SiCp/Cu复合材料热膨胀性能研究

以电子封装基片为应用背景,采用挤压铸造方法制备了体积分数为55％,不同颗粒粒径增强的SiCp／Cu复合材料,并分析测试了颗粒粒径和热处理状态对材料热膨胀性能的影响规律．显微组织观察表明,复合材料颗粒分布均匀,材料组织致密;热膨胀性能测试表明,随着温度升高,复合材料的热膨胀系数呈非线性增加;SiC体积分数相同时,减小SiC颗粒尺寸有利于降低复合材料的热膨胀系数;退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数．     

一种实用的微生物工程的建模方法

利用设计的微生物工程数据处理与建模软件包，对Ｌｏｇｉｓｔｉｃ方程的理论进行了研究，提出了一种实用的建模方法     

包装用高含水量聚氨酯组合料的研制

研制开发的包装用聚氨酯组合料,具有含水量高、料液稳定及成品泡孔细密、均匀等特点。该组合料含水量约为聚醚多元醇的24％,泡沫密度为9．5kg／m^3,压缩强度为10．1kPa。     

锦纶6帘子线高速纺卷绕成形影响因素浅析

从工艺和设备上探讨了影响锦纶6帘子线高速纺卷绕成形的主要影响因素。结果表明:对于2100dtex产品,卷绕角为9.0°-9.5°,卷绕张力控制在0.098 cN／dtex,K值(摩擦辊速度／第四对热牵伸辊速度)选择为93％,卷绕机接触压力为300 kPa,上油率控制在1.2％-1.3％,有利于卷绕成形。对卷绕机卡盘与摩擦辊的平行度、导丝装置等进行定期检查校准,可保证卷绕成形良好。     

Measurement of solder joint strength in freestanding chip-scale packages using a quantitative laser spallation technique

A previously developed laser spallation technique is adapted to measure in situ the tensile strengths of geometrically heterogeneous interfaces, in multilayer freestanding chip-scale packages that were baked for specific temperatures and times. The test procedure involved quantification of the stress waves inside the packages using interferometry, and subsequent stress field quantification, including that at the failed interface, using a wave mechanics simulation. The technique is generally applicable and can be used to test any type of freestanding package. In this work, it is demonstrated on freestanding 0.5?mm-pitch MicroStar BGA^TM packages. The ball grid array joint strengths for Pb-free solders on bare Cu pads were measured to be 942?±?91, 703?±?69, 666?±?70, 441?±?42, and 392?±?45?MPa for samples that were thermally aged for 3, 10, 20, 40, and 80?days, respectively. An important result of our study is that the critical laser energy for causing joint failure was found to be approximately proportional to the peak tensile stress at the joint. This validates the discussion earlier where no stress quantification was carried out, but the interfaces were characterized only in terms of the critical laser energies and the deteriorations in the material microstructure in the solder joint region caused by thermal aging were related to the reductions in the measured critical laser energies. This powerful result shows that in the future it may suffice to use the critical laser energy for material selection and quality control during manufacturing.     

食品包装用塑料材料的卫生安全性

阐述了食品包装用塑料材料的优势与潜在风险;以科技进步不断提升食品包装用塑料材料的功能;建立市场准入机制确保食品包装用塑料材料的卫生安全性。     

咪唑类潜伏性固化剂

微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。要发展高性能、超小型／高密度、低能耗、多功能、高速信号处理和长期可靠性的电子产品，就离不开微电子封装技术。封装材料目前大多使用咪唑类潜伏性固化剂，咪唑类潜伏性固化剂对微电子封装而言非常重要，本文介绍咪唑类潜伏性固化剂的制备方法。以及在电子封装方面的一些应用实例，并对潜伏性固化机理进行扼要的探讨。     

适用于仿真工业控制系统的软件包

本文提出的仿真软件包具有丰富的数学运算功能、控制算法功能、逻辑运算功能及图形编辑能力．软件包结构上充分体现了模块化的设计思想，而在功能及组态方法上又十分类似于分散控制系统相应的功能。使用该软件包，可方便地对各种典型的工业控制系统特别是由微处理机组成的分散控制系统进行仿真研究。     

浅谈大卷装拉丝丝饼常见成形缺陷的改善

通过对大卷装拉丝机丝饼成形缺陷的改善试验研究,找出影响丝饼成形的因素,找到解决方案并实施,最终确定了适合的拉丝工艺参数。经过试验验证,效果良好,提高了大卷装丝饼纱的产品质量,同时提高了生产效率。     

拉丝工艺中张力对直接纱原丝筒外形的影响

阐述了张力对直接纱原丝筒外形影响的力学原理,通过试验验证了张力对直接纱马鞍形、高度和外径影响的规律。在相同拉丝条件下,拉丝张力越大,直接纱的马鞍形越严重;随着拉丝张力的不断增大,直接纱卷径逐渐减小,高度略微增加。