关于我国的粮食标准

本文总结了我国粮食标准的历史，将历次我国小麦标准和小麦粉标准的技术指标，分别集中列表，并据以估计我国优质小麦标准的良好发展前景。     

工艺因素对金属封装外引线弯曲疲劳的影响

考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。     

溶胶-凝胶法制备HAP骨水泥材料的研究

文章对用溶胶－凝胶法（简称SOL－GEL）烧结制备HAP骨水泥材料的工艺条件进行了研究，并探索了HAP粉剂与柠檬酸水溶液构成和凝结体系的可行性，结果显示出该材料作为医用骨水泥材料的可能性。     

The microstructure of Cu films deposited by the self-ion assisted technique

The microstructures of Cu films deposited by the self-ion assisted, partially ionized beam (PIB) deposition technique under two different accelerating potentials, 0 KeV and 6 KeV, are compared. The 6 KeV film shows a bimodal (111) fiber and (100) fiber texture with an abundance of twin boundaries and a relatively large average grain size with a typical lognormal distribution. The 0 KeV film consists of small, mostly (111) oriented grains with islands of abnormally large (100) grains. The controlling factors for the abnormal growth of the (100) grains are discussed in relation to the observed microstructures, showing that all factors necessary for abnormal (100) growth are present in the films.     

Grain Growth Behavior of 5Cr21Mn9Ni4N Steel Micro-Alloyed by Rare Earth

Grain growth behavior of 5Cr21Mn9Ni4NRE steel was experimentally studied at various solid solution treatment temperatures and holding for different times. The experimental results show that the 5Cr21Mn9Ni4NRE steel has the feature of sharp austenite grain coarsening after solid solution treatment at the temperature above 1150 ℃. RE added in the steel has the benefit to restrain grain growth and increase grain growth activation energy.     

Effects of hot-carrier stress on high performance polycrystalline silicon thin film transistor with a single perpendicular grain boundary

This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower.     

高温和低张应力引起的非平衡晶界偏聚动力学(Ⅱ)--实验结果的动力学模拟

以文献[1]建立的张应力引起的非平衡晶界偏聚动力学方程模拟了Shinoda T等的磷在钢中的应力时效实验结果和Misra R D K的硫在钢中的应力时效实验结果，模拟结果与实验结果互相吻合。通过模拟发现，张应力使磷-空位复合体以及硫-空位复合体在钢中的扩散系数均增加3个数量级，且磷原子和硫原子的扩散系数分别降低3个和5个数量级。     

降低气体悬浮焙烧炉焙烧过程中Al_2O_3粒度破损的措施

为了降低气体悬浮焙烧炉焙烧过程中Al_2O_3粒度的破损,对气体悬浮焙烧炉焙烧过程中氧化铝粒度的影响因素进行了分析,提出了降低粒度破损的一些措施。     

影响铁精矿K2O、Na2O、SiO2含量的因素分析

用统计分析方法 ,分析了影响精矿K2 O、Na2 O、SiO2 含量的因素 ,并根据分析结论提出了对生产工艺进行定向控制的条件     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.