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991.
Role of block copolymer on the coarsening of morphology in polymer blend: Effect of micelles
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The reactive compatibilization of polystyrene/ethylene‐α‐octene copolymer (PS/POE) blend via Friedel–Crafts alkylation reaction was investigated by rheology and electron microscope. It was found that the graft copolymer formed from interfacial reaction reduced the domain size and decreased the coarsening rate of morphology. The reduction of the interfacial tension is very limited according to the mean field theory even assuming that all block copolymer stays on the interface. With the help of self‐consistent field theory and rheological constitutive models, the distribution of graft copolymer was successfully estimated. It was found that large amount of copolymer had detached from the interfaces and formed micelles in the matrix. Both the block copolymer micelles in matrix and the block copolymers at the interface contribute to the suppression of coarsening in polymer blend, but play their roles at different stages of droplet coalescence. In droplet morphology, the micelles mainly hinder the approaching of droplets. © 2014 American Institute of Chemical Engineers AIChE J, 61: 285–295, 2015 相似文献
992.
Comparative study on electrical properties of copper nanowire/polypropylene and carbon nanotube/polypropylene composites
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Nanocomposites using copper nanowires (CuNWs) or carbon nanotubes (CNTs) as fillers with polypropylene (PP) as matrix were prepared by miscible solution mixing and precipitation method. Comparative studies on electrical conductivity and electromagnetic interference shielding properties were reported. On the conductivity curve, a plateau was found for both CuNW/PP composite and CNT/PP composite. The plateaus are located at a different concentration range for each composite type: for CuNW/PP composite, it is between 0.8 and 1.7 vol %, while for CNT/PP composite the plateau occurs in a narrower range between 0.4 and 0.6 vol %. The shielding effectiveness (SE) increases with increased concentration of fillers. CNT/PP composite has higher SE at concentrations less than 2 vol %; the two curves cross near 10 dB at this point and at concentrations higher than 2 vol %, CuNW/PP composite has higher SE. © 2014 American Institute of Chemical Engineers AIChE J, 61: 296–303, 2015 相似文献
993.
Morphology of polystyrene/poly(methyl methacrylate) blends: Effects of carbon nanotubes aspect ratio and surface modification
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Jiaxi Guo Nicholas Briggs Steven Crossley Brian P. Grady 《American Institute of Chemical Engineers》2015,61(10):3500-3510
Multiwalled carbon nanotubes (MWCNTs) with aspect ratios (ARs) ranging from 94 to 474 were incorporated into polystyrene (PS)/poly(methyl methacrylate) blends using solution mixing and melt mixing. Also, two functionalized MWCNTs were prepared from the nanotubes having AR 94: one was oxidized by nitric acid while the other was further modified with amine‐terminated PS attached to carboxyl groups to form amides. The two functionalized MWCNTs (1 wt %) were used to show that which phase the carbon nanotubes (CNTs) were located in could be controlled with nanotube surface chemistry. When nanotubes were confined to the minor phase, the size of the minor domain first decreased with adding low AR CNT as expected due to the increased viscosity of the minor phase. However, at higher ARs, the size increased beyond the size for the minor domain with no nanotubes, and at high enough AR, the shape of the minor domain changed from spherical to an elongated irregular shape. © 2015 American Institute of Chemical Engineers AIChE J, 61: 3500–3510, 2015 相似文献
994.
Jing Guo Amanda L. Baker Hanzheng Guo Michael Lanagan Clive A. Randall 《Journal of the American Ceramic Society》2017,100(2):669-677
Cold sintering process (CSP) is an extremely low‐temperature sintering process (room temperature to ~200°C) that uses aqueous‐based solutions as transient solvents to aid densification by a nonequilibrium dissolution‐precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic‐polymer composites. Some dielectric materials, namely Li2MoO4, Na2Mo2O7, K2Mo2O7, and (LiBi)0.5MoO4 ceramics, and also (1?x)Li2MoO4?xPTFE and (1?x)(LiBi)0.5MoO4?xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88%‐95%) and good microwave dielectric properties (permittivity, 5.6‐37.1; Q × f, 1700‐30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co‐fired ceramic technology, namely CSCC. Li2MoO4?Ag multilayer co‐fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy‐saving strategy for the ceramic packaging and microwave device development. 相似文献
995.
996.
Two copolyimides, LARC-STPI and STPI-LARC-2, with flexible backbones were prepared and characterized as adhesives. The processability and adhesive properties were compared to those of a commercially available form of LARC-TPI.
Lap shear specimens were fabricated using adhesive tape prepared from each of the three polymers. Lap shear tests were performed at room temperature, 177°C, and 204°C before and after exposure to water-boil and to thermal aging at 204°C for up to 1000 hours.
The three adhesive systems possess exceptional lap shear strengths at room temperature and elevated temperatures both before and after thermal exposure. LARC-STPI, because of its high glass transition temperature provided high lap shear strengths up to 260°C. After water-boil, LARC-TPI exhibited the highest lap shear strengths at room temperature and 177°C, whereas the LARC-STPI retained a higher percentage of its original strength when tested at 204°C [68% versus 50% (STPI-LARC-2) and 40% (LARC-TPI)].
These flexible thermoplastic copolyimides show considerable potential as adhesives based on this study and because of the ease of preparation with low cost, commercially available materials. 相似文献
Lap shear specimens were fabricated using adhesive tape prepared from each of the three polymers. Lap shear tests were performed at room temperature, 177°C, and 204°C before and after exposure to water-boil and to thermal aging at 204°C for up to 1000 hours.
The three adhesive systems possess exceptional lap shear strengths at room temperature and elevated temperatures both before and after thermal exposure. LARC-STPI, because of its high glass transition temperature provided high lap shear strengths up to 260°C. After water-boil, LARC-TPI exhibited the highest lap shear strengths at room temperature and 177°C, whereas the LARC-STPI retained a higher percentage of its original strength when tested at 204°C [68% versus 50% (STPI-LARC-2) and 40% (LARC-TPI)].
These flexible thermoplastic copolyimides show considerable potential as adhesives based on this study and because of the ease of preparation with low cost, commercially available materials. 相似文献
997.
综述了合成阳离子丙烯酸系聚合物乳液的乳化剂、引发剂及单体体系和聚合方法,介绍了阳离子乳液的性质和应用。 相似文献
998.
聚合物系的脱挥发分设备 总被引:5,自引:1,他引:5
评述了近20年来国内外在聚合物制造过程中脱挥发分(简称脱挥)设备的应用和研究概况。重点讨论了塔式薄膜蒸发脱挥器,该类脱挥器具有结构简单,成本低,处理量大等优点。为了使塔式列管式脱挥器中的蒸发器内有较理想的流体分布,介绍了加设在蒸发器内的液体分布器的结构。 相似文献
999.
在小试和模试验中,依据加帽技术的构想,采用高分子设计,将少量丁二烯插入到聚苯乙烯链段中,以此来制备改性丁苯嵌段共聚物。结果表明,当Bdr插入量为(0.05%-1.50%(质量,占Bd总用量)时,改性SBS的扯断永久变形可降低到20-30%,与国外同类产品的相当;改性前后SBS的分子结构相同,物理机械性能相似,该项技术已获得中国专利。 相似文献
1000.
将智能层附于足够大的矩形薄板表面,通过不同的弯曲试验构造出多种表面应变状态,基于三种工况下的试验结果,建立智能层电阻变化与平面二维应变状态之间的映射关系,该关系表明纵向应变对智能层的电阻变化的影响占主导地位。在此基础上对其它工况下智能层的电阻变化率进行了预测,其结果与实验结果具有较好的一致性。 相似文献