Effect of powder characteristics on Cr internal oxidation for preparation of Cr2O3/Cu composite

Abstract

Cr O₃/Cu composite was prepared by the internal oxidation of Cu–Cr pre-alloyed powders formed by high energy milling. Effects of milling time on the internal oxidation characteristics of Cu–Cr pre-alloyed powders were also discussed in this paper. The results indicate that the degree of the internal oxidation continually increases with prolonged milling time. At the initial stage, external oxidation rather than internal oxidation occurs, resulting in coarse Cr₂O₃ particles. With further milling, the internal oxidation becomes more complete and the sizes of Cr₂O₃ particles also become finer and well distributed. The properties of the composite are therefore improved. A high quality composite specimen from Cu–1·0Cr pre-alloyed powders after 40 h milling was prepared by the internal oxidation process. The Cr₂O₃ particles with an average size of 2–5 μm in diameter and about 5–10 μm in particles space were found by a microstructure examination, and they were uniformly dispersed in the Cu matrix.     

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

Abstract

In this study, the interfacial reaction and joint reliability of immersion Ag-plated Cu substrate with the Sn–0·7Cu (wt-%) ball–grid array (BGA) solder was investigated. During reflow, the Ag plating layer was dissolved completely into the molten Sn–Cu solder and some of the Cu layer was also dissolved into the molten solder. The dissolved Ag and Cu were precipitated as Ag₃Sn and Cu₆Sn₅ intermetallic compounds (IMCs) in the solder matrix. Upon reflow, the Sn–Cu solder exhibits an off-eutectic reaction to produce the eutectic phase and precipitate (Cu₆Sn₅ and Ag₃Sn). The Cu–Sn IMC layer was formed at the solder/Cu interface after reflow, and the IMC layer grew during aging treatment. During the shear tests, the failure mode switched from a bulk-related failure to an interface-related failure. After aging for 250 h, the joint failed partially at the solder/Cu₆Sn₅ interface. The brittle fracture was linked to the formation of thick Cu–Sn IMC layer.     

一种快速HEVC帧内算法

为了提高HEVC帧内预测的编码速度,本文提出了一种快速帧内预测算法。该算法充分利用视频序列的时间相关性,利用相邻帧CU的大小相关性在CU（Code Unit）层提前判定CU的最佳编码尺寸以及利用相邻帧在PU层减少预测方向数目来加速帧内预测的过程。实验结果表明：本文提出的算法与HEVC已有快速算法相比,峰值信噪比（PSNR）平均下降0.06dB,输出码率平均减少0.09%,而帧内预测时间平均减少了约49.81%。     

Dissolution of Al2Cu phase in non-modified and Sr modified 319 type alloys

Abstract

This study investigates the effects of solution heat treatment on dissolution of the Al₂Cu phase in non-modified and 150 ppm Sr modified 319 type alloys. Experimental and industrial 319 alloys containing different Mg levels (0, 0·3 and 0·6 wt-%) were used for this purpose. Electron probe microanalysis (EPMA) in conjunction with energy dispersive X-ray (EDX) analysis was used to monitor the distribution of Cu in the matrix and to measure the undissolved Al₂Cu phase. In as cast 319 alloys, copper segregates at the dendrite boundaries. The addition of Mg and Sr may cause this segregation to deteriorate. After heat treatment, the copper begins to distribute more evenly across the dendrite as well as in the matrix. The amount of Cu dissolved in the matrix increases with increasing solution time and temperatures, reaching a maximum for the 490°C/8 h solution heat treatment. The dissolution process of eutectic and block like Al₂Cu was also investigated.     

面向绘制质量的深度图像快速帧内编码

与彩色视频用来直接显示不同,在三维视频系统中深度视频序列的作用是在绘制虚拟视点时提供所需的几何信息,所以直接将现有编码算法应用于深度图像存在一定的局限性.针对深度视频序列的作用以及深度图像自身特征,提出了一种面向绘制质量的深度图像快速帧内编码方法,该方法包括基于深度图像统计特性和空域相关性的图像区域划分算法、HEVC的快速编码单元(CU)和预测块(PB)决策算法和帧内编码模式预先选择算法.实验结果表明:与直接利用HEVC测试软件编码深度视频相比,该快速算法在保证几乎相同的主客观绘制质量的前提下,每个视点的编码速度平均提升了35％以上.     

多策略的HEVC帧内快速预测算法

为降低高效视频编码(HEVC)帧内预测过程的计算复杂度,提出一种利用灰度直方图结合自相关函数的快速深度选择算法。统计每个最大编码单元(CU)的灰度值分布,生成其灰度直方图,利用灰度直方图的自相关函数排除不必要的深度计算。同时针对帧内预测模式的优化,给出3个减少帧内候选模式数量的有效策略。应用梯度边缘检测进一步减少8×8CU的候选模式数量,使用模式相关以及当前CU的纹理特征,对满足一定条件的CU只选取2种预测模式进行率失真优化计算。实验结果表明,与原始HM10.1相比,该算法平均可以节省约48%的编码时间,同时又能保持较高的视频质量。     

一种HEVC帧内快速编码算法

高效视频编码(HEVC)采用编码单元(CU)四叉树的 分割结构,相比H.264/AVC显著地提升了编码效 率,但却使编码复杂度急剧增加。为此,本文提出一种帧内快速编码算法。首先,根据视 频图像纹理复 杂度,提前判断是否进行最大编码单元(LCU)分割。然后,根据空域相邻CU的深度预测当前C U的深度范围, 跳过不必要的计算;最后,根据预测模式被选为最优预测模式的统计特性,去掉可能性小的 帧内预测模式。本文算法在HM14.0的基础上实现。 仿真结果表明,本文算法在全I帧模式下与HM14.0相比,帧内编码时 间平均减少38%,码率(BR)只增加1.41%,峰值信噪比(PSNR)只降低0.29dB,在保证编码性能和视频质量几乎不变的 情况下,本文算法降低了编码的计算复杂度。     

5G无线网络CU/DU部署策略探讨

5G网络将满足三大类业务：eMBB、uRLLC、mMTC，不同业务对时延、可靠性、移动速度要求不相同。为了适应这些需求，3GPP标准化组织将BBU重构成CU和DU两个功能实体，在实际部署时的形态可以映射到不同物理设备上，也可以映射到同一物理实体。具体采用哪种方式要结合业务需求，应用场景，及网络要求综合分析，根据不同情况采用合适的部署策略。     

一种面向HEVC的编码单元深度决策算法

新一代高性能视频编码(HEVC)标准采用灵活的四叉树自适应存储结构、可变尺寸的编码块、35种帧内预测模式等新技术,能够有效提升HEVC的编码效率,但也造成了更高的编码复杂度。为此,提出一种基于时空相关性的编码单元深度决策算法。融合关联帧编码单元的深度信息及当前帧相邻编码单元的深度信息,从而预测当前编码单元的深度范围。实验结果表明,与HEVC标准测试算法相比,该算法能在不明显影响编码质量的基础上平均减少30.2%的编码时间。