Al_(10)Zn_(2.9)Mg_(1.7)Cu超高强铝合金的喷射成形制备研究

采用喷射成形技术制备了Al1 0 Zn2 .9Mg1 .7Cu高强高韧铝合金沉积坯件 ,研究了喷射成形制备过程中各工艺参数对沉积坯件的成形性、显微组织、致密度的影响 ,确定了适当的工艺参数 ,研究了沉积坯件的热挤压及热处理工艺 ,对材料的组织进行了分析并对不同状态的材料性能进行了比较。研究结果表明 :当喷射成形工艺参数合理时 ,沉积坯件具有良好的成形性与致密度 ,在随后的热挤压过程中 ,通过较低的挤压比即可使材料达到全致密 ;通过对合金进行适当的热处理 ,材料的极限抗拉强度达到 810MPa ,同时延伸率保持在 8%～ 11% ,该材料是一种理想的轻质高强结构材料。     

我国内螺纹铜管的生产技术与发展方向

本文论述了我国内螺纹铜管业生产、工艺、产品技术条件、齿型及市场现状 ,提出了内螺纹铜管的研发方向。     

Chemical mechanical polishing of polymer films

Strategies to reduce capacitance effects associated with shrinking integrated circuit (IC) design rules include incorporating low resistivity metals and insulators with low dielectric values, or “low-κ” materials. Using such materials in current IC fabrication schemes necessitates the development of reliable chemical mechanical polishing (CMP) processes and process consumables tailored for them. Here we present results of CMP experiments performed on FLARE™ 2.0 using a specialized zirconium oxide (ZrO₂) polishing slurry. FLARE™ 2.0 is a poly(arylene) ether from AlliedSignal, Inc. with a nominal dielectric constant of 2.8. In addition, we provide insight into possible removal mechanisms during the CMP of organic polymers by examining the performance of numerous abrasive slurries. Although specific to a limited number of polymers, the authors suggest that the information presented in this paper is relevant to the CMP performance of many polymer dielectric materials.     

Catalytic behavior of YBa2Cu3O7-x in the partial oxidation of methanol to formaldehyde

The partial oxidation of methanol to formaldehyde was studied over YBa₂Cu₃O_7-x catalyst in a flow reactor. The structural change of YBa₂Cu₃O_7-x before and after the reaction was measured by means of XRD and iodometric titration method. The catalytic characteristics of YBa₂Cu₃O_7-x for the partial oxidation of methanol to formaldehyde was due to copper ions. It was found that Cu⁺² was responsible for the higher selectivity for formaldehyde.     

硫脲树脂对Cu~(2+)吸附性能研究

考察了不同吸附时间、pH值和吸附温度下,聚对苯甲酰基硫脲树脂和聚酯基硫脲树脂对Cu2+的吸附性能影响;并对吸附动力学和热力学进行了研究。     

Preparation of ultra-fine copper powder and its lead-free conductive thick film

In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing.     

Copper(II) removal from aqueous solutions by fly ash

The removal of Cu(II) by adsorption on fly ash has been found to be concentration, pH and temperature dependent. The kinetics of adsorption indicates the process to be diffusion controlled. The Langmuir constants have been calculated at different temperatures, and the adsorption has been found to be endothermic (ΔH = 15.652 kcal mol^?1). The maximum removal is observed at pH 8.0, and variation in adsorption with pH has been explained on the basis of surface ionisation and complexation.     

A kinetic model for the acid-oxygen pressure leaching of Ni–Cu matte

A semi-empirical mathematical model for the acid-oxygen pressure leaching of Ni–Cu matte is presented, based on data from batch leaching experiments. The primary controlling factor in the leaching process is found to be galvanic inhibition of the more highly oxidized copper and nickel sulfide species by less oxidized species, particularly Ni alloy and Ni₃S₂. The leaching rate of many species is greatly reduced by the presence of one or both of these phases, and others will not commence leaching until neither is present. The mathematical model is based on first-order chemical reaction controlled rate expressions, as the reactions occurring are electrochemical in nature. Mass transfer effects are included only empirically. Some possibly diffusion-related phenomena are noted, although the model is not extended to incorporate these effects on a fundamental level. The model is verified and extended by the inclusion of several different factors that were tested experimentally. The effects of variations in O₂ flow rate and partial pressure, initial particle size, reaction pulp density and initial acid concentration were all studied, and included in the model. Variations in O₂ flow rate and partial pressure are found to affect the reaction rates via the dissolved oxygen concentration in the solution phase.     

氮气氛下LTCC基板Cu共烧金属化研究

从PMMA型LTCC素坯膜的制备和PMMA的排胶机理两方面，研究了LTCC基板Cu共烧金属化。结果表明，采用PMMA作为粘结剂的流延浆料具有剪切变稀行为，所得的流延坯膜微观组织均匀，叠压后坯体内部无分层现象。热失重、差热和傅立叶红外光谱联用分析结果表明高纯N2气氛中PMMA以解聚机理热解，热解后释放的主要产物为丙烯酸甲酯。在高纯N2气氛中LTCC与Cu共烧后Cu金属化膜平整、致密，连通良好。经测试，基板表面Cu导体方阻小于5mΩ/□。     

用于铜的化学机械抛光液的研究

文中介绍了一种以碱性抛光液对铜进行全局平面化的方法 ,讨论了以 Si O2 水溶胶为磨料的抛光液在Cu-CMP过程中的化学 (络合 )作用及反应机理 ,并给出了抛光液的配比及上机实验结果。结果表明 :该抛光液用于对带有阻挡层和介质层的铜抛光 ,达到了对铜层的高去除速率和高选择比 ,取得了较好的全局平面化效果