VANET无线链路质量的测量与分析

目前对移动自组织网络的研究很少涉及现实环境里的测量问题。该文对不同环境下无线链路丢包率、信号强度等参数进行了测量和分析。结果表明,环境对链路质量有较大影响,在郊区环境下,丢包率较低,链路质量较好,信号强度反应链路质量的能力有限,连续丢包概率的变化与丢包率平均值的变化基本一致。分析结果对预测无线链路质量和设计VANET网络协议具有重要意义。     

多网卡bonding技术在无线广告系统中的应用

简单地介绍了多网卡链路绑定策略,重点讨论了Linux下的bonding技术及其基于bonding技术的几种负载均衡算法。给出了无线多媒体广告系统的主要架构,分析了负载均衡算法的差异性及适用情况,给出了MAC地址异或算法在该系统中的应用实现,并做了相关测试,测试结果表明该方案成功地解决了本系统的网络瓶颈。     

基于路径损耗的无线传感器网络分布式拓扑控制算法

对无线传感器网络中目前最常用的3种链路度量标准进行分析和比较得出,在满足一定收包率要求时,节点的接收信号强度存在一个最小阈值.考虑接收信号强度作为拓扑构建条件时需节点具备相同发射功率的不足,提出将路径损耗大小作为拓扑构建的条件,设计了一种分布式拓扑控制算法——PLBD.该算法在保证收包率的同时,还使各节点之间的通信保留最小损耗链路.仿真结果表明,PLBD算法构建的拓扑不仅能够保证网络连通性,还具有通信时延低,健壮性好,能量消耗相对均衡的特点.     

A new optical elasticity resin for mobile LCD modules

Abstract— The display used in current cell phones has an air gap between the cover glass and the liquid‐crystal‐display (LCD) module to prevent the LCD glass from being damaged. Reflections at the boundaries of the air gap cause a reduction in the LCD luminance and contrast. To address this problem, a newly proposed LCD structure has been investigated. The “Super View Resin (SVR),” a transparent elastic resin which improves the shock resistance and visibility of the LCD, has been developed. Filling the air gap between the cover glass and LCD module with a refractive‐index‐matching resin solves the light‐reflection problem inherent in the use of a reinforced cover‐glass lens. Moreover, the elastic filler works as a damper, reducing any external shock, which prevents not only the cover glass and LCD module from being damaged, but also the glass from being shattered when it is broken.     

一种基于充要强度的优化规则发现方法

提出了一种基于信息系统的优化规则的提取方法,主要目的是提取信息系统中具有一定充要性的优化规则。首先,提出了充要强度并讨论了它的性质。其次,由于搜索空间的巨大和遗传算法的全局优化的特性,设计了使用遗传算法进行优化规则搜索的方法。最后,通过实验说明方法的有效性。     

Successful fabrication of bicrystal Si substrates for YBa2Cu3O7 − y Josephson junctions

Bicrystal Si(BiSi) substrates for grain boundary (GB) Josephson junctions (GBJJs) have been fabricated by a direct bonding technique using a hot press method. The fracture strength and structure of the bonding interfaces were investigated to obtain substrates suitable for the junctions. It was found that an increase in the pressure of the hot press improves the reproducibility of the GBJJs. YBa₂Cu₃O_{7 − y} GBJJs were successfully fabricated on Bi-Si substrates with a misorientation angle of 15 ° bonded under a pressure of 90 kgf cm⁻² at 1200 °C in a vacuum of ≈10⁻³ Pa. These junctions showed typical I-V curves described by the RSJ model. The Shapiro steps induced by millimetre wave irradiation of 101 GHz were clearly observed in the I-V curves up to 3 mV, corresponding to at least 1.5 THz (, where e is the unit charge, V the voltage and h Planck's constant).     

Non-Hierarchical Architected Materials with Extreme Stiffness and Strength

Stretch-dominated truss and plate microstructures are contenders in the quest for realizing architected materials with extreme stiffness and strength. In the low volume fraction limit, closed-cell isotropic plate microstructures meet theoretical upper bounds on stiffness but have low buckling strength, whereas open-cell truss microstructures have high buckling strength at the cost of significantly reduced stiffness. At finite volume fractions, the picture becomes less clear but both are outperformed by hollow truss lattice and hierarchical microstructures in terms of buckling strength. Despite significant advances in manufacturing methods, hollow and multi-scale hierarchical microstructures are still challenging to build. The question is if there exist realizable microstructures providing stiffness and strength matching or even beating hard-to-realize hollow or hierarchical microstructures? Herein, single-scale non-hierarchical (first order) microstructures that beat the buckling strength of hollow truss lattice structures by a factor of 2.4 and first- and second-order plate microstructures by factors of 5 and 1.4, respectively, are systematically designed, built, and tested. Stiffness of the microstructures is within 40% of theoretical bounds and beats both truss and second order plate microstructures. The microstructures are realized with 3D printing. Experiments validate theoretical predictions and additional insight is provided through numerical modeling of a CT-scanned sample.     

