Low-energy electron-enhanced etching of HgCdTe

Low-energy electron-enhanced etching (LE4) is applied to HgCdTe to eliminate ion-induced surface damage. First, LE4 results for patterned samples are illustrated. The LE4 mechanism is understood from a mechanistic study in terms of three etch variables: direct current (DC) bias, gas composition, and sample temperature. For this paper, the effects of DC bias (electron energy) and gas composition (CH₄ concentration) are summarized qualitatively, followed by quantitative evidence. Etch rate, the amount of polymer, surface stoichiometry, and surface roughness have specific relations with each etch variable under competition between pure LE4 and polymer deposition.     

激光诱导湿刻在微结构加工中的应用

介绍了激光诱导湿刻技术在各种材料微加工中的应用,同时对其作用机理和刻蚀特性进行了简单探讨,并对其发展进行了展望。     

Experimental study and analysis of corner compensation structures for CMOS compatible bulk micromachining using 25 wt% TMAH

In the present work, most common compensation structures (〈1 1 0〉 squares and 〈1 0 0〉 bars) have been used for convex corner compensation with 25 wt% TMAH-water solution at 90±1 °C temperature. Etch flow morphology and self-align properties of the compensating structures have been investigated. For 25 wt% TMAH water solution {3 1 1} plane is found to be responsible for corner undercutting, which is the fast etch plane. Etch-front-attack angle is measured to be 24°. Generalized empirical formulas are also discussed for these compensation structures for TMAH-water solution. 〈1 1 0〉 square structure protects mesa and convex corner and is the most space efficient compared to other compensation structures, but unable to produce perfect convex corner as 〈1 0 0〉 bar type structures. Both the 〈1 0 0〉 bar structures provide perfect convex corners, but 〈1 0 0〉 wide bar structure is more space efficient than the 〈1 0 0〉 thin bar structure. Implications of these compensation structures with realization of accelerometer structure have also been discussed. A modified quad beam accelerometer structure has been realized with these compensation structures using 25 wt% TMAH.     

Reading the footprints of strained islands

We report on recent advances in the understanding of surface processes occurring during growth and post-growth annealing of strained islands which may find application as self-assembled quantum dots. We investigate the model system SiGe/Si(0 0 1) by a new approach based on “reading the footprints” which islands leave on the substrate during their growth and evolution. Such footprints consist of trenches carved in the Si substrate. We distinguish between surface footprints and footprints buried below the islands. The former allow us to discriminate islands which are in the process of growing from those which are shrinking. Islands with steep morphologies grow at the expense of smaller and shallower islands, consistent with the kinetics of anomalous coarsening. While shrinking, islands change their shape according to thermodynamic predictions. Buried footprints are investigated by removing the SiGe epilayer by means of selective wet chemical etching. Their reading shows that: (i) during post-growth annealing islands move laterally because of surface-mediated Si–Ge intermixing; (ii) a tree-ring structure of trenches is created by dislocated islands during their “cyclic” growth. This allows us to distinguish coherent from dislocated islands and to establish whether the latter are the result of island coalescence.     

Effects of a-Si:H resist vacuum-lithography processing on HgCdTe

A vacuum-compatible process for carrying out lithography on Hg_1−xCd_xTe and CdTe films was previously demonstrated. It was shown that hydrogenated amorphous silicon (a-Si:H) could be used as a dry resist by projecting a pattern onto its surface using excimer laser irradiation and then developing that pattern by hydrogen plasma etching. Pattern transfer to an underlying Hg_1−xCd_xTe film was then carried out via Ar/H₂ plasma etching in an electron cyclotron resonance (ECR) reactor. Despite the successful demonstration of pattern transfer, the possibility of inducing harmful effects in the Hg_1−xCd_xTe film due to this vacuum lithography procedure had not been explored. Here we present structural and surface compositional analyses of Hg_1−xCd_xTe films at key stages of the a-Si:H vacuum lithography procedure. X-ray diffraction double crystal rocking curves taken before and after a-Si:H deposition and after development etching were identical, indicating that bulk structural changes in the Hg_1−xCd_xTe film are not induced by these processes. Cross-section transmission electron microscopy studies show that laser-induced heating in the 350 nm thick a-Si:H overlayer is not sufficient to cause structural damage in the underlying Hg_1−xCd_xTe surface. In vacuo surface analysis via Auger electron spectroscopy and ion scattering spectroscopy suggest that the hydrogen plasma development process produces Hg-deficient surfaces but does not introduce C contamination. However, after ECR plasma etching into the Hg_1−xCd_xTe film, the measured x value is much closer to that of the bulk.     

二元光学元件——微透镜

介绍了二元光学的产生和发展,着重阐述了二元光学元件之一的微透镜的设计、制作和测试方法以及它们的主要应用。     

Modeling of silicon oxynitride etch microtrenching using genetic algorithm and neural network

A prediction model of etch microtrenching was constructed by using a neural network. The etching of silicon oxynitride films was conducted in C₂F₆ inductively coupled plasma. The process parameters that were varied in a statistical experimental design include radio frequency source power, bias power, pressure, and C₂F₆ flow rate. The etch microtrenching was quantified from scanning electron microscope images. The prediction accuracy of optimized neural network model with genetic algorithm had a root mean-squared error of 0.03 nm/min. Compared to conventional model, this demonstrates an improvement of about 32%. The constructed model was used to infer etch mechanisms particularly as a function of pressure. Roles of profile sidewall variations were investigated by relating them to the microtrenchings. The pressure effect was conspicuous at lower source power, lower bias power, or higher C₂F₆ flow rate. Microtrenching variations could be reasonably explained by the expected ion reflection from the profile sidewall. The pressure effect seemed to be strongly affected by the relative dominance of fluorine-driven etching over polymer deposition initially maintained in the chamber.     

溶剂对微控直写含能油墨的性能影响

以CL-20作为含能油墨炸药主体,采用硝化纤维素作为粘结剂,分别以丙酮和乙酸丁酯为溶剂配制含能油墨,研究了不同溶剂对含能油墨性能的影响。所得的两种含能油墨均可流畅书写,成型后光滑、无裂纹。经SEM、XRD表征和DSC分析,乙酸丁酯为溶剂的含能油墨在致密程度、晶型稳定性及组分相容性等方面均优于溶剂为丙酮的含能油墨。对两种溶剂的含能油墨进行固化时间测定,丙酮为溶剂的含能油墨的固化时间约为45min,乙酸丁酯为溶剂的含能油墨的固化时间为180min。通过靶线法测得丙酮为溶剂的含能油墨的平均爆速为5 499m/s,乙酸丁酯为溶剂的含能油墨的平均爆速为8 971m/s。     

Direct3D在航空火控空战模拟系统开发中的应用

研究了 Direct3D技术在航空火控空战模拟系统开发中的应用 ,介绍了软件开发方法 ,最终得到了成果软件。     

用于无线局域网的CMOS射频前端发送器

介绍了一种用于802.11b无线局域网的高线性度射频前端发送器的设计与实现。该发送器采用直接转换结构,从而最大程度地减小了所需的片外和片上元件。电路采用0.18μmCMOS工艺实现。发送器包括两个低通滤波器、一个单边带混频器、一个功率预放大器和一个产生正交本振信号的除2分频器。发送器能够以3 dB一级提供12 dB的增益控制,输出1 dB压缩点为7.7 dBm,正常输出功率为2 dBm。整个发送器工作时消耗电流40 mA,工作电压1.8 V,芯片面积(不包括焊盘)为1.8 mm×1.5 mm。