Pull out of FRP reinforcement from masonry pillars: Experimental and numerical results

In this paper, debonding phenomena between carbon fiber reinforced polymer (CFRP) strips and masonry support were investigated on the basis of single-lap shear tests, considering different dimensions of the bond length. To capture the post-peak response of the CFRP–masonry joint, the slip between the support and the reinforcement strip was controlled using a clip gauge positioned at the end of the reinforcement. The tests were simulated by means of a finite element model able to capture the post-peak snap-back behavior due to the failure process. The numerical model is based on zero-thickness interface elements and on a proper non-linear cohesive law. The comparison between experimental and numerical results was performed in terms of overall response, measured by both the machine stroke and the clip gauge positioned at the free end of the reinforcement. The cases of effective bond length greater and lesser than the minimum anchorage length, suggested by the CNR Italian recommendation, were considered.     

Solidification morphology and phase selection in drop-tube processed Ni–Fe–Si intermetallics

Drop-tube processing was used to rapidly solidify droplets of Ni_64.7Fe₁₀Si_25.3 and Ni_59.7Fe₁₅Si_25.3 alloys. In the larger droplets, and therefore at low cooling rates, only two phases, γ-Ni₃₁Si₁₂ and β₁-Ni₃Si were observed. Conversely, in the smaller droplets, and therefore at higher cooling rates, the metastable phase Ni₂₅Si₉ was also observed. The critical cooling rate for the formation of Ni₂₅Si₉ was estimated as 5 × 10³ K s⁻¹. SEM and TEM analysis reveals three typical microstructures: (I) a regular structure, comprising single-phase γ-Ni₃₁Si₁₂ and a eutectic structure between γ-Ni₃₁Si₁₂ and β₁-Ni₃Si; (II) a refined lamellar structure with a lamellar spacing <50 nm comprising γ-Ni₃₁Si₁₂ and β₁-Ni₃Si; (III) an anomalous structure with a matrix of Ni₂₅Si₉ and only a very small proportion of a second, and as yet unidentified, phase. These results indicate that there is an extended stability field for Ni₂₅Si₉ in the Ni-rich part of the Ni–Fe–Si ternary system in comparison to the Ni–Si binary system. With an increase of cooling rate, an increasing fraction of small droplets experience high undercoolings and, therefore, can be undercooled into the Ni₂₅Si₉ stability field forming droplets consisting of only the anomalous structure (III). The Fe atoms are found to occupy different substitutional sites in different phase, i.e. Fe substitutes for Ni in the γ phase and Si in the L1₂ (β₁) phase respectively.     

面向消费类电子产品的自动化生产线成组技术

针对现代消费类电子产品快速更新换代的现状, 介绍了该类产品的自动化生产线成组技术,阐述了通过度量消费类电子产品相似性和派生性特征,对产线进行成组编码的原理,研究产线工位单元的建模方法,描述了建模内容,并通过有无装载板的产线结构,论述了产线成组编码集成的途径和方法.     

Compiler compatible 5.66 Mb/mm2 8T 1R1W register file in 14 nm FinFET technology

1-read/1-write (1R1W) register file (RF) is a popular memory configuration in modern feature rich SoCs requiring significant amount of embedded memory. A memory compiler is constructed using the 8T RF bitcell spanning a range of instances from 32 b to 72 Kb. An 8T low-leakage bitcell of 0.106 μm² is used in a 14 nm FinFET technology with a 70 nm contacted gate pitch for high-density (HD) two-port (TP) RF memory compiler which achieves 5.66 Mb/mm² array density for a 72 Kb array which is the highest reported density in 14 nm FinFET technology. The density improvement is achieved by using techniques such as leaf-cell optimization (eliminating transistors), better architectural planning, top level connectivity through leaf-cell abutment and minimizing the number of unique leaf-cells. These techniques are fully compatible with memory compiler usage over the required span. Leakage power is minimized by using power-switches without degrading the density mentioned above. Self-induced supply voltage collapse technique is applied for write and a four stack static keeper is used for read Vmin improvement. Fabricated test chips using 14 nm process have demonstrated 2.33 GHz performance at 1.1 V/25 °C operation. Overall V_min of 550 mV is achieved with this design at 25 °C. The inbuilt power-switch improves leakage power by 12x in simulation. Approximately 8% die area of a leading 14 nm SoC in commercialization is occupied by these compiled RF instances.     

1,5-己二烯交联烯烃聚合物的合成及其抗剪切稳定性

以金属配合物为催化剂、1,5-己二烯为交联剂,采用本体聚合法合成了交联超高相对分子质量烯烃类聚合物(简称交联聚合物)。用傅里叶变换红外光谱、核磁共振、凝胶渗透色潜表征交联聚合物的结构和相对分子质量。用旋转黏度计和超声波仪研究了1,5-己二烯用量对交联聚合物溶液表观黏度的影响及交联聚合物的相对分子质量对交联聚合物溶液抗剪切稳定性的影响。实验结果表明,在最佳聚合条件(单体80mL、助催化剂0．4mL、CS-1催化剂0．090g、1,5-己二烯0．40mL、0℃、24 b)下所合成的交联聚合物的重均相对分子质量为7．7×106,数均相对分子质量3．6×106。加入少量1,5-己二烯能提高交联聚合物的抗剪切能力,同时也能提高交联聚合物的相对分子质量。交联聚合物的相对分子质量越大,抗剪切稳定性越好。1,5-己二烯用量约为0．1 mL时(单体40 mL),交联聚合物溶液的表观黏度达到最大值(16．8 mPa·s)。     

CDMA 1x EV-DO覆盖模型的分析与仿真

结合经过校正后的适合于本地无线环境的OKUMURA-HATA传播模型，建立起一种新的本地化基于1x EV—DO系统数据业务吞吐量分析的覆盖预测仿真模型，可应用于1xEV—DO系统的网络规划及系统性能分析。     

一种适合∑-△A／D转换器的FIR数字滤波器

讨论了一种用于∑-△A／D转换器的固定系数半带（half-band）FIR数字滤波器，分析了其线性相位特性和低通滤波特性，给出了频率仿真结果，以及在Cadence设计系统中的电路和版图实现。     

串行16位DAC转换芯片在流量手操器中的应用

本文介绍串行16位D／A转换芯片MAX541及其与AT89C52单片机的接口电路、相应的转换子程序，并给出其在过程流量手操器中的应用。     

番禺30-1砂岩强水驱气藏储层非均质性研究

针对垂向非均质性严重且边底水能量强的番禺30-1气田面临的潜在开发问题，通过岩心分析及测井二次解释，对其夹层特征及储层非均质性等进行了研究，划分出19个流动单元并定量描述了各流动单元的特征参数，建立了该气田的精细地质模型。综合评价表明，新建的地质模型具有较高的精度，为该气藏合理开发提供了坚实的地质基础。     

水力射孔对套管强度的影响研究

水力射孔技术是一种新型的完井方式，深穿透水力射孔技术辅助定向水力压裂可以实现油气层改造和油气井增产。但是，水力射孔套管会在孔眼处造成应力集中，使得局部应力过大而削弱了套管和水泥环的强度，可能会影响套管的使用寿命。因此，文章利用有限元软件建立了射孔套管的三维有限元模型，分析了水力射孔后套管管体的应力分布，重点研究了水力射孔参数-孔密、孔径、孔深、射孔方位角等对套管强度的影响规律。分析结果表明，沿着最大水平地应力方向深穿透水力射孔，选择合适的孔密、孔径可将射孔对套管的损害降至最小。研究结果为提高水力射孔完井设计水平提供了一定的参数依据。