The effect of surface roughness on the vibration behavior of AFM piezoelectric MC in the vicinity of sample surface in air environment based on MCS theory

Recent developments in the field of piezoelectric materials have led to the increasing use of piezoelectric materials in a variety of Atomic Force Microscopy (AFM). Utilizing piezoelectric layer as a sensor and actuator not only reduces the size of microscope but also enhances the quality of surface topography in Micro and Nano scales. In the current study, the effect of surface roughnesson the vibration behavior of AFM piezoelectric micro cantilever (MC) has been investigated in Micro and Nano scales according to the types of the surface roughness. Furthermore, the micro cantilever modelling has been schemed based on the Modified Couple Stress (MCS) theoryin order to model the vibration amplitude of AFM piezoelectric MC that precisely indicates the measured surface roughness. Besides, according to the various modelling of surface roughness, the effect of roughness radius on the minimum and maximum amplitude of Piezoelectric MC has been studied based on the geometry of roughness in air environment. In this environment, the effect of environmental forces including van der Waals, Capillary and contact forces on the vibration amplitude of MC forms the basis of surface topography which has, also, been studied in this article. Moreover, the present study intends to investigate the effect of surface roughness on the vibrating amplitude of MC in both the Tapping and Non-Contact Modes.     

A study of surface topography, friction and lubricants in metalforming

In this paper are presented the results of investigations concerning the relation between friction behaviour and surface topography using various lubricants and initial workpiece surface conditions in ring upsetting and rod extrusion processes. The tests were carried out using either a liquid lubricant or under clean dry conditions. Two types of workpiece surfaces, random and directional, were prepared by either shotblasting, or EDM or turning to different levels of surface finish. Not only has the friction effect of lubricant and initial surface been studied, but also the surface topography of the finished products has been examined in detail, to obtain a better understanding of the mechanism of lubrication and surface interaction. It was found that, for random surfaces, smoother ones could retain more lubricant and decrease friction resistance. The experimentation also demonstrated that turned surfaces were effective in reducing friction, but the final surface finish of the workpiece was not as good as that from random surfaces.     

Topography of the flank wear surface

In many applications, topography represents the main external features of a surface. This paper describes the topography of the flank wear surface and also presents the relationship between the maximum flank wear and the topography parameters (roughness parameters) of the flank wear surface during the turning operation. A modern CNC lathe machine (Okuma LH35-N) was used for the machine turning operation. Three-dimensional surface roughness parameters of the flank wear surface were measured by a surface texture instrument (from Talysurf series) using surface topography software (Talymap). Based on the resulting experimental data, it is found that as the flank wear increases, the roughness parameters (sR_a, sR_q, and sR_t) on the flank surface increase significantly. The greater the roughness value of the flank wear surface, the higher the friction of the tool on the workpiece and the greater the heat generation that will occur, thus ultimately causing tool failure. On the other hand, positive skewness (sR_sk) indicates the presence of a small number of spikes on the flank surface of the cutting tool, which could quickly wear off during the machining process.     

3D surface topography assessment of the effect of different electrolytes during electrochemical polishing of EDM surfaces

In many countries the most common polishing practice in die making is to hand polish the part as a finishing operation after the electro discharge machining process (EDM). The usual polishing abrasives are silicon carbide paper and diamond paste of different grit sizes.However, during the last decade researchers especially in Japan and the USA have tried to combine EDM and electrochemical machining (ECM) in one machine so as to use the positive aspects of each individual process. The ECM process uses high density, typically 50 A/cm², and also a pulse current with a servo-controlled electrode. These investigators have mostly used sodium nitrate solutions (of different concentrations) as the electrolyte.This paper deals with an experiment that was undertaken in order to assess the effect of four different electrolytes in an electrochemical polishing process (ECP) on the surface topography of EDM surfaces. The primary set of 3D surface parameters was used as a basis to characterise the surface produced by the combined processes in different electrolytic media.     

