金刚石/铜电子封装复合材料的研究状况及展望

随着电子信息技术的迅速发展,电子仪器向小型化、便携化、多功能化方向发展,传统的电子封装材料已经不能满足现代集成电路电子封装的要求。金刚石/铜复合材料作为新型电子封装材料,具有高的热导率、可控的热膨胀系数、较低的密度等特点,近年来成为研究的热点。本文概述了金刚石/铜复合材料的制备工艺及优良性能,并对其未来应用进行了展望。     

高热负荷对钨铜材料工作应力分布影响的研究

采用高热负荷实验并结合有限元计算考察和分析了热流密度对钨铜合金工作应力分布的影响。结果表明：钨铜材料作为过渡层可以降低工作应力,当热流密度为1 MW/m2时,在钨板与铜块间焊接W60Cu合金作为过渡层,可使最大应力值比没有过渡层降低36%左右;工作时最大应力出现在两侧焊接层附近,并随热流密度增大而增大;钨铜合金（W60Cu）作为过渡层的试样在两焊缝处的应力,上部焊缝应力较大,下部焊缝应力较小。     

The annealing of bainite while being concurrently deformed

Abstract

Annealing with oncurrent deformation has been carried out on a bainitic high-carbon steel in a temperature range just below the lower transformation temperature, i.e. ～850 – 975K.

The enhancement of carbide coarsening was measured during hot torsion under conditions of (a) constant strain rate and (b) constant experiment duration. The carbide coarsening rates are compared with results obtained from earlier experiments employing isothermal annealing without deformation, and the enhancement of coarsening due to concurrent deformation is quantitatively assessed from measurements of the mean particle radius and mean free ferrite path.

From kinetic data, the rate limiting step in coarsening during concurrent deformation is identified as the self-diffusion of iron and two dominant mechanisms are proposed which result in a discontinuity of coarsening rate at critical strain levels. The effective diffusion coefficient for coarsening is shown to be a linear function of strain rate and the strain rate coefficient is evaluated from the present data for bainitic 1070 steel.

Résumé

Un traitement de revenu associé à une déformation simultanée a été appliqué à un acier bainitique à haut carbone dans une gamme de températures juste inférieures à la température de transformation (850–975K).

L'accélération de la coalescence des carbures pendant la torsion à chaud a été mesurée soit àvitesse de déformation constante, soit à temps d'expérience constant.

Les lois de coalescence des carbures sont comparées àcelles obtenues au cours d'un traitement isotherme sans déformation et l'accélération de la croissance due àune déformation simultanée est évaluée quantitativement grâce aux mesures du rayon moyen des particules et de la longueur moyenne de ferrite libre.

A partir des résultats de cinétique, le facteur limitant la coalescence sous déformation est identifie comme étant l'auto-diffusion du fer et les auteurs proposent deux mécanismes prédominants qui conduisent à une discontinuité de la vitesse de coalescence pour des niveaux critiques de la déformation. Le coefficient effectif de diffusion pour la coalescence est une fonction linéaire de la vitesse de déformation et le coefficient de vitesse de déformation est évalué à partir de ces résultats expérimentaux pour un acier bainitique 1070.     

SiCp/Cu电子封装材料研究进展

详细介绍了SiCp/Cu电子封装材料的主要制备方法及应用情况,目前国内外SiC/Cu电子封装材料的主要制备方法有粉末冶金法、放电等离子烧结法、无压浸渗法、压力浸渗法和反应熔渗法,其中包覆粉末热压烧结法和压力浸渗法是目前研发应用较广泛的两种方法.分析了SiC与Cu之间的界面反应机理,并指明SiCp/Cu电子封装材料的制备要解决的主要问题就是在SiC与Cu之间设置界面阻挡层,进而详细阐述了SiCp/Cu电子封装材料主要界面改性方法及其调控效果,并指出目前应用最好的两种方法是物理气相沉积法和化学气相沉积法.     

Fe添加对Cu/Zn/ZrO2催化剂CO2加氢合成低碳醇性能的影响

采用共沉淀法制备了添加不同Fe含量的Cu/Zn/ZrO2催化剂,在523 K、3.0 MPa和3000 h-1的条件下,考察了不同Fe含量对Cu/Zn/ZrO2催化剂上CO2加氢合成低碳混合醇性能的影响.并采用低温N2吸附、X射线衍射(XRD)、程序升温还原(H2-TPR)和CO2程序升温脱附(CO2-TPD)技术对催化剂进行了表征.结果表明:在Cu/Zn/ZrO2催化剂中加入适量的Fe后,可以提高催化剂的活性、醇的时空产率(STY)以及C2+醇的选择性.     

