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91.
在不同反应温度条件下采用原位聚合法在石英基片上制备了聚苯胺薄膜.对薄膜样品进行了紫外光谱、SEM、电性能表征。实验结果表明,过高的合成温度会加速聚合反应过程,抑制膜厚的增长,引起薄膜的热降解,进而对样品的导电性产生不良影响。根据生长速率与合成温度的依赖关系,估算了聚合反应的活化能Ea=34.4kJ/mol。 相似文献
92.
Effect of Rare Earth Elements on Thermal Fatigue Property of Low Chromium Semi-Steel 总被引:3,自引:0,他引:3
The effect of rare earth elements on eutectic carbide‘s morphology of low chromium semi-steel in as-cast state and after heat treatment was investigated, and accordingly, the thermal fatigue property of this material was studied. The results show that RE can improve the eutectic carbide‘s morphology, inhibit the formation and propagation of thermal fatigue cracks, therefore, promote the thermal fatigue property, which is more noticeable in case of the RE modification in combination with heat treatment. The optimal thermal fatigue property can be obtained when treated with 0.2% RE modification as well as normalization at 950℃ for 3h. 相似文献
93.
Creep crack growth rates were measured using centrally cracked tension specimens of thin polypropylene film with different
crack lengths at various stresses and temperatures. The creep crack growth rates were correlated with the stress intensity
factor. There was the region of the minimum constant crack growth rate which occupied more than 70% of the total creep failure
life. This constant creep crack growth rate characteristics were analyzed on the basis of the stress-dependent Arrhenius type
thermally activated process. 相似文献
94.
The thermal stress on building‐integrated photovoltaic modules (BIPV) in Espoo, Finland, was studied with field‐testing of amorphous silicon modules. Based on these results, the thermal stress at two other European locations (Paris and Lisbon) was estimated. The estimation procedure entailed thermal modelling of heat transfer in the façade with meteorological data as input. The results indicate that the thermal stress on BIPV modules in Lisbon is, in this case, approximately 50% higher that in Espoo and between 80 and 200% higher than in Paris, depending on the activation energy of the degradation process. The difference in stress between a BIPV module and a free‐standing module in Espoo was 50–200%. Copyright © 2006 John Wiley & Sons, Ltd. 相似文献
95.
B. V. Korzoun L. A. Makovetskaya V. A. Savchuk V. A. Rubtsov G. P. Popelnyuk A. P. Chernyakova 《Journal of Electronic Materials》1995,24(7):903-906
Twenty alloys of various compositions in the Cu2Se-Al2Se3 system were prepared and investigated. The T(x) phase diagram of the Cu2Se-Al2Se3 system was obtained from x-ray diffraction, differential thermal analysis, and microstructure investigation for the first
time. The homogeneity region of the CuAlSe2 semiconducting compound was established.
Previous articles by this author were presented with the spelling of his name as B.V. Korzun. 相似文献
96.
The effect of FEF carbon black as filler on the thermal capacity c, diffusivity a, and thermal conductivity λ, of styrene butadiene rubber (SBR) composites in the temperature range 300–420 K was studied. The filler strongly increases the thermal diffusivity, whilst strongly decreasing the thermal capacity and the thermal conductivity (except at high FEF content ≥80 phr). The influence of the filler on the thermoelastic behaviour of the same composites was also investigated. It was found that the thermoelastic temperature change (ΔT) increased with carbon black concentration as well as the entropy change per unit extension. 相似文献
97.
98.
A prediction method for the thermal conductivity of halocarbon refrigerants in the saturated liquid state in the reduced temperature range 0.3 to well above 0.9 is presented in this paper. The aim of the method is to present a very simple calculation of the transport property useful for engineering purposes. The method determines thermal conductivity as a sole function of the reduced temperature and requires the knowledge of a parameter dependent upon easily available physical constants characteristic of each compound. The method is validated against experimental data available in the literature, giving average absolute deviations which are usually less than 5%, with maximum absolute deviations generally less than 10%. An extension of the method to estimate thermal conductivity of binary mixtures is also presented, along with a comparison with the few experimental data available in the literature.Paper presented at the Twelfth Symposium on Thermophysical Properties, June 19–24, 1994, Boulder, Colorado, U.S.A. 相似文献
99.
100.
This paper presents a novel process for the fabrication of pultruded polyurethane (PU) composites. The effects of the processing parameters on the mechanical properties (flexural strength and flexural modulus, etc.) and thermal properties (HDT) of the fibre reinforced PU composites by pultrusion have been studied. The processing parameters investigated include pulling rate (in-line speed), die temperature, filler type and content, and post-cure time and temperature. Results show that the composites possessed various optimum pulling rates at different die temperatures. On the basis of the DSC diagram, the swelling ratio, the mechanical properties and the thermal properties of composites, the optimum die temperature can be determined. It is found that the mechanical and thermal properties increase with filler content for various types of filler. The mechanical and thermal properties increase at a suitable post-cure temperature and time. Furthermore, the properties which decreased due to the degradation of composite materials for a long post-cure time will be discussed. 相似文献