Multicomponent Physical Vapor Deposited Films with Homogeneous Molecular Material Distribution Featuring Improved Resist Sensitivity

Each film preparation technique affects the physical properties of the resulting coating and thus defines its applicability in modern device construction. In this context solvent based spin coated and solvent‐free physical vapor deposited molecular glass photoresist films are systematically investigated for their dissolution behavior, sensitivity, and overall lithographic performance. These investigations demonstrate that the solvent‐free physical vapor deposition leads to a marked increase in sensitivity. This could be explained by the individual molecule by molecule deposition step producing a more homogeneous distribution of the multicomponent resist system, especially the photoacid generator. In addition, this assumption is supported by former published simulations focusing on aggregate formation within thin films. This work demonstrates that the lithographic sensitivity of multicomponent resist system is an intrinsic parameter to investigate molecular material distribution and indicates that the applied film preparation technique is crucial for the corresponding performance and applicability.     

一种应用于IEEE 802.11 b/g/n无线局域网收发机的CMOS模拟基带电路

本文提出了一种应用于直接变频无线局域网收发机的模拟基带电路,该电路采用标准的0.13微米CMOS工艺实现,包括了采用有源RC方式实现的接收4阶椭圆低通滤波器、发射3阶切比雪夫低通滤波器、包含直流失调消除伺服环路的接收可变增益放大器及片上输出缓冲器。芯片面积共1.26平方毫米。接收基带链路增益可在-11dB至49dB间以2dB步长调节。相应地,基带接收输入等效噪声电压（IRN）在50 nV/sqrt(Hz) 至30.2 nV/ sqrt(Hz)间变化而带内输入三阶交调（IIP3）在21dBm至-41dBm间变化。接收及发射低通滤波器的转折频率可在5MHz、10MHz及20MHz之间选择以符合包含802.11b/g/n的多种标准的要求。接收基带I、Q两路的增益可在-1.6dB至0.9dB之间以0.1dB的步长分别调节以实现发射IQ增益失调校正。通过采用基于相同积分器的椭圆滤波器综合技术及作用于电容阵列的全局补偿技术,接收滤波器的功耗显著降低。工作于1.2V电源电压时,整个芯片的基带接收及发射链路分别消耗26.8mA及8mA电流。     

椭圆偏振光在各向异性1维光子晶体中的传输

为了解决利用传统传输矩阵法计算在各向异性材料结构中任意极化态电磁波传播遇到的困难,设计含磁光材料缺陷层的1维光子晶体。通过把入射电磁波按左旋圆偏振和右旋圆偏振进行正交分解的方法,推导出适合各向异性材料和任意极化态入射电磁波的传输矩阵算法。结果表明,该算法可以确定1维层状结构透射波和反射波偏振态的变化。     

关于乡镇模数转换的几点思考

目前全国的城市社区都已经普及了数字电视,但在一些偏远的乡镇,还在使用一些天线、卫星电视接收器等接收模拟电视节目。利用天线等接收设备,只能收看到为数不多的电视频道,在一些特别偏远的地区,甚至接收不到电视信号,更谈不上数字电视,为此就乡镇的模数转换进行讨论,并提出一些建议和想法。     

An Omni‐Healable Supercapacitor Integrated in Dynamically Cross‐Linked Polymer Networks

Self‐healing will greatly improve the reliability of an energy‐storage device in case of physical damage, but the challenge remains in assembling such a smart device capable of repairing all its electroactive components simultaneously. Here, an omni‐healable supercapacitor that can spontaneously repair its electrolyte, electrodes, and even the interfaces between them in ambient conditions after mechanical damage is reported. The goal is achieved by integrating electrolyte and electrode materials into a dynamic poly(vinyl alcohol)‐based network cross‐linked by diol‐borate ester bonding. The capacitor fast restores its configuration, mechanical properties, and capacitive performances during all 15 breaking/healing cycles without external stimulus, regardless of the breaking positions. Interestingly, the capacitor can tolerate various physical deformations and even tailoring without performance deterioration. The investigation offers a facile and versatile strategy to construct an intrinsically self‐healable energy‐storage device that has potential application for portable/wearable electronics, smart apparels or flexible robots, and so on.     

基于Verilog的模拟前端时序的实现方法

针对如何高精度、高速实现模拟前端时序的问题,提出了一种用于平板探测器的模拟前端时序的Verilog实现方法。Verilog语言的编程整体上采用模块化设计,主要包含电荷采集模块、数据读出模块和计数器模块。利用锁相环技术设置各模块不同的时钟信号,通过编写有限状态机和改进型计数器实现各模块的时序。仿真结果表明,该编程方法满足了时序高精度实现的需求,具有运行速度快、灵活性高等特点,达到了预期效果。     

npn AlGaN/GaN HBT模型与特性分析

基于实验数据对GaN材料的少子寿命和碰撞电离率进行了建模,应用漂移-扩散传输模型开展了npnAlGaN/GaN异质结双极晶体管的特性研究,给出了器件导通电压、偏移电压和饱和电压的解析式.结果表明:实际器件导通电压、偏移电压及饱和电压较大的原因主要是高基区电阻和基区接触的非欧姆特性,为器件的工艺制造提供了理论指导.     

NURBS曲面RCS的物理光学法混合计算

基于近似驻相法和直接积分法,在利用物理光学法(PO)计算NURBS曲面的雷达散射截面(RCS)的问题中提出一种混合积分法.这种方法既保持积分精度,又提高了计算速度.此外,归纳了七种不适合用一般驻相法处理的剖分面元.同时验证了计算中采用NURBS面元剖分对于提高目标RCS计算精度的作用.     

一种智能化漏电保护芯片的设计

提出了一种智能化漏电保护芯片。电路基于0.6μm CMOS工艺、采用数模混合信号设计,并用全定制的方法实现。与现有模拟漏电保护芯片相比,该芯片具有较高的智能化:对输入信号是否有效进行辨识,以排除干扰,减少误动作;采用数字延时代替现有的RC延时方式,大大提高了控制精度及三级匹配;三级保护的不同应用环境的可编程性;实现智能化开关控制;具有报警功能,保障安全。由于芯片的大部分功能由数字电路实现,大大降低了功耗。通过采用全定制的方法,优化电路和版图设计,减少了芯片面积,降低了成本。