Surface-tension measurements of the eutectic alloy (Ag-Sn 96.2 at.%) with Cu additions

The maximum bubble-pressure method has been used to measure the surface tension and density of liquid alloys (Ag-Sn)_eut + Cu (X_Cu = 0.005, 0.020, 0.0375, and 0.065 (mole fraction)). The surface tension and density measurements were curried out in the temperature ranges of 262–942°C and 264–937°C, respectively. The linear dependencies of surface tensions and densities on temperature were observed, and they were described by straight-line equations. It has been found that the additions of Cu to the Ag-Sn eutectic alloy increase the surface tension. Experimental data of the surface tension were compared with those from modeling based on Butler’s method, using the optimized-thermodynamic parameters from the literature, and a slight tendency contrary to the experimental results was observed.     

包层变化型光纤光栅传输特性研究

运用传输矩阵理论分析了一种包层半径变化的光栅结构。对包层形状变化取不同形式的光栅传输特性进行了模拟。研究发现,包层半径沿z轴非单调变化将比单调变化时具有更好的方波形反射谱;当半径变化因子g取0．1,包层形状为sin型及外加应力F为1．0N时,可以得到带宽为0．9nm,中心波长为1．55685μm的方波形反射谱。对光栅施加外力时的应变响应进行了研究,发现其对应力也是非常敏感的。     

激光在测定液体表面张力系数及折射率中的应用

实验发现 :激光束照射在振动的液面上 ,表面波对入射光可产生衍射 ;用扩束后的激光束入射在插入细针的液面区 ,其反射光场中心分布近似为一暗椭圆形。以上两种实验现象机理 ,可用于液体表面张力系数的测定。激光经小孔透射样品池中的液体介质 ,在液体上表面发生遮光效应 ,根据其机理 ,建立了一种测量液体折射率的新方法     

新型稀土6063铝材热加工性能研究

采用高温拉伸、高温压缩试验方法,对新型稀土6063铝合金半连续铸造锭坯材进行热变形加工性能研究。通过拉伸变形抗力、伸长率、压缩变形量、冲击速度的测量比较,以及两类试验试样的形貌、形态观察对比,确定新型稀土6063铝合金半连续铸造锭坯材最佳热挤压加工温度区间为450~480℃;实施大变形、高速挤压与在线连续淬火工艺,最佳热挤压温度区间应控制在430~480℃。     

Studies on nucleation kinetics of InxGa1−xN/GaN heterostructures

Nucleation kinetics during the growth of In_xGa_1−xN on a GaN substrate have been studied. The behavior of nonequilibrium between the In_xGa_1−xN and the GaN substrate has been analyzed, and hence, the expression derived for the stress-induced supercooling/superheating has been numerically evaluated. The maximum amount of stress-induced supercooling is found to be 1.017 K at x=0.12. These values are incorporated in the classical heterogeneous nucleation theory. Using the regular solution model, the interfacial tension between the nucleus and substrate and, hence, the interfacial tension between nucleus and mother phase and thermodynamical potential of the compounds have been calculated. The amount of driving force available for the nucleation has been determined for different compositions and degrees of supercooling. It has been shown that the value of the interaction parameter of InN-GaN plays a dominant role in nucleation and growth kinetics of In_xGa_1−xN on a GaN substrate. These values have been used to evaluate the nucleation parameters. It is shown that the nucleation barrier for the formation of a In_xGa_1−xN nucleus on a GaN substrate is minimum in the range of x=0.12 to x=0.17, and it has been qualitatively proved that good quality In_xGa_1−xN on GaN can be grown only in the range 0<x≤0.2.     

