Kelogg合成氨工艺进展

综述了以先进合成氨工艺和转化换热系统技术为代表的Ｋｅｌｏｇｇ第二代合成氨工艺。较详细介绍了钌基催化剂和转化换热器     

熔窑玻璃液流数值模拟的新发展

熔窑玻璃液流数值模拟的新发展赵国昌（清华大学核能技术设计研究院，１０００８４）ＮｅｗＤｅｖｅｌｏｐｍｅｎｔｏｆｔｈｅＮｕｍｅｒｉｃａｌＳｉｍｕｌａｔｉｏｎｆｏｒＦｌｏｗａｎｄＨｅａｔＴｒａｎｓｆｅｒｏｆＧｌａｓｓＭｅｌｔｉｎＴａｎｋＦｕｒｎａｃｅ￥Ｚ...     

激光热源形成过程的定量描述

研究了热传导方程的通解，进而提出激光热源形成的微观机理和热源形成过程的三个理论计算式。对激光热效应的应用具有指导意义。     

重Fermi子体系反常比热的理论研究

利用文献中Ｋｏｎｄｏ格子理论模型，研究了重Ｆｅｒｍｉ子体系比热与温度的反常关系。     

用红外热象技术研究有凸台热源倾斜板的散热

本文介绍红外热象技术在工程热物理研究中某些应用的探索。作为实例，通过热象技术，实验研究了具有水平凸台离散热源的倾斜板的散热，在研究它的自然对流换热部份结合利用激光全息干涉技术。此间着重于分析倾斜角对散热的影响。     

热流法计算高温炉内辐射传热

高温炉内的辐射传热是工业生产中常遇到的问题。过去，人们在应用热流法计算辐射传热时遇到了一定的困难，使计算结果与实际有一定的偏差。本文运用文献［１］中给出的新热流数学模型，开发出由新热流方程与能量方程相耦合的计算机程序，其中的比热流参数由线加热热源情况下计算得到。用该程序计算了实验室用马弗炉内的温度场，并且用热电偶实测了炉内的一些温度值，理论计算与实测值符合很好。     

空气中烧成的镍导体及其应用

将空气中烧成的镍导体用于散热制冷片制作工艺中，可降低成本，提高合格率。通过实验得到的最佳值为：镍导体中４号玻璃（ＳｉＯ２＞３０，Ｂ２Ｏ３＞１０，ＰｂＯ＜５５，ＴｉＯ２少许）的含量４．５％，化学镀镍时间５０ｍｉｎ，方阻４７．５ｍΩ／□，附着力８．１Ｎ／ｍｍ２。     

Impact of uncertainties on estimations of heat pump cycle performance

Sensitivity analysis is used to show how uncertainties in basic factors, such as heat transfer, pressure drop, compressor efficiency, and thermophysical properties, influence the result of heat pump cycle performance estimations. By comparing the results of this analysis with uncertainty levels of estimations and experimental determinations, it is established to what extent improvements in accuracy are needed. The investigation was carried out for several different applications and, as working fluids, both pure substances and non-azeotropic mixtures were examined. It was found that evaporation heat transfer and compressor efficiency are two areas where improvements are needed. It is also shown that estimates using very accurate, substance-specific, equations of state differ from those using more general types by up to 1 % for COP and 2% for capacity.     

快速凝固高碳铁基合金脉冲激光非平衡热处理

利用脉冲Ｎｄ：ＹＡＧ激光辐照对快速凝固高碳铁基合金进行非平衡相变热处理，发现在高能脉冲激光辐照时，原快速凝固共晶碳化物（Ｆｅ３Ｃ）异常迅速地石墨化，获得了含超细石墨球和既含超细石墨球又含快速凝固共晶Ｆｅ３Ｃ的两种新材料，研究表明，这种快速石墨化及上述两类新型材料的形成主要归因于脉冲激光光速辐照产生强烈周期性起伏温度场的“微退火（ｍｉｃｒｏ－ａｎｎｅａｌｉｎｇ）效应。     

Power Dissipation in Spintronic Devices Out of Thermodynamic Equilibrium

Quantum limits of power dissipation in spintronic computing are estimated. A computing element composed of a single electron in a quantum dot is considered. Dynamics of its spin due to external magnetic field and interaction with adjacent dots are described via the Bloch equations. Spin relaxation due to magnetic noise from various sources is described as coupling to a reservoir. Resulting dissipation of energy is calculated and is shown to be much less than the thermal limit, ∼kT per bit, if the rate of spin relaxation is much slower than the switching rate. Clues on how to engineer an energy efficient spintronic device are provided.