X波段85W功率放大模块微带电路设计

针对X波段50 W GaN功放管电路进行改进设计,在满足原有指标的条件下,同时提高电路工作稳定性;巧妙改变微波电路结构,去除了原电路所用的电感,并在不影响电路指标的前提下适当减少了电容、电阻的用量,为整个电路的设计节约了成本。同时,仿真并制作了Wilkinson功分功合器。最终得到85 W功率放大模块,并给出了测试结果。     

A simplification method for capacitance models in AlGaN/GaN high electron mobility transistors under large drain voltage using channel analysis

This article analyzes the bias dependence of gate‐drain capacitance (C_gd) and gate‐source capacitance (C_gs) in the AlGaN/GaN high electron mobility transistors under a high drain‐to‐source voltage (V_ds) from the perspective of channel shape variation, and further simplifies C_gd and C_gs to be gate‐to‐source voltage (V_gs) dependent only at high V_ds. This method can significantly reduce the number of parameters to be fitted in C_gd and C_gs and therefore lower the difficulty of model development. The Angelov capacitance models are chosen for verifying the effectiveness of simplification. Good agreement between simulated and measured small‐signal S‐parameters, large‐signal power sweep, and power contours comprehensively proves the accuracy of this simplification method.     

Preparation and characterization of GaN films grown on Ga-diffused Si （111） substrates

Hexagonal GaN films were prepared by nitriding Ga2O3 films with flowing ammonia. Ga2O3 films were deposited on Ga-diffused Si (111) substrates by radio frequency (r.f.) magnetron sputtering. This paper have investigated the change of structural properties of GaN films nitrided in NH3 atmosphere at the temperatures of 850, 900, and 950℃ for 15 min and nitrided at the temperature of 900℃ for 10, 15, and 20 rain, respectively. X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS) were used to analyze the structure, surface morphology and composition of synthesized samples. The results reveal that the as-grown films are polycrystalline GaN with hexagonal wurtzite structure and GaN films with the highest crystal quality can be obtained when nitrided at 900℃ for 15 min.     

GaN‐based emissive microdisplays: A very promising technology for compact,ultra‐high brightness display systems

High‐brightness GaN‐based emissive microdisplays can be fabricated with different approaches that are listed and described. They consist either of hybridizing a GaN LED array on a CMOS circuit or building a monolithic component on a single substrate. Using the hybridization approach, two types of 10‐μm pixel pitch GaN microdisplay prototypes were developed: (1) directly driven, 300 × 252 pixels and (2) active‐matrix, 873 × 500 pixels. Brightness as high as 1 × 10⁶ and 1 × 10⁷ cd/m² for blue and green arrays, respectively, were reached. GaN‐based emissive microdisplays are suitable for augmented reality systems or head‐up displays, but some challenges remain before they can be put in production.     

Genetic algorithm‐based neural‐network modeling approach applied to AlGaN/GaN devices

An accurate equivalent circuit large‐signal model (ECLSM) for AlGaN‐GaN high electron mobility transistor (HEMT) is presented. The model is derived from a distributed small‐signal model that efficiently describes the physics of the device. A genetic neural‐network‐based model for the gate and drain currents and charges is presented along with its parameters extraction procedure. This model is embedded in the ECLSM, which is then implemented in CAD software and validated by pulsed and continuous large‐signal measurements of on‐wafer 8 × 125‐μm GaN on SiC substrate HEMT. Pulsed IV simulations show that the model can efficiently describe the bias dependency of trapping and self‐heating effects. Single‐ and two‐tone simulation results show that the model can accurately predict the output power and its harmonics and the associated intermodulation distortion (IMD) under different input‐power and bias conditions. © 2012 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2013.     

High power GaN‐HEMT SPDT switches for microwave applications

In this article, the design, fabrication, and on‐wafer test of X‐Band and 2–18 GHz wideband high‐power SPDT MMIC switches in AlGaN/GaN technology are presented. The switches have demonstrated state‐of‐the‐art performance and RF fabrication yield better than 65%. Linear and power measurements for different control voltages have been reported and an explanation of the dependence of the power performances on the control voltage is given. In particular, the X‐band switch exhibits a 0.4 dB compression level at 10 GHz when driven by a 38 dBm input signal. The wideband switch shows a compression level of 1 dB at an input drive higher than 38 dBm across the entire bandwidth. © 2009 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2009.     

High power devices in wide bandgap semiconductors

Silicon carbide (SiC) semiconductor devices for high power applications are now commercially available as discrete devices. Recently Schottky diodes are offered by both USA and Europe based companies. Active switching devices such as bipolar junction transistors (BJTs), field effect transistors (JFETs and MOSFETs) are now reaching the market. The interest is rapidly growing for these devices in high power and high temperature applications. The main advantages of wide bandgap semiconductors are their very hi...     

Impact of ZnO gate interfacial layer on piezoelectric response of AlGaN/GaN C-HEMT based ring gate capacitor

We report on a piezoelectric response investigation of AlGaN/GaN circular high electron mobility transistor (C-HEMT) based ring gate capacitor as a new stress sensor device to be potentially applied for dynamic high-pressure sensing. A ring gate capacitor of C-HEMT with an additional ZnO gate interfacial layer was used to measure the changes in the piezoelectric charge induced directly by the variation of piezoelectric polarization of both gate piezoelectric layers (AlGaN, ZnO) for harmonic loading at different excitation frequences. Our experimental results show that about 10 nm thick piezoelectric ZnO layer grown on ring gate/AlGaN interface of C-HEMT can yield almost a 60% increase in the piezoelectric detection sensitivity of the device due to its higher piezoelectric coefficient. A three-dimensional CoventorWare simulation is carried out to confirm the increase in the measured piezoelectric response of ZnO based ring gate capacitor of C-HEMT.     

Numerical Explanation of Slow Transients in an AlGaN/GaN HEMT

观察了AlGaN/GaN HEMT器件在短期应力后不同栅偏置下的一组漏极电流瞬态,发现瞬态的时间常数随栅偏压变化很小,据此判断这组瞬态由电子陷阱的释放引起.为了验证这个判断,采用数值仿真手段计算了上述瞬态.分别考虑了在器件中不同空间位置的电子陷阱,分析了应力和瞬态中相应的陷阱行为,对比和解释了仿真曲线与测量结果的异同.基于上述讨论,提出测量的瞬态可能是表面深陷阱和GaN层体陷阱的综合作用的结果.     

基于亲水表面处理的GaAs/GaN晶片直接键合

对晶片进行亲水表面处理,在氮气保护下500℃热处理10min,成功实现GaAs与GaN晶片的直接键合,键合质量较好.扫描电子显微镜观测结果表明,键合界面没有空洞.光致发光谱观测结果表明,键合工艺对晶体内部结构的影响很小.可见光透射谱测试结果表明,键合界面具有良好的透光特性.GaAs与GaN晶片直接键合的成功,为实现GaAs和GaN材料的集成提供了实验依据.