos itewirecanbeusedtoproducegridsofnewleadacidbatterythatisveryusefultotheEVsandHEVs .Thiskindofnewleadacidbatteryhasmanyadvan tages ,suchashigherspecificenergy ,lessinnerresis tance ,morequicklychargingcapabilityand…     

Microstructure and properties of cutting magnesium-brass containing no lead

1 INTRODUCTIONLead-brass has excellent cutting ability , me-chanical and physical properties and is one of themost widely used copper alloys . The occupationratio of brass tube to all kinds of tubes reaches90 % in developed countries . The cutting lead-brass is a dual-phase brass and fine lead particlesdistribute dispersivelyin grains and on grain boun-ries . Theleadin wasted brass can easily beleachedand dissolvedinto soil .If the wasted lead-brass isburned in air ,the lead will become p…     

THEORETICAL INVESTIGATION ON BY-ONLY-CURRENT ELECTROMAGNETIC SEPARATION OF INCLUSION FROM MOLTEN METALS

The electromagnetic field under applied AC and DC current in round and rectangular pipe was systematically investigated, then a concept of "equivalent current density" was proposed for evaluating the inhomogeneous electromagnetic pinch force, and the mono-component removal efficiency and the overall removal efficiency of inclusion were formulated. It is founded that flat pipe is superior to round pipe for the electromagnetic removal of inclusion, and DC current can get a higher removal efficiency than A C current due to absence of skin phenomenon. Under usual condition, a removal efficiency of 52% for 10μm inclusion or more than 92% for 20μm inclusion can be achieved by imposing a current density of 3×106A/m2 in a flat pipe.     

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Silicon is the primary semiconductor material used to fabricate microchips. A series of processes are required to manufacture high-quality silicon wafers. Surface grinding is one of the processes used to flatten wire-sawn wafers. A major issue in grinding of wire-sawn wafers is reduction and elimination of wire-sawing induced waviness. Results of finite element analysis have shown that soft-pad grinding is very effective in reducing the waviness. This paper presents an experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Wire-sawn wafers from a same silicon ingot were used for the study to ensure that these wafers have similar waviness. These wafers were ground using two different soft pads. As a comparison, some wafers were also ground on a rigid chuck. Effectiveness of soft-pad grinding in removing waviness has been clearly demonstrated.     

PBSZT系大功率压电陶瓷极化工艺的研究

为探索大功率低损耗压电陶瓷材料的最佳制备工艺,对改性锆钛酸铅压电陶瓷Pb0.9Ba0.05Sr0.05(Sn1/3Nb2/3)0.06(Zn1/3Nb2/3)0.06Ti0.44Zr0.44O3 0.5wt%MnO2 0.5wt%Sb2O3的极化工艺进行研究。结果表明,该体系的最佳极化电场为4Kv/mm,极化温度120℃左右,此时得到的陶瓷性能较佳。     

Lead recovery from aqueous environment by using porous carbon of citrus fruits waste: equilibrium,kinetics and thermodynamic studies

ABSTRACT

The mixture of citrus fruits (orange, grapefruit, mandarin, and lemon) wastes was utilized to obtain high surface area activated carbon (AC) by H₃PO₄ activation. The production conditions were optimized and the optimum conditions were determined. The optimal-activated carbon (CFWAC) was characterized by various physicochemical techniques. CFWAC was also used as a sorbent for Pb (II) ions from water. Batch experiments were performed to explore the adsorption capacity and mechanism. The Langmuir isotherm and pseudo-second-order kinetic model showed good fitness to the experimental data. The maximum Pb (II) adsorption capacity of CFWAC was found to be 163.93 mg/g.