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961.
The tube-fin contact status is an important factor influencing both thermal resistance and service life of the tube-fin heat exchanger. Tube expansion process brings forming defects of gaps at the tube-fin interfaces. And elimination of this forming defect is proved to be difficult. This paper presents a novel method in improving the tube-fin contact status of heat exchanger. From simulation results, distribution of the contact pressure along the tube-fin interface can be obtained. Then, an optimization process integrated with FE simulation is established for the sectional profile of the fin collar. The fin collar is represented with spline curves. Results show that after the optimization, the gap at the tube-fin interfaces is basically eliminated and the tube-fin contact status is significantly improved. Furthermore, flanging process for the optimized sectional shape of the fin collar is discussed. 相似文献
962.
Abstract In this note, a simple model of a circular cavity with two arcs rotated in opposite directions on the boundary is employed to demonstrate flow patterns of recirculation. A particular streamline “cutting” the domain into two separating eddies is formed as a circular arc. When the rotating angular speed of the arc is proportional to the length of the arc, the streamline degenerates to a straight line. 相似文献
963.
王妍娜 《吉林化工学院学报》2011,(9):46-48
在石油化工设备压力容器制造中,对于分瓣成形封头的质量控制关键是封头展开下料毛坯尺寸展开计算和冲压成形环节,文中对大直径球形封头冲压展开下料尺寸计算并加以阐述. 相似文献
964.
《应用陶瓷进展》2013,112(7):422-426
Thermal expansion, electrical conductivity, hardness and friction property of Mn3ZnN, which had been doped with Sn, Ag or Ni and sintered at 1223?K, were measured. X-ray diffraction analyses show that these compounds have a cubic antiperovskite Mn3CuN-type structure and negative thermal expansion (NTE). The width of NTE operation temperature (ΔT) and the coefficient of thermal expansion are different when Mn3ZnN was doped with different element. A giant NTE coefficient of ?81.00?×?10?6?K?1 is obtained from Mn3Zn0.5Ag0.5N while ΔT is 18?K. A broad ΔT of 60?K is obtained from Mn3Zn0.5Sn0.5N with thermal expansion coefficient of ?19.05?×?10?6?K?1. The results show that Mn3Zn0.5 A0.5N (A?=?Sn, Ag, Ni) has good electrical conductivity. The electrical conductivity of Mn3Zn0.5Ag0.5N is the largest among these compounds as 2.45?×?103?S?cm?1. The Vickers hardness of these compounds is more than 350?HV. The friction coefficients of Mn3Zn0.5Ag0.5N, Mn3Zn0.5Ni0.5N and Mn3Zn0.5Sn0.5N are 0.5318, 0.4554 and 0.2336, respectively. 相似文献
965.
Cavity walls are often proposed in the building envelope design as a solution for improving the thermal comfort of the occupants and reducing the adverse condensation effects on the building fabric. Although the behaviour of a non‐ventilated cavity wall is well‐known, more studies are required when cavity ventilation is allowed. In order to consistently predict the thermal behaviour of a naturally ventilated cavity wall, a convective model based on the integral equations of motion and enthalpy was developed and applied in the present study. The model is presented as a combination of two limiting cases of a steady laminar flow into the channel gap: fully developed flow and boundary layer flow. Conduction effects across the system are also included through a proper limiting case and then combined with the convective model. In addition a numerical CFD model was developed that provides solution for free convective flow configurations between two parallel conducting vertical walls. For comparison purposes, some test cases were simulated with the two models and a general good agreement was found between results. Finally, the integral model was applied to assess the thermal performance of a ventilated cavity wall for winter and summer conditions. Copyright © 2009 John Wiley & Sons, Ltd. 相似文献
966.
Rubber‐toughened polyamide‐6 with a low thermal expansion coefficient: effect of preferential distribution of rubber and inorganic filler
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Guozhang Wu Kun Zhang Kiyoji Takagi Hironari Sano Hiroshi Yui 《Polymer International》2016,65(1):102-108
The effects of morphological changes on the thermal expansion, toughness and heat resistance of polyamide‐6 (PA)/styrene–ethylene–butylene–styrene (SEBS)/polyphenylene ether (PPE) blends were investigated. Compared with the typical ‘sea (PA matrix)–island (PPE domain)–lake (SEBS in PPE domain)’ morphology, an injection‐molded ternary blend with a preferential distribution of SEBS component at the interface between PA and PPE exhibited a low coefficient of linear thermal expansion (CLTE) in the flow direction. This low CLTE was ascribed to the deformation of SEBS and PA into a co‐continuous microlayer network structure during injection molding. Consequently, the expansion preferentially occurred towards the thickness direction. Further CLTE reduction either by a change in PA viscosity or by the selective location of an inorganic filler was examined, and its influences on impact strength and heat resistance are discussed based on transmission electron microscopy observations. © 2015 Society of Chemical Industry 相似文献
967.