A mechanistic approach to evaluate the potential of the debonding distress in asphalt pavements

The debonding distress in asphalt pavement structures is a critical problem that affects the performance of asphalt concrete pavements. It occurs at the layer interface due to the poor bond quality between adjacent asphalt concrete layers and/or when stresses at the layer interface exceed the strengths of the material at the interface. The debonding of the adjacent layers, especially the top surface layer of an asphalt pavement, is a contributing factor to the premature cracking of pavements. Hence, the debonding distress can lead to a reduction in the life of the pavement. This paper presents an analytical and experimental framework to evaluate the potential for debonding at the layer interface of asphalt concrete pavements. Computational analysis was performed to determine the critical stress and strain states in layered asphalt pavements under moving vehicle loads using the Layered ViscoElastic pavement analysis for Critical Distresses (LVECD) computer program developed at North Carolina State University. This computational analysis enables a greater understanding of the critical stress that is involved in debonding and the ways that such stress is affected by pavement design parameters and environmental conditions. In addition, a prediction model was developed that can determine the shear bond strength at the interface of asphalt concrete layers with different tack coat materials at various temperatures, loading rates and normal confining stresses. The systematic and mechanistic framework developed in this study employs the maximum shear ratio concept as a shear failure criterion and provides a tool to evaluate the effects of various loading, environmental and pavement factors on the debonding potential of asphalt pavements. The overall advantages of the mechanistic framework and approach using the LVECD analysis tool will help lead to better understanding of the debonding mechanism, proper selection of the tack coats, and economic benefit in highway pavement maintenance and rehabilitation costs.     

Mechanical properties of concrete containing phase-change material

This study aimed to investigate the mechanical properties of concrete containing solid–liquid phase-change material (PCM) and focused on two key factors. First, a systematic study on the mechanical performance of PCM-modified concretes was conducted, including compressive, elastic modulus, and shrinkage tests. Second, because PCM provides high latent heat during the solid–liquid phase change, the effects of the solid phase and liquid phase on the mechanical properties of concrete were also explored. Results of this study showed that the solid–liquid phase of PCM affected the mechanical properties of concrete. For example, the compressive strength of 10% PCM concrete in solid phase (23 °C) and liquid phase (40 °C) at 28 days was 29.30 and 19.57 MPa, respectively. In addition, with increasing PCM content, the mechanical properties were degraded. For example, 10, 20, and 30% of PCM content lowered the compressive strength by 35.4, 58.4, and 74.3%, respectively. Therefore, concrete with PCM may not be suitable for structural elements. However, PCM is an important solution for optimizing energy consumption in modern buildings. It can absorb or emit large amounts of heat to store or release thermal energy. These properties can be used to control building temperatures resulting in energy saving and carbon reduction.     

Thermal,mechanical and drug release characteristics of an acrylic film using active pharmaceutical ingredient as non-traditional plasticizer

Abstract

The objective of this study was to investigate thermal and mechanical properties as well as in vitro drug release of Eudragit® RL (ERL) film using chlorpheniramine maleate (CPM) as either active pharmaceutical ingredient or non-traditional plasticizer. Differential scanning calorimeter was used to measure the glass transition temperature (T_g) of 0–100% w/w CPM in ERL physical mixture. Instron testing machine was used to investigate Young’s modulus, tensile stress and tensile strain (%) of ERL film containing 20–60% w/w CPM. Finally, a Franz diffusion cell was used to study drug release from ERL films obtained from four formulations, i.e. CRHP0/0, CRHP0/5, CRHP2/0 and CRHP2/5. The T_g of ERL was decreased when the weight percentage of CPM increased. The reduction of the T_g could be described by Kwei equation, indicating the interaction between CPM and ERL. Modulus and tensile stress decreased whereas tensile strain (%) increased when weight percentage of CPM increased. The change of mechanical properties was associated with the reduction of the T_g when weight percentage of CPM increased. ERL films obtained from four formulations could release the drug in no less than 10?h. Cumulative amount of drug release per unit area of ERL film containing only CPM (CRHP0/0) was lower than those obtained from the formulations containing traditional plasticizer (CRHP0/5), surfactant (CRHP2/0) or both of them (CRHP2/5). The increase of drug release was a result of the increase of drug permeability through ERL film and drug solubility based on traditional plasticizer and surfactant, respectively.