Modelling and analysis of abrasive water jet cut surface topography

In this paper, a new approach proposed for modelling the three-dimensional (3D) topography produced on abrasive water jet (AWJ) cut surface is presented. It makes use of the trajectory of jet, predicted from the theory of ballistics and Bitter’s theory of erosion for material removal, for numerically simulating the cutting front. The 2D topography at different depths of the cut surface is generated by considering the trajectories on the cutting front and the abrasive particles impacting the walls of cut surface randomly. For realistic generation of topography on cut surfaces, several instantaneous profiles generated in each region of cut are superimposed to obtain an effective profile. The nature of effective profiles thus predicted is analyzed and validated using power spectral density analysis. The effective profiles predicted at different depths are in turn used to generate the 3D topography of AWJ cut surface. Results obtained with the proposed model are validated with the experimental results.     

Dynamics of boring processes: Part III-time domain modeling

This article presents a mathematical model and a computational algorithm for the time domain solution of boring process dynamics. The model is developed in a modular form; it includes a workpiece geometry and surface topography module, a kinamatics and tool position module, a dynamic chip load module, a dynamic cutting force prediction module and a structural dynamics module. The time domain model takes cutting process parameters, tool and workpiece geometries and modal parameters of the structure as inputs. It predicts instantanous cutting forces and vibrations along the machining time, and machined workpiece topography as outputs. Some of the simulated and experimental results for various cutting conditions are presented and compared for validation purposes.     

FEM analysis of the vibrational motion of oblique piezoelectric microcantilever in the vicinity of a sample surface in liquid

This article examines an oblique Microcantilever (MC) with an extended piezoelectric layer in liquid. The study of hydrodynamic force in MC which has been floated in viscous fluid is considered as paramount importance. To model the Vibrational motion, the Hamilton's principle has been used. For this purpose, the Vibrational motion equation has been modeled by considering the continuous beam based on the Euler–Bernoulli beam theory in liquid. Furthermore, using the Galerkin method and the Newmark algorithm, the differential equations of the MC has been solved. In this modeling, the inter-atomic forces between the MC tip and the sample surface have been considered in addition to the hydrodynamic and squeeze forces. The simulation results illustrate a reduction in the sensitivity of the vibrational motion under the effect of the squeeze force during the angularization of the MC. Moreover, the results illustrate that by reducing the MC distance from the sample surface, the Vibration amplitude decreases due to the increase in the fluid squeeze force. At the end, it has been shown that the time delay in sample surface topography in liquid substantially decreases in comparison with the air.     

硫酸铜浓度及电流密度的变化对游离微珠辅助磨电铸铜的影响

目的 研究硫酸铜浓度及电流密度的变化对游离微珠辅助磨电铸铜电流效率和沉积层表面形貌、显微硬度的影响。方法 使用立式阴极回转电铸设备进行单因素电铸试验,在硫酸铜质量浓度分别为40、80、120 g/L的条件下,将电流密度由1 A/dm²增至4 A/dm²进行试验。使用库仑计测量记录流经试验回路的电荷量,使用精密电子天平称取铜沉积层的质量,使用扫描电子显微镜观察铜沉积层的表面微观形貌,使用显微硬度计测量铜沉积层的显微硬度。结果 硫酸铜质量浓度为40 g/L,电流密度由1 A/dm²提高到4 A/dm²时,沉积层的表面形貌逐渐趋于光滑平整,电流效率随着电流密度的增加先提高、后降低,在电流密度为2 A/dm²时增至最高95.4%,在电流密度为4 A/dm²时下降至最低92.7%。电流密度由1 A/dm²提高到3 A/dm²时,显微硬度由120.3HV增至最高139.8HV。电流密度为4 A/dm²时,沉积层的表面粗糙度Ra最低,为0.19 μm。硫酸铜质量浓度为80 g/L条件下,电流密度为4 A/dm²时的沉积层表面最为平整,沉积层的表面粗糙度较低,为0.62 μm。电流密度由1 A/dm²提高到4 A/dm²时,电流效率由94.1%增至最高97.2%,显微硬度由119.4HV增至最高146.3HV。硫酸铜质量浓度为120 g/L条件下,电流密度由1 A/dm²提高到4 A/dm²时,沉积层表面的毛刺逐渐变小,且数量也逐渐减少,电流效率由93.9%增至最高97.6%,显微硬度由117.3HV增至最高136.4HV。结论 在一定条件下提高电流密度或降低硫酸铜浓度,均可改善沉积层的表面形貌,提高沉积层的显微硬度。游离微珠的运动磨削既可以改善沉积层的表面形貌,也可以改善沉积层内部的晶粒组织结构,提高沉积层的显微硬度,但微珠的运动会磨削掉沉积层表面微量的铜,降低电铸铜的电流效率。     

