跨导为220mS/mm的AlGaN/GaN HEMT

介绍了 Al Ga N/ Ga N HEMT器件的研制及室温下器件特性的测试。漏源欧姆接触采用 Ti/ Al/ Pt/ Au,肖特基结金属为 Pt/ Au。器件栅长为 1 μm,获得最大跨导 2 2 0 m S/ mm,最大的漏源饱和电流密度 0 .72 A/ mm。由 S参数测量推出器件的截止频率和最高振荡频率分别为 1 2 GHz和 2 4GHz。     

GaN基外延膜的激光剥离和InGaN LD外延膜的解理

利用波长为248nm的KrF准分子激光器进行了蓝宝石衬底GaN外延层剥离。对极薄的MOCVD生长的单层GaN外延膜(3μm)和InGaNLD外延膜(5μm)实现了大面积剥离。对剥离蓝宝石衬底背面抛光和未抛光外延片的不同特点作了比较,激光剥离所需的能量密度阈值分别约为200mJ/cm2和300mJ/cm2,优化结果表明,能量密度分别在400mJ/cm2和600mJ/cm2可实现稳定的剥离。同时对剥离后的InGaN多量子阱LD结构薄膜进行了解理,SEM观察显示获得的InGaNLD腔面平整光滑。基于这种技术可以获得无蓝宝石衬底的GaN基光电子和电子器件。     

The effect of organometallic vapor phase epitaxial growth conditions on wurtzite GaN electron transport properties

The growth issues known to effect the quality of GaN organometallic vapor phase epitaxial films are reviewed and the best 300Kmobility vs electron concentration data are discussed. The data probably represent transport properties intrinsic to films grown on sapphire. From the results of Hall measurements, the unintentional donor in high quality GaN films cannot be Si since the donor ionization energy is much larger than that of films intentionally doped with Si (36 vs 26 meV). Electrical properties of a doped channel layer are shown not to be significantly different from those of thick films which implies a viable technology for conducting channel devices. It is argued that 77K Hall measurements are a useful indicator of GaN film quality and a compilation of unintentionally and Si doped data is presented. The 77K data imply that, at least over a limited range, Si-doping does not appreciably change the compensation of the GaN. The 77K data indicate that the low mobilities of films grown at low temperatures are probably not related to dopant impurities.     

The effect of GaN and ain buffer layers on GaN film properties grown on both C-plane and A-plane sapphire

This paper presents a comparative study of the properties of GaN grown by organometallic vapor phase epitaxy, using both a GaN and A1N buffer layer, as a function of sapphire orientation (c-plane vs a-plane). Results are presented for varying the thickness of the buffer layer, varying the growth temperature of the GaN film, and also varying the ammonia/trimethylgallium mass flow ratio. The electron Hall mobilities of GaN films grown on an A1N buffer layer were, in general, higher compared to films grown using a GaN buffer layer. In addition, growth on a-plane sapphire resulted in higher quality films (over a wider range of buffer thicknesses) than growth on c-plane sapphire. The room temperature electron mobilities were also found to be dependent on, not only the growth temperature, but also the ammonia/trimethylgallium mass flow ratio.     

Role of interfacial-charge in the growth of GaN on α-SiC

The growth of GaN and A1N films on (0001) substrates of 6H-SiC has produced high-quality opto-electronic films. The SiC surface at the interface with GaN or A1N is either Si-terminated or C-terminated, and the Si-terminated interface is known to be the better substrate, producing higher-quality films. The polarity of the interface is important, as recognized by Sasaki and Matsuoka. We propose that the main relevant parameter for characterizing the interface and its potential for producing high-quality opto-electronic GaN or A1N films is the interfacial charge, which leads to the best films when the charge is positive and relatively large. The positive charge reduces the size of the Nions at the interface and hence improves the local lattice match. (The charges are approximately −0.45 lei and +0.55 lei on the interfacial N and Si atoms, respectively.) Therefore, while the polarity of the interface is important, the polarity's effect on the local lattice mismatch is what leads to a high-quality interface. These ideas are consistent with XPS data and are supported by electronegativity arguments, by calculations for ordinary mono-bonded GaN/SiC superlattices (with N-Si and Ga-C interfaces) and by computations for superlattices with tri-bonded interfaces. We predict that the tri-bonded N-Si interface of GaN/SiC should produce excellent GaN and AIN films.     

Electrical and optical properties of oxygen doped GaN grown by MOCVD using N2O

Oxygen doped GaN has been grown by metalorganic chemical vapor deposition using N₂O as oxygen dopant source. The layers were deposited on 2″ sapphire substrates from trimethylgallium and especially dried ammonia using nitrogen (N₂) as carrier gas. Prior to the growth of the films, an AIN nucleation layer with a thickness of about 300? was grown using trimethylaluminum. The films were deposited at 1085°C at a growth rate of 1.0 μm/h and showed a specular, mirrorlike surface. Not intentionally doped layers have high resistivity (>20 kW/square). The gas phase concentration of the N₂O was varied between 25 and 400 ppm with respect to the total gas volume. The doped layers were n-type with carrier concentrations in the range of 4×10¹⁶ cm⁻³ to 4×10¹⁸ cm⁻³ as measured by Hall effect. The observed carrier concentration increased with increasing N₂O concentration. Low temperature photoluminescence experiments performed on the doped layers revealed besides free A and B exciton emission an exciton bound to a shallow donor. With increasing N₂O concentration in the gas phase, the intensity of the donor bound exciton increased relative to that of the free excitons. These observations indicate that oxygen behaves as a shallow donor in GaN. This interpretation is supported by covalent radius and electronegativity arguments.     

Highly anisotropic, ultra-smooth patterning of GaN/SiC by low energy electron enhanced etching in DC plasma

Hetero-epitaxial films of GaN(OOOl), deposited on SiC(OOOl) by organometallic vapor phase epitaxy and masked by 200 nm of SiO₂, have been patterned by low energy electron enhanced etching (LE4) in hydrogen and chlorine dc plasmas at room temperature. Lines 2.0 μm wide showed highly anisotropic etching: straight side walls, no overcut, no trenching, and no “pedestal” at the base of the line. Root mean square (RMS) surface roughness of the films as grown was 8.5–10?; after LE4, RMS surface roughness of the etched surfaces was 2.5?.     

可见光LED的进展——发展趋势及蓝色LED(一)

较为详细地叙述了可见光ＬＥＤ的进展，包括发展趋势、蓝色ＬＥＤ、超高亮度ＬＥＤ的研制及应用领域的拓宽     

GaN材料生长研究

用常压ＭＯＣＶＤ方法我们在蓝宝石（０００１）、Ｓｉ（１１１）衬底上，成功地制备出ＧａＮ单晶薄膜材料，取得了ＧａＮ材料的初步测试结果。纯度ＧａＮ为ｎ型，载流子浓度为１０１７～１０１８ｃｍ－３，迁移率为２００～３５０ｃｍ２／Ｖ·ｓ，双晶衍射半峰宽为７′，室温ＰＬ光谱本征发光波长为３７０ｎｍ，并首次观察到掺ＺｎＧａＮ呈ｐ型电导。     

蓝宝石上横向外延GaN薄膜

在蓝宝石衬底上利用金属有机物气相外延(MOCVD)方法对横向外延(ELO)GaN薄膜的生长条件进行了研究.在蓝宝石衬底上利用化学腐蚀的方法刻饰出图案,再沉积低温GaN缓冲层作为外延层的子晶层,以降低外延层与衬底的晶格失配与热失配,制备出低位错密度的GaN外延层.分别利用X射线衍射、原子力显微镜及湿法腐蚀对外延层进行检测.