ESPI Measurements of Strain on a CFRP‐Reinforced Bending Beam1

Abstract: This paper presents 3D electronic speckle pattern interferometry (ESPI) measurement results of strain components at the end of a carbon‐fibre reinforced polymer (CFRP) plate adhesively bonded to a reinforced concrete beam. To minimise speckle decorrelation because of the inevitable rigid‐body motion of the measured specimen, the load was increased in small increments. Two evaluation schemes are compared: the step‐by‐step addition of the measured displacement components and regain of the correlation by image shifting. Strain is evaluated by interpolating the in‐plane displacement measurements along selected lines, and is compared with results from finite element analysis (FEA). An uncertainty estimate is given.     

基于ESPI技术的混凝土单轴拉伸断裂特性研究

为了研究混凝土的拉伸断裂特性,对带有预制切口的C80高强混凝土棱柱体进行单轴拉伸试验,采用电子散斑干涉(ESPI)技术测量棱柱体表面的场位移等信息,分析加载过程得到混凝土的断裂参数以及断裂特性等。为进行对比分析,本次试验还采用线性位移计和夹式位移计测量试件的变形程度。对比结果表明ESPI技术的测量结果与夹式位移计结果吻合较好,证实了ESPI技术用于测量混凝土表面位移场的精确性和可行性。分析得到:初裂点应力约为峰值应力的82%;峰值下裂缝口张开位移(CMOD)为11 μm,结合公式得到混凝土在单轴拉伸下的断裂韧度约为0.41 MPa·m^1/2,断裂能约为24.71 N/m;利用两种拟合公式对试验应力-应变关系进行拟合,得到了较好的拟合结果。最后,通过不同加载步骤下ESPI技术测得的位移云图分析裂缝口张开位移随试件宽度的变化规律,得到了单轴拉伸下的裂纹扩展规律。     

利用激光偏振特性的电子散斑面内全场位移测量技术的研究

提出一种能够同时测量面内全场位移的电子散斑测量光路结构,解决了面内全场位移在瞬态和不可重复情况下无法测量的问题。将激光束分成四路照明光,分别安排在水平和垂直平面内,利用激光器的偏振特性安排光路,使水平平面内两束光的偏振方向相同,垂直平面内两束光的偏振方向相同,但这两个平面中的偏振方向又互相垂直。对转动圆盘内位移测量,取得了满意的结果,用一幅散斑图同时得到了表示水平和垂直分量的散斑条纹     

用连续相位扫描进行振动定量分析

利用光学连续相位扫描和正弦相位调制相结合 ,提出一种 ESPI时间平均测振的定量分析方法。由于采用光学连续相位扫描 ,该方法具有较强的抗环境干扰能力 ,不需要精确校准光学相移器 ,并且能自动定量地给出物体的全场振幅分布。     

基于ESPI的图像处理系统

从电子散斑干涉测量技术的基本原理出发 ,通过建立数学模型 ,编制了一种ESPI条纹图像处理软件 ,并通过电子散斑干涉条纹图象特征的分析 ,尝试一种频域滤波去噪算法———DCT指数低通滤波。实验结果表明该方法对ESPI条纹图象是有效的。     

电子散斑干涉场的空间调制与解调技术

提出了偏转物体实现电子散斑干涉（ESPI）条纹调制的新方法。当物体有微小偏转时可形成等间距的干涉条纹,从而形成载波条纹。物体加载后,该条纹受物体变形的调制而发生弯曲变形。采集物体变形前后的条纹,利用Fourier变换法,可解调出变形场的位相,从而实现物体变形场的精确测量。对偏转物体方法的调制机理进行了理论分析,并利用中心加载周边固定圆盘进行了典型实验。结果表明,该方法能够高质量地调制ESPI场,求解位移场。     

改进的电子散斑干涉法

电子散斑干涉法在处理大面内位移物体时,因变形前后散斑场失配,相关性消退,干涉条纹严重退化,导致体现变形的相位信息无法准确获得.针对该问题,将二维数字散斑相关法引入电子散斑干涉法中,由散斑相关法探测导致散斑失相关的二维面内位移场,用数字的方法将失配散斑场进行再对准,使干涉条纹恢复.用离面位移敏感电子散斑光路得到离面位移,再与散斑相关所得的面内位移场相结合,可以求得物体三维位移.最后,对周边固定、中心加载典型试件进行了测量,结果表明该方法是合理可行的.     

Simultaneous in-plane and out-of-plane deformation measurement by speckle multi-recording method

An in-plane and out-of-plane deformation simultaneous measurement method using only two speckle patterns grabbed before and after deformation of an object with rough surfaces using two cameras has been proposed. However, there are some problems concerning the setup of optical system, the aspect ratio of grabbed image data and so on in the conventional method. To solve these problems, the new optical system is proposed by using the multi-recording technology. Though multi-recording technologies have been already employed conveniently in the off-axis digital holography, the technologies have not been used functionally enough in speckle interferometry. In this paper, an in-plane and out-of-plane deformation simultaneous measurement is performed by the proposed method based on multi-recording technology in speckle interferometry. From experimental results, it can be confirmed that the proposed optical system can measure simultaneously in-plane and out-of-plane deformations in high resolution by one camera.     

基于ESPI的集成电路封装热特性研究

为了快速有效地测试和分析集成电路封装的热特性,本文以激光电子散斑干涉术(ESPI)为测量手段,在分析了集成电路热学结构模型的基础上,建立了离面位移的响应方程。选用大规模的集成电路CPU486为实验对象,并以动态老化的方式实现了实验样品的功率加载,通过电子散斑干涉方法得到了离面位移的响应曲线,并对其处理得到了热阻-热容关系曲线。实验结果与相关文献数据吻合,表明利用电子散斑测量集成电路封装的热特性是可行性的。     

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Electronic speckle-pattern interferometry (ESPI) was applied for noncontact, real-time evaluation of thermal deformation in a flip-chip package. The spatial resolution of ESPI was increased to submicron scale by magnifying the areas studied in order to measure the deformation of such small-scale components as the solder in the flip-chip package. Thermal deformation in the horizontal and vertical directions around the solder joints was measured as two-dimensional mappings during heating from 25 to 125 °C. ESPI was successful in obtaining information on the complicated deformation field around the solder joints. Furthermore, the shear strain could also be calculated using the measured thermal deformation around each solder joint. The applicability of ESPI to flip-chip packages was verified by comparing the ESPI results with those of finite-element analysis (FEA).