铁路继电器触点表面形貌及失效机理分析

目的深入研究铁路继电器触点的失效机理。方法在直流条件下进行铁路继电器电寿命试验,自动识别静触点表面与动触点的接触区域。利用三维形貌扫描仪和扫描电镜扫描触点,选定平面基准面,计算触点表面粗糙度参数,分析触点表面形貌变化。对触点烧蚀后的表面进行元素分析,研究触点表面的微观组织结构和失效机理。结果 Sa/Sq的值小于0.8表示随机性较强的表面,Sa/Sq(静)=0.246Sa/Sq(动)=0.291,即继电器触点在额定运行后,表面凹凸形貌均具有很强的随机性,静触点表面的随机性明显强于动触点。分析继电器动、静触点起伏变化(Sp+Sv),静触点为109.786,远大于动触点26.08,表明静触点的起伏变化明显,幅度较大,动触点幅度变化较小,相对平坦。继电器表面基本以Ag和Cd元素为主,Cd含量变化平稳,在明显裂缝处含量极低。相对于动触点,静触点表面凹坑和龟裂状裂纹清晰可见,腐蚀严重。裂缝凹坑区域和凹坑边缘区域Ag和Cd的原子百分比约为2∶1,磨损颗粒区域Ag和Cd的原子百分比约为0.5∶1。相对平坦区域腐蚀程度很浅,Ag和Cd的原子百分比约为5∶1。触点阴极,即静触点表面,存在反应Cd+2OH~-→Cd(OH)_2+2e,部分Ag被磨损,附着在动触点凸起表面。另一部分Ag进行反应Ag++Cl-→Ag Cl,绝大多数Ag进行了Ag+O→Ag_2O反应。结论归纳出了表面形貌和失效之间的联系,动触点表面有微小颗粒沉积,表面高度变化区域性明显。静触点表面凹凸裂痕分界清晰,表面高度变化呈现横向规律性。触点在裂缝凹坑和凹坑边缘区域元素腐蚀情况相当,磨损颗粒区域存在一部分材料从阴极转移到阳极,相对平坦区域存在一部分材料从阳极转移到阴极。     

因瓦合金纳米抛光材料去除机理的分子动力学模拟∗

因瓦合金作为一种独特的低膨胀材料已广泛用于航空航天等高科技领域,但目前还鲜有对其超精密加工理论和技术的研究,而纳米抛光是因瓦合金超精密加工的一种重要手段。 针对纳米抛光过程中因瓦合金的材料去除机理,基于分子动力学模拟研究抛光速度对材料去除效率、亚表面损伤和抛光表面平整度的影响。 通过对磨屑、能量、抛光力、位错运动等方面的分析揭示因瓦合金的变形损伤机制。 研究结果表明:材料去除效率随着抛光速度将达到一个临界值,当抛光速度低于 100 m/ s 时,磨削热促使位错形核,亚表面损伤厚度增加;当抛光速度高于 100 m/ s 时,应变速率急剧增大导致位错运动受限,使得亚表面损伤厚度得以降低。 为实现因瓦合金高效率和低损伤加工机制提供理论依据和技术支持。