Measurement of nonlinear mechanical properties of PDMS elastomer

This paper presents the measurement of the nonlinear mechanical properties of polydimethylsiloxane (PDMS) elastomer based on the mixing ratio of base polymer to curing agent. Strip-type PDMS samples with different mixing ratios were prepared using a simple coating, curing, and cutting process. A cyclic uniaxial tension test with a fixed magnitude of applied strain and a single-pull-to-failure tension test were performed with a micro-tensile tester at room temperature.Our new finding is that when the PDMS is mixed with excessive curing agent, stress softening occurs and residual strain exists in cyclic tension tests when the magnitude of the applied strain increases. For the PDMS-05 samples, in which the mixing ratio of base polymer to curing agent was 5 to 1, there were large differences in the stresses for the same strain level under loading and unloading during the first cycle with a 100% fixed strain amplitude, but the softening effect of the stress in the PDMS dropped rapidly starting from the second cycle.Nonlinear mechanical Neo-Hookean, third-order Mooney, and second-order Ogden models of three different PDMS films were computed from the stress-strain data. The results showed that all models were preferable for the small strain region of PDMS compared with other models. In the nonlinear, large strain region, only the second-order Ogden model properly described the mechanical behavior of the PDMS, while the Neo-Hookean and third-order Mooney-Rivlin models were too stiff or flexible in the measurement range. The bulk modulus of PDMS increased with the amount of curing agent in it. Therefore, the second-order Ogden model is preferable for analyzing the PDMS structure over the entire measurement range. This could provide reasonable mechanical models of PDMS for rapid computational prototyping and for designing active and passive components from PDMS.     

冲击载荷下延性材料的动态本构关系与动态断裂

基于Y/G及G/B为常数的假设,构建了7种高压与高应变率本构模型,采用所构建的7种本构模型对于高导无氧铜(OFHC)的平面冲击波试验进行了数值模拟。结果表明,平面冲击波载荷下OFHC的屈服强度对于压力、密度、温度以及塑性应变的依赖性是本构描述的关键。由Hopkinson试验取得的OFHC高应变率本构模型,并不适合描述平面冲击波载荷下的本构特性。采用层裂过程中的应力松弛方程,建立了一种基于空穴聚集的延性层裂模型,依赖于应力的层裂空隙度方程被耦合计及损伤的总体控制方程。数值模拟了多种材料的平面冲击致层裂试验。采用Hopkinson拉伸装置和一种基于一级气体炮的高速冲击拉伸断裂装置,研究了OFHC铜杆在一系列冲击拉伸速度下的断裂。一种受单轴冲击拉伸荷载的中心含椭球空穴的样本体积单元用于数值模拟空穴的增长与失稳,以空穴形状演化为判据,比较了空穴失稳时的单元平均径向应变与无凹槽杆的冲击断裂应变。     

电子产品实施无铅化是一个系统工程

从六个方面内容进行了评述,并强调了电子产品实施无铅化是一个系统工程。企图从电子产品实施无铅化的提出、无铅化焊料的基本特性、无铅化焊料焊接时的特点与要求等出发,从而论述电子产品实施无铅化对电子元器(组)件、CCL基板材料、PCB基板的主要要求以及相关的测试与标准的制定等,其目的是使读者有一个较全面的了解,以利于电子产品(包含原材料、元器件、PCB、组装等)制造者、特别是相关的工程技术人员,从整体的关联或系统工程上来理解、研究和解决电子产品无铅化问题,使电子产品能顺利而迅速地从有铅化(锡-铅体系)时代过渡到无铅化(目前,最佳体系为锡-银-铜系列)时代。     

Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150°C) were studied. Composite solders were prepared by either incorporating 2 wt.% Cu (3 μm to 20 μm) or Cu₂O (∼150 nm) particles into SAC405 paste. Aggressive flux had the effect of reducing the Cu₂O nanoparticles into metallic Cu which subsequently reacted with the solder alloy to form the Cu₆Sn₅ intermetallic. While all solders had similar interfacial intermetallic growth upon reflow, both of the composite solders’ growth rates slowed through aging to reach a common growth rate exponent of approximately 0.38, considerably lower than that of the nonreinforced solder (n = 0.58). The nanoscale reinforced solder additionally exhibited the highest tensile strength in both the initial and aged conditions, behavior also attributed to its quick conversion to a stable microstructure.     

钛酸铋钠基无铅压电陶瓷晶粒生长机制的研究

采用反应模板晶粒生长法(RTGG),制备了0.94Na0.5Bi0.5TiO3-0.06 BaTiO3无铅压电织构陶瓷,应用晶粒生长动力学唯象理论研究籽晶模板Bi2.5Na3.5Nb5O18对织构陶瓷中取向长条晶生长的影响规律,确定了长条晶生长动力学指数和激活能,探讨了籽晶含量对无铅压电织构陶瓷长条晶生长的作用机理。结果表明:籽晶含量在10%～30%(质量分数)时,随着其含量的增加,晶粒生长指数n约为2,变化不大,说明长条晶粒生长机制主要是界面反应机制。