A novel wafer temperature control system using direct expansion cycles is developed to improve etching performance. This system enables rapid temperature control of a wafer with low power consumption. In a previous report, we confirmed that the etching rate and mask selectivity of high-aspect-ratio contact etching could be increased by around 6% and 14%, respectively, by controlling the temperature of the wafer during the etching process. In this study, an advanced wafer temperature control system that realizes not only rapid response but also uniform wafer cooling is developed, and a new etching process that controls O2 gas flow rate as well as wafer temperature during etching is evaluated to decrease the etching rate depression of high-aspect-ratio contact etching. As a result, a rate of wafer temperature change of 1 °C/s and uniformity of ±0.7% with a coefficient of performance exceeding 3 is achieved over a wafer with a diameter of 300 mm during the etching process. Furthermore, etching rate depression in C4F6/Ar/O2 plasma is decreased from 14.4% to 7.8% for a sample with a diameter of 100 nm and aspect ratio of 30. 相似文献
968.
J. Pinho-da-Cruz J.A. Oliveira F. Teixeira-Dias 《Computational Materials Science》2009,45(4):1073-1080
The asymptotic expansion homogenisation method is an excellent methodology to model physical phenomena on media with periodic microstructure and a useful technique to study the mechanical behaviour of structural components built with composite materials. In the first part of this work the authors present a detailed form of the mathematical formulation of the asymptotic expansion homogenisation for linear elasticity problems, as well the explicit mathematical equations that characterise the microstructural stress and strain fields associated with a given macrostructural equilibrium state – the localisation procedure. From this mathematical basis, the authors also present the numerical equations resulting from the finite element modelling of the asymptotic expansion homogenisation method in linear elasticity. 相似文献
969.
J.A. Oliveira J. Pinho-da-Cruz F. Teixeira-Dias 《Computational Materials Science》2009,45(4):1081-1096
The asymptotic expansion homogenisation (AEH) method can be used to solve problems involving physical phenomena on continuous media with periodic microstructures. In particular, the AEH is a useful technique to study of the behaviour of structural components built with composite materials. The main advantages of this approach lie on the fact that (i) it allows a significant reduction of the problem size and (ii) it has the capability to characterise stress and deformation microfields. In fact, specific equations can be developed to define these fields, in a process designated by localisation and not found on typical homogenisation methods. In the AEH methodology, overall material properties can be derived from the mechanical behaviour of selected periodic microscale representative volumes (also known as representative unit-cells, RUC). Nevertheless, unit-cell based modelling requires the control of some parameters, such as reinforcement volume fraction, geometry and distribution within the matrix material. The need for variety and flexibility leads to the development of automatic geometry generation algorithms. Additionally, the unstructured finite element meshes required by these RUC are usually non-periodic and involve the control of specific periodic boundary conditions. This work presents some numerical procedures developed in order to support finite element AEH implementations, rendering them more efficient and less user-dependent. The authors also present a numerical study of the influence of the reinforcement volume fraction on the overall material properties for a metal matrix composite (MMC) reinforced with spherical ceramic particles. A general multiscale application is shown, with both the homogenisation and localisation procedures. 相似文献
970.
The thermal expansion behaviors of α-CL-20 · 1/2H2O, anhydrous α-, β-, ε-, and γ-CL-20 crystals have been investigated by means of variable-temperature X-ray powder diffraction (XRD) together with Rietveld refinement. The results show that hexanitrohexaazaisowurtane (CL-20) with four polymorphs exhibits linear thermal expansion. The ε phase performs approximately isotropic expansion in the temperature range of 30 to 130°C, but α, β, and γ phases exhibit anisotropic expansion in the temperature ranges of 30 to 130°C, 30 to 120°C, and 30 to 180°C, respectively. The different expansion behaviors are due to the different structures of the four polymorphs. The different thermal expansion behaviors of α-CL-20 · 1/2H2O and anhydrous α are revealed in this work. The a-axis expansion of α-CL-20 · 1/2H2O exhibits a switch from positive thermal expansion (PTE) to negative thermal expansion (NTE) at 90°C, whereas the a-axis of anhydrous α is resilient to PTE. The cause is the loss of the structural water. Moreover, it is easily found that the b-axis of the γ phase shows a constriction that may be attributed to the distortion of the six-membered ring. 相似文献