Modified Atmosphere Packaging Affects Ascorbic Acid, Enzyme Activity and Market Quality of Broccoli

Reduced ascorbic acid (RAA) content, total chlorophyll and green color retention, enzyme activities and texture changes were followed in broccoli spears packaged in polymeric film and nonpackaged during 96 hr storage (10°C). Concentrations within packages monitored by gas chromatography were (CO₂,) 8% and (0²) 10%. RAA retention, moisture content, total chlorophyll and color retention were greater in packaged broccoli. No differences were found between packaged and nonpackaged broccoli for ascorbate oxidase and peroxidase activities, or texture.     

Storage Changes of Fresh and Pasteurized Blue Crab Meat in Different Types of Packaging

We investigated pasteurization and storage of blue crabmeat in steel cans, aluminum cans, plastic cans, nonbarrier pouches, and barrier pouches. Fresh meat was packed in copolymer polyethylene/polypro-pylene cups, Saran® over-wrapped or vacuum skin packaged polystyrene trays, and nonbarrier pouches. Meat pasteurized in plastic and aluminum cans had better sensory and microbiological quality and longer shelf life than meat packed in steel cans. Oxygen-barrier pouches had the lowest quality and shortest shelf life. Nonbarrier pouches had product with quality similar to meat in steel cans, but with an extended shelf life. No packaging materials improved the microbiological shelf life of freshly cooked meat. Vacuum skin packaging resulted in improved sensory qualities of freshly cooked and picked meat.     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes

The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,a _effs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.     

水基传送带润滑剂综述

说明了水基传送带润滑剂的作用机理、性能要求,详细介绍了现有的水基传送带润滑剂的特点,并简单介绍了水基传送带润滑剂的发展前景和趋势。     

塑料包装应用及技术进展

塑料在包装领域有着广泛的应用，其中聚酯（PET）性能优良，应用领域不断扩大。介绍了塑料包装不断通现的新技术，以及塑料包装环保问题的几点思路。     

Improved oxidative stability of sunflower oil in the presence of an oxygen-scavenging film

The oxidative stability of sunflower oil (SFO) was measured during storage at 23 and 37°C in the presence of a novel oxygen-scavenging film that contained polyfuryloxirane (PFO). Commercially refined and deodorized SFO was stored in a lighted room in sealed transparent packages containing either PFO film or an antioxidant, 0.02% butylated hydroxytoluene (BHT). Oxidative stability was evaluated by determination of peroxide values and gas-chromatographic measurement of headspace hexanal. SFO stored in the presence of the oxygen-scavenging film was more stable than oil stored without the film, or than film stored with 0.02% BHT. The PFO film scavenges oxygen through energy-transfer sensitization of singlet oxygen. The film is doped with eosin and the naturally-occurring dye, curcumin, which absorb over a wide range of visible wavelengths. Curcumin transfers its absorbed energy to eosin, which sensitizes the production of singlet oxygen. The singlet oxygen is scavenged by PFO. The use of two dyes increases the efficiency of the sensitization process, reducing the illumination time and intensity required for effective oxygen scavenging.     

Ceramic and Glass-Ceramic Packaging in the 1990s

A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high-performance and low-performance applications. Glass-ceramics are identified as the best candidates for high-performance systems, and aluminum nitride, alumina, or mullite are identified for low-performance systems. Glass-ceramic/copper substrate technology is discussed as an example of high-performance ceramic packaging for use in 1990s. Lower-dielectric-constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.     

电子封装用环氧树脂的增韧和提高耐热性研究

用α,ω 二氯聚二甲基硅氧烷(DPS)或α 氯聚二甲基硅氧烷(CPS)来改性普通双酚A环氧树脂(BPAER)和四溴双酚A环氧树脂(TBBPAER),目标是制备出一系列可用于电子封装的高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对材料性能的影响。结果表明,当m(BPAER)∶m(DPS)=100∶10时,树脂固化物的冲击强度达到30 5kJ/m2,拉伸强度达46 95MPa,断裂伸长率达到60 23%,Tg达到141 3℃;分别比未改性BPAER提高了19 7kJ/m2,1 69MPa,54 29%以及5 9℃。而当m(TBBPAER)∶m(CPS)=100∶10时,固化物的冲击强度达到17 2kJ/m2,拉伸强度达39 89MPa,断裂伸长率达到5 60%,Tg达到147 0℃;分别比未改性TBBPAER提高了12 8kJ/m2,28 26MPa,4 29%以及7 9℃。     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002