Electrical properties at p-ZnSe/metal interfaces

In order to prepare low resistance ohmic contacts to p-ZnSn by the “deposition and annealing (DA)” technique which has been extensively used for GaAs and Si-based devices, formation of a heavily doped layer by the p-ZnSe/metal reaction is required. For p-ZnSe/Ni contacts, Ni and Se reacted preferentially at the ZnSe/Ni interface upon annealing at temperatures higher than 250°C. However, capacitance-voltage measurements showed that the net acceptor concentration (N_A-N_D) close to the p-ZnSe/Ni interface was reduced upon the Ni/ZnSe reaction, resulting in high contact resistance. For p-ZnSe/Au contacts, neither Au/ZnSe reaction nor reduction of the acceptor concentration were observed after annealing at temperatures lower than 300°C. This indicates that although the metal/p-ZnSe reaction is mandatory to prepare a heavily doped layer, the reaction induced an increase in the compensation donors in the p-ZnSe substrate. In order to increase the acceptor concentration in the vicinity of the p-ZnSe/metal interface through diffusion from the contact materials, Li or O which was reported to play the role of an acceptor in ZnSe was deposited with a contact metal and annealed at elevated temperatures. Ni or Ag was selected as the contact metal, because these metals were expected to enhance Li or O doping by reacting with ZnSe. However, the current density-voltage characteristics of the Li(N)/Ni and Ag(O) contacts exhibited rectifying behavior, and the contact resistances increased with increasing annealing temperature. The present results indicated that, even though the acceptor concentration in the p-ZnSe substrate increased by diffusion of the dopants from the contact elements, an increment of the compensation donors was larger than that of the acceptors. The present experiments indicated that preparation of low resistance ohmic contacts by forming a heavily doped intermediate layer between p-ZnSe and metal is extremely difficult by the DA technique.     

α－Al_2O_3衬底上生长的GaN膜的光学性质

采用金属有机化学气相淀积（ＭＯＣＶＤ）方法生长了α－Ａｌ２Ｏ３衬底上外延的高质量的单晶ＧａＮ薄膜。Ｘ射线衍射光谱与喇曼散射光谱表征了ＧａＮ外延薄膜的单晶结构和单晶质量。透射光谱和光调制反射光谱定出了六角单晶ＧａＮ薄膜的直接带隙宽度和光学参数。     

Electron microscope studies of InxGav1−xAs/GaAs/Si grown by metalorganic chemical vapor deposition

The microstructure of In_xGa_1−xAs/GaAs (5 nm/5 nm, x < 0 to 1.0), as grown by a metalorganic chemical vapor deposition two-step growth technique on Si(100) at 450‡C, and subsequently annealed at 750‡C, is investigated using plan-view and cross-sectional transmission electron microscopy. The variations in resultant island morphology and strain as a function of the In content were examined through the comparison of the misfit dislocation arrays and moirés observed. The results are discussed in relation to the ways in which the island relaxation process changes for high In content.     

真空阴极弧离子镀类金刚石碳（DLC）膜的碳弧稳定性研究

选用氩气、氩气加氢气、氩气加乙炔等气体作为介质，石墨作为靶材进行真空阴极弧离子镀来制备类金刚石碳膜。石墨电弧有其独特的电弧特性曲线，不同气体介质对碳弧特性的影响不同，磁场的大小对电弧的稳定性有很大作用，碳弧下基片偏流随电弧电压的增加而减小，试验得到表面光滑的类金刚石碳（DLC）膜，对膜的表面进行了SEM分析。     

等离子体化学气相法沉积金刚石薄膜

本文介绍和评述了化学气相沉积法制备人造金刚石薄膜及其进展。重点评述了反应机理、发展历史、沉积方法、补底材料、检测手段。论述了有利于形成立方晶系金刚石材料的沉积条件。     

应用焊道长度控制线能量

运用ＨｅｒｂｓｔＦＷ公式原理对国产碱性条件进行了大量试验，建立了焊接线能量（Ｅ），焊条熔化长度（ｌＥ），焊道长度（ｌＲ）的关系式：Ｅ＝８０８Ｄ１．８ｌＥ／ｌＲ。并应用线算图和ＳＨ－ＣＣＴ图对该式施焊结果验证，热影响区的金相组织，硬度基本一致。因此，可以应用焊道长度校核与控制线能量。     

CVD反应器传输过程的三维数学模型

提出了一个同时表示CVD过程的气体流动、温度分布和物质传输的三维数学模型。应用这个模型预报了在含有SiCl_4的氢气流中沉积出Si的锥台式反应器中的速度场、温度场和浓度场。所得的结果有助于增进对这类反应器中的传输过程的认识,模型亦可用于设计参数的最优化,诸如入口流量,锥台倾角等。     

钢表面化学气相沉积TiC晶体的择优取向

本文用化学气相沉积(CVD)法,以TiCl_4-CH_4-H_2为原料气体,在不锈钢表面获得了致密的TiC膜.研究了TiC的成膜速度、表面形貌和晶体择优取向与沉积条什的关系.结果表明,沉积温度T_(dep),碳钛比CH_4/TiCl_4强烈地影响了TiC的成膜速度、表面形貌和晶体择优取向.CH_4/TiCl_4低时,TiC晶体的择优取向为(220):而CH_4/TiCl_4高时,TiC晶体的择优取向为(200).TiC晶体的择优取向主要取决于气氛中活性碳的平衡浓度。     

PREPARATION OF TiN FILMS BY N_2 ASSISTED Xe~+ ION BEAM ENHANCED DEPOSITION AND THEIR MECHANICAL PROPERTIES

A new method for preparation of hard TiN films has been developed by using electronbeam evaporation-deposition of Ti and bombardment with 40 keV Xe~+ ion beam ina N_2 gas environment.The synthesized TiN films were superior to PVD and CVDones in respects of improved adhesion to substrate and low preparing temperature.Theyexhibited good wear resistance and high hardness up to 2200 kg/mm~2.Some industrialapplications have been reported.     

化学气相沉积法制备碳化铬薄膜的研究

以三（2,2,6,6-四甲基-3,5-庚二酮）化铬为前驱体,采用化学气相沉积（CVD）法在氧化铝（Al₂O₃）陶瓷基板上制备碳化铬（Cr₃C₂）薄膜,其中沉积温度为723 K至923 K,沉积时间为1 200 s。研究了不同沉积温度对Cr₃C₂薄膜的相组成、择优取向、宏观表面、微观结构及电学性能的影响。结果表明,在723 K至923 K下制备得到具有高度（130）择优取向的Cr₃C₂薄膜。随着沉积温度的升高,Cr₃C₂薄膜表面先由光滑变粗糙,后逐渐变光滑;薄膜晶粒呈椭球型生长;薄膜的厚度先增加后减小,从而导致电阻先减小后增大。在798 K时制备得到厚度最大且电阻最小的（130）择优取向的最佳Cr₃C₂薄膜。同时,在实验条件下Cr₃C₂薄膜表面存在少量的碳和Cr₂O₃。