天地基综合观测的东日本大地震电离层异常分析

介绍了地震电离层前兆的主要特性,并给出了掩星电离层电子密度峰值位置的标高估计技术。利用天地基电离层观测数据,综合分析了2011年3月11日日本9.0级大地震发生前的电离层异常变化,发现地震前3天内电离层f0F2异常扰动、相对垂直总电子含量（VTEC）扰动以及电子密度峰值处标高（Hs）增加等多种异常现象。分析了地磁活动和太阳活动等因素后,认为其可能与地震有一定关联,表明电离层异常变化对于地震短期预报具有重要参考意义。     

直缝焊管焊缝质量电磁超声检测方法研究

为实现直缝焊管焊缝内缺陷检测,采用周向电磁超声SH0导波检测技术,研究了基于磁致伸缩效应激励周向SH0模态导波,确定了周向SH0导波激励频率,设计了一款一发双收差分接收的直缝焊管焊缝缺陷检测探头。结果表明:该系统能够激发单一模态周向SH0导波,实际波速与模型分析结果吻合;针对直径116 mm、壁厚3.5 mm的激光直缝焊管焊缝的Φ0.6 mm盲孔和Φ1.0 mm通孔,通过差分探头的信号处理,能够实现焊缝处Φ1.0 mm通孔和Φ0.6 mm盲孔缺陷的检测。     

Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

Eutectic solder balls (63Sn-37Pb) joined to Cu pads with an Au/Ni metallization have been widely used in wafer-level chip-size package (WLCSP) technology for providing electrical and mechanical interconnections between components. However, some reliability issues must be addressed regarding the intermetallic compounds (IMCs). The formation of a brittle IMC layer between the solder/Cu pad interface impacts considerably upon the solder-ball shear strength. In addition, it will degrade the long-term operating reliability of the WLCSP. This study investigates, by means of experiments, the growth of the IMC layer under isothermal aging for the eutectic Sn-Pb solder reflowed on a Cu pad with an Au/Ni metallization. Forming the Cu pad with an Au/Ni metallization was achieved by a simple semiconductor-manufacturing process. The effects of the intermetallic layer on solder-ball shear strength were examined for various parameters, including the thickness of the Au layer, solder-ball size, and the diameter of the Cu pad. Experimental results indicate that two IMC layers, Au_0.5Ni_0.5Sn₄ and Ni₃Sn₄, form at the solder/Cu pad interface after aging. The Au_0.5Ni_0.5Sn₄ intermetallic layer dominates the total thickness of the IMC layer and grows with aging time while the solder-ball shear strength decreases after aging. The degradation of the solder-ball shear strength was found to be caused mainly by the formation of the Au_0.5Ni_0.5Sn₄ layer. The experimental results established that a thinner Au layer on Cu pad can effectively control the degradation of solder-ball shear strength, and this is especially true for smaller ball sizes.     

自对准硅化物工艺研究

对适用于深亚微米CMOS器件的各种自对准硅化物工艺进行了讨论，并对不同硅化物薄膜的特性进行了分析。结果表明，随着大规模集成电路特征尺寸的不断缩减及其对器件性能要求的不断提高，常规Ti和Co的自对准硅化物工艺已经不能满足器件特征尺寸进一步缩小的需要；Ni的自对准硅化物工艺可以很好地满足超深亚微米及纳米器件对硅化物的需求。     

1Cr18Ni9Ti不锈钢摩擦过程中的扩散与相变

对 1 Cr1 8Ni9Ti奥氏体不锈钢摩擦过程中的组织与成分变化进行了研究。结果表明 :1 Cr1 8Ni9Ti不锈钢经摩擦之后碳元素和其它合金元素在表面发生了明显的富集与扩散。但(马氏体 )相变只有在转速和压力比较低、摩擦时间较长、磨损速率较小各合金元素充分扩散的条件下才会发生。晶粒细化的程度受摩擦条件变化的影响     

高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用

介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。     

焊缝及焊接材料中Ni元素可见光谱快速分析方法研究

使用数字化技术对部分合金钢焊材和焊缝中Ni元素可见光谱进行了分析测定.研究了Ni485.54nm分析谱线组的数字化处理技术,探索了利用Ni元素可见光谱分析技术进行焊材和焊缝Ni元素含量分析及牌号鉴别的方法.结果可用于常用合金钢焊材和焊缝中Ni元素的定性、定量分析和材料牌号鉴别.     

精炼30Cr2Ni4MoV低压转子材料在超超临界机组上的应用

采用Ansys有限元方法计算了超超临界机组低压转子的温度场,并整理了精练30Cr2N i4MoV低压转子材料的物理化学特性。通过对两者的分析对比,认为超超临界机组的低压转子采用精练30Cr2N i4MoV完全可以满足设计要求。     

Synthesis and electrochemical studies of the 4 V cathode, Li(Ni2/3Mn1/3)O2

Layered Li(Ni_2/3Mn_1/3)O₂ compounds are prepared by freeze-drying, mixed carbonate and molten salt methods at high temperature. The phases are characterized by X-ray diffraction, Rietveld refinement, and other methods. Electrochemical properties are studied versus Li-metal by charge–discharge cycling and cyclic voltammetry (CV). The compound prepared by the carbonate route shows a stable capacity of 145 (±3) mAh g⁻¹ up to 100 cycles in the range 2.5–4.3 V at 22 mA g⁻¹. In the range 2.5–4.4 V at 22 mA g⁻¹, the compound prepared by molten salt method has a stable capacity of 135 (±3) mAh g⁻¹ up to 50 cycles and retains 96% of this value after 100 cycles. Capacity-fading is observed in all the compounds when cycled in the range 2.5–4.5 V. All the compounds display a clear redox process at 3.65–4.0 V that corresponds to the Ni^2+/3+–Ni^3+/4+ couple.     

大型汽轮发电机转子材料26Cr2Ni4MoV钢疲劳性能的研究

本文研究了大型汽轮发电机转子材料26Cr2Ni4MoV钢的疲劳性能。疲劳裂纹扩展门槛值△K_(th)和扩展速率da/dn的试验结果表明.应力比R严重影响门槛值△K_(th)和扩展速率da/dn。随着应力比的增加,门槛值下降。通过应变片法测量出裂纹尖端的闭合载荷,用裂纹闭合机制合理解释了应力比R对门槛值△K_(th)扩展速率da/dn的影响,提出了门槛值和扩展速率随应力比变化规律。