Effective thermal conductivity of Cu/diamond composites containing connected particles

An analytical model for the thermal conductivity of Cu/diamond composites with connected particles is presented by replacement of a cluster of connected particles with an equivalent polycrystal subsequently using a multiple effective medium approach. By applying this model to the measured thermal conductivity of Cu/diamond composites prepared by high pressure high temperature sintering technique reported in the literature, we show that it quite well describes the observed thermal conductivity enhancement induced by the connected particles. We estimate the value of connected particle loading in real composites and show that large particles are easier to form the bonding contact than small particles. The present work also demonstrates that the sensitivity of thermal conductivity contribution from the connected particles strongly depends on the particle size, and their pronounced thermal conductivity enhancement should lie within the certain particle size range.     

Microstructural modification and ageing behaviour of the Al–17Si–5Cu alloy using a novel approach

A novel short duration heat treatment schedule is proposed in the present investigation for the Al-17?wt-% Si-5?wt-% Cu alloy (AR alloy). The existing heat treatment uses long duration (4–24?h) holding at solutionising temperature prior to ageing treatment. In the present investigation, the AR alloy is subjected to isothermal holding at 590°C for 15?min followed by warm water quenching prior to the normal ageing schedule. Detailed microstructural investigations involving size and shape of primary as well as eutectic Si particles, porosity measurements along with hardness and tensile property characterisation are carried out to find the effect of isothermal heat treatment. The study reveals considerable improvement in microstructure and mechanical properties after this isothermal heat treatment.     

Investigation on interface of Al/Cu couples in compound casting

Abstract

The joining of Al and Cu commercially pure metals using the compound casting process has been investigated where an aluminium melt is cast onto a solid cylindrical copper insert. The microstructure of the interface between copper core and surrounding aluminium was characterised by optical microscopy, scanning electron microscopy, energy dispersive X-ray spectroscopy and Vickers hardness tests. Results showed that five separate reaction layers are formed in the reaction interface of core and surrounding Al. These layers included Cu₉Al₄, AlCu and Al₂Cu intermetallic compounds; a eutectic layer; and a eutectic α-Al dendritic structure layer. Owing to the presence of hard and brittle intermetallic compounds within reaction layers, microhardness profile showed a peak of 300 HV where both parent metals have hardness <50 HV. Microhardness profile also showed that hardness decreases from the copper to the aluminium side.     

Influence of pH and ionic strength on Cu(II) biosorption by aerobic granular sludge and biosorption mechanism

BACKGROUND: To elucidate the process and mechanism of Cu(II) biosorption onto aerobic granules, the influence of pH and ionic strength (IS) on the Cu(II) biosorption capacity and biosorption mechanism was studied. RESULTS: The biosorption of Cu(II) onto aerobic granules under different conditions of pH (3, 4 and 5), IS (0, 0.1 and 0.5 mol L^?1) and Cu(II) concentration (25–250 mg L^?1) was investigated. The correlation coefficients of the pseudo‐second‐order kinetic model were , while those of the Langmuir and Freundlich models were and respectively. The biosorption of Cu(II) increased with increasing pH, while the effect of IS on the biosorption was complicated, which could be explained by the competition among different metallic ions, colloidal chemistry theory or Derjaguin, Landau, verwey and Overbeek (DLVO) theory. About 70% of the solid phase Cu(II) was exchanged by Na(I), Ca(II) and Mg(II) released from the aerobic granules at pH 4 and 5. The results revealed that ion exchange is the most important biosorption mechanism but that other mechanisms also play a part. CONCLUSION: The sorption performance can be optimised by adjusting the pH and IS. Aerobic granules can be used as an alternative effective, economical and practical biosorbent for heavy metal removal. Copyright © 2008 Society of Chemical Industry     

High-performance Cu/MgO–Na catalyst for methanol synthesis via ethyl formate

A novel hybrid catalyst system containing alkali formate and Cu/MgO–Na was developed to synthesize methanol from syngas via ethyl formate in a slurry reactor. The results exhibited that high CO conversion (>80%) and methanol selectivity (90%) with a mass space velocity of 1800 L(STP)/(h kg) were achieved at a low temperature of 433 K and at 5.0 MPa. A synergic function between HCOOM (M = Li, Na, K, Rb and Cs) and Cu/MgO–Na was in existence for promoting the reaction performance, in which sodium formate showed the optimizing synergy with Cu/MgO–Na catalyst. In addition, the nature of the solid copper catalysts also had a remarkable influence on the catalytic activity.