AlGaN中的应变状态

用X射线衍射和卢瑟福背散射方法研究了生长在GaN上厚度为570nm 的AlxGa1-xN外延层中的应变状态. 实验结果显示AlGaN的共格因子在组分小于0.42时随组分的增加而近似线性减小，并且在0.42时达到30%，此后随组分的增加变化较慢，在x＝1(AlN)时接近0. 在本实验条件中，由于GaN层处于压应变状态，导致与AlGaN外延层的失配变小，使得组分约为0.16的AlxGa1-xN外延层可以共格生长在GaN层上.     

AlGaN/GaN HEMT高跨导特性的研究

报道了蓝宝石衬底、栅长为0.3 μ m AlGaN/GaN HEMT器件的制备,在未采用散热设备的条件下测得栅宽为100μ m器件的饱和电流为55.9mA,最大源漏电流为92.1mA.对器件的跨导特性进行了对比,得到最大跨导为306mS/mm的器件.同时对器件进行了微波小信号测试,推导出截止频率fT和最高振荡频率fmax分别为18.5GHz和46GHz.     

AlN阻挡层对AlGaN/GaNHEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

采用PECVD方法制作SiO2绝缘层的AlGaN/GaN MOS-HFET器件

为了进一步减小栅漏电,提高击穿电压,将MOS结构的优点引入ALGaN／GaN HEMT器件中,研制并分析了新型的基于AlGaN／GaN的MOS—HFET结构。采用等离子增强气相化学沉积（PECVD）的方法生长了50nm的SiO2作为栅绝缘层,新型的AlGaN／GaN MOS—HFET器件栅长1μm,栅宽80μm,测得最大饱和输出电流为784mA／mm,最大跨导为44．25ms／mm,最高栅偏压＋6V。     

原位钝化和催化剂钝化沟道阱能带计算

把Si3N4/AlGaN界面看成新的异质结,自洽求解薛定谔方程和泊松方程,建立起原位钝化和CATCVD钝化异质结构的新能带模型.运用这一模型,研究了原位钝化和CATCVD钝化异质结沟道阱的电子气密度、能带结构和输运性能,解释了相应的实验结果.在此基础上研究了这些新钝化异质结沟道阱能带的优化设计.优化设计的钝化复合势垒沟...     

A Ka-band 22 dBm GaN amplifier MMIC

A Ka-band GaN amplifier MMIC has been designed in CPW technology,and fabricated with a domestic GaN epitaxial wafer and process.This is,to the best of our knowledge,the first demonstration of domestic Kaband GaN amplifier MMICs.The single stage CPW MMIC utilizes an AlGaN/GaN HEMT with a gate-length of 0.25μm and a gate-width of 2×75μm.Under V_ds=10 V,continuous-wave operating conditions,the amplifier has a 1.5 GHz operating bandwidth.It exhibits a linear gain of 6.3 dB,a maximum output power of 22 dBm and a peak PAE of 9.5%at 26.5 GHz.The output power density of the AlGaN/GaN HEMT in the MMIC reaches 1 W/mm at Ka-band under the condition of V_ds=10 V.     

Characterization of AlGaN/GaN structures on various substrates grown by radio frequency-plasma assisted molecular beam epitaxy

The structural properties and surface morphology of AlGaN/GaN structures grown on LiGaO₂ (LGO), sapphire, and hydride vapor phase epitaxy (HVPE)-grown GaN templates are compared. AlGaN grown on LGO substrates shows the narrowest x-ray full width at half maximum (FWHM) for both symmetric 〈00.4〉 and asymmetric 〈10.5〉 reflections. Atomic force microscopy (AFM) analysis on AlGaN surfaces on LGO substrates also show the smoothest morphology as determined by grain size and rms roughness. The small lattice mismatch of LGO to nitrides and easily achievable Ga-polarity of the grown films are the primary reasons for the smoother surface of AlGaN/GaN structure on this alternative substrate. Optimizations of growth conditions and substrate preparation results in step flow growth for an AlGaN/GaN structure with 300 Å thick Al_0.25Ga_0.75N on 2.4 μm thick GaN. A high III/V flux ratio during growth and recently improved polishing of LGO substrates aids in promoting two dimensional step flow growth. The GaN nucleation layer directly on the LGO substrate showed no evidence of mixed phase cubic and hexagonal structure that is typically observed in the nucleation buffer on sapphire substrates. Cross-sectional high-resolution transmission electron microscopy (HRTEM) was performed on an AlGaN/GaN heterostructure grown on LGO. The atomic arrangement at the AlGaN/GaN interface was sharp and regular, with locally observed monolayer and bilayer steps.     

AlGaN/GaN HEMT结构热时间常数谱提取方法的研究

利用电学法对AlGaN/GaN 高电子迁移率晶体管(HEMTs)有源区瞬态温升进行测量.利用非参数拟合算法—局部加权回归散点平滑法(LOWESS)对原始测量数据进行平滑去噪处理,进而得到热时间常数谱,分析AlGaN/GaN HEMTs热传导路径物理结构。与传统平滑去噪方法—多阶指数拟合相比,通过LOWESS算法得到的热时间常数谱更丰富,得到RC网络更多,进而热传导路径结构分析更精细。结果表明,LOWESS非参数拟合算法能够更好的去除测量数据噪声,保留原始离散数据细微的变化趋势。通过该方法所提取的热时间常数谱能描述AlGaN/GaN HEMTs有源区温度细微变化,帮助研究人员精确分析热传导路径层次构成。     

日盲雪崩探测器滤波膜系的优化设计及器件性能的影响

利用传输矩阵法设计了空气与基本膜系之间具 有3个周期减反膜结构的日盲紫外探测器滤波膜系,并利用半导体 器件仿真软件Atlas分析集成了滤波膜系的GaN/AlGaN异质结雪崩光电探测器(APDs)的光 电性能。研究结果表明,相对 无减反射膜的滤波膜系,本文设计的膜系明显提高了光在日盲区的透过率及截止区的反射率 ,使GaN/AlGaN APDs有更 加平滑的光谱响应曲线、更大的响应度、更陡峭的响应截止边频及更好的滤波性能;同时, GaN/AlGaN APDs比传统AlGaN APDs 更有利于光生空穴的注入,使GaN/AlGaN APDs的最大光谱响应度及紫外/可见抑制比较传统的 APDs提高超过300%。     

最大振荡频率为200 GHz的蓝宝石衬底AlGaN/GaN HEMT

本文报道了fmax为200GHz的基于蓝宝石衬底的AlGaN/GaN 高电子迁移率晶体管（HEMT）。外延材料结构采用了InGaN背势垒层来减小短沟道效应,器件采用了凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaN HEMT。器件饱和电流达到1.1A/mm,跨导为421mS/mm,截止频率（fT）为30GHz,最大振荡频率（fmax）为105GHz。采用了湿法腐蚀工艺将器件的Si3N4钝化层去除后,器件的Cgs和Cgd减小,器件截止频率提高到50GHz,最大振荡频率提高到200GHz。