MOCVD Growth of Doped GaAs/AlGaAs Quantum Heterostructures

The influences of growth techniques of AP-MOCVD GaAs/AlGaAs silicon-doped multi-quantum wells(MQWs), heterostructure bipolar transistors (HBTs), double barrier resonant tunneling diodes(DBRTDs) ontheir structures and performances were studied. Continuously grown MQWs, that is, no growth interruption atthe heterointerfaces, shown blue-shifted, narrower and stronger photoluminescence(PL) compared withinterruptedly grown ones.TEM examination of the interrupted interfaces revealed a bright line correspondingto the compositional fluctuation and impurity adsorption, and indicated noncommutative structures ofAlGaAs/GaAs and GaAs/AlGaAs interfaces. High performance HBTs and DBRTDs were obtained bycontinuously grown method while growth interruption caused performance degradation. It was concluded thatgrowth interruption may cause accumulation of residua1 impurities in the ambient as well as compositionalfluctuation while continuous growth at very low growth rates can overcome such problems.     

镍的金属有机化学气相沉积及相关因素的研究

研究了以碳基镍为沉积源，利用MOCVD技术沉积镍薄膜；讨论了沉积温度及压力对沉积速率的影响，以及利用SEM、XRD、DSC等分析手段来探讨沉积温度及不同沉积基体对薄膜微观形态的影响。结果表明，沉积温度约为150℃可以得到较快的沉积速率，而且薄膜连续具有金属光泽；以铜为沉积基体所得到的薄膜其微观形态中有明显的晶粒，以玻璃为基体得到的薄膜却含有部分非晶态的组织；沉积速率随着反应室工作压力的增加而下降。     

最大振荡频率为200 GHz的蓝宝石衬底AlGaN/GaN HEMT

本文报道了fmax为200GHz的基于蓝宝石衬底的AlGaN/GaN 高电子迁移率晶体管（HEMT）。外延材料结构采用了InGaN背势垒层来减小短沟道效应,器件采用了凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaN HEMT。器件饱和电流达到1.1A/mm,跨导为421mS/mm,截止频率（fT）为30GHz,最大振荡频率（fmax）为105GHz。采用了湿法腐蚀工艺将器件的Si3N4钝化层去除后,器件的Cgs和Cgd减小,器件截止频率提高到50GHz,最大振荡频率提高到200GHz。     

Ku波段宽带氮化镓功率放大器MMIC

基于0.25μm栅长GaN HEMT工艺,采用三级放大拓扑结构设计了一款Ku波段GaN功率放大器.放大器设计从建立大信号模型出发,输出匹配网络和级间匹配网络均采用电抗匹配减小电路的损耗,从而提高整体放大器的功率效率.测试结果表明,该放大器在14.6~18GHz频带内,小信号增益30dB,脉冲饱和输出功率达15W,功率附加效率(PAE)大于32%;在14.8GHz频点处,放大器的峰值功率达19.5W,PAE达39%.该结果表明GaN MMIC具有高频高功率高效率的优势,具有广阔的应用前景.     

蓝宝石衬底上使用氮化硅钝化的AlGaN/GaN高电子迁移率晶体管的研制与特性分析

本文研制了高性能的AlGaN/GaN高电子迁移率晶体管并进行了特性分析。诸如氮化铝插入层、氮化硅钝化、高宽窄比的T型栅、减小欧姆接触电阻和缩短漏源距离等技术被用于提高器件性能。使用半导体参数分析仪和矢量网络分析仪分别对前制器件的直流和交流特性进行了表征。所得80nm栅长的器件其最大漏极电流密度为1.41A/mm,该结果为到目前为止国内文献报道的最大值。同时测得峰值跨导为317mS/mm,特征频率为74.3GHz,最高振荡频率为112.4GHz。     

Preparation and characterization of single crystalline In2O3 films deposited on MgO (110) substrates by MOCVD

Epitaxial indium oxide (In₂O₃) films have been prepared on MgO (110) substrates by metal-organic chemical vapor deposition (MOCVD). The deposition temperature varies from 500 °C to 700 °C. The films deposited at each temperature display a cube-on-cube orientation relation with respect to the substrate. The In₂O₃ film deposited at 600 °C exhibits the best crystalline quality. A clear epitaxial relationship of In₂O₃ (110)|MgO (110) with In₂O₃ [001]|MgO [001] has been observed from the interface area between the film and the substrate. The average transmittance of the prepared films in the visible range is over 95%. The band gap of the obtained In₂O₃ films is about 3.55–3.70 eV.     

Heteroepitaxial growth of indium phosphide on silicon by MOCVD using adduct source

Abstract

The heteroepitaxial growth of InP on Si by low pressure metalor‐ganic chemical vapor deposition is reported. Trimethylindium‐trimethylphosphine adduct was used as In source in this study. From X‐ray and SEM examinations, good crystallinity InP epilayers with mirror‐like surfaces can be grown directly on (100) and (111) p‐type Si substrates. Carrier concentration profile shows that the carrier distribution in the InP epilayer is very uniform. The efficient photo‐luminescence compared with that of InP homoepitaxy shows the good quality of InP/Si epilayers.     

Low-temperature ECR-PEMOCVD deposition of high-quality crystalline gallium nitride films: A comparative study of intermediate layers for growth on amorphous glass substrates

A low temperature growth method based on an electron cyclotron resonance plasma-enhanced metal organic chemical vapor deposition system (ECR-PEMOCVD) was proposed for the growth of GaN (Gallium nitride) films on ordinary amorphous soda-lime glass substrates. To alleviate the large lattice mismatch between GaN film and glass substrate and improve the heat dissipation performance for potential optoelctrical device application, five intermediate layers (Cu, Ni, Ti, Ag, and ITO) were deposited on the glass substrate before the growth of GaN. A comparative study was performed through structural analysis of the as-grown GaN films with various intermediate layers investigated by means of in-situ reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), and atomic force microscopy (AFM). The results indicate that the Ti intermediate layer has a great advantage over other intermediate layers in view of crystalline quality and smooth surface, therefore is more suitable and preferred for the potential application in optoelectronic devices.     

High-performance and current crowding-free InGaN-GaNbased LEDs integrated by an electrically-reverse-connected Schottky diode and a Mg-delta doped p-GaN

This work demonstrates high-performance and current crowding-free InGaN/GaN light-emitting diodes (LEDs) using an electrically-reverse-connected Schottky diode (SD) and an Mg-delta (δ) doped layer.Poss...     

AlGaN/GaN HEMT结构热时间常数谱提取方法的研究

利用电学法对AlGaN/GaN 高电子迁移率晶体管(HEMTs)有源区瞬态温升进行测量.利用非参数拟合算法—局部加权回归散点平滑法(LOWESS)对原始测量数据进行平滑去噪处理,进而得到热时间常数谱,分析AlGaN/GaN HEMTs热传导路径物理结构。与传统平滑去噪方法—多阶指数拟合相比,通过LOWESS算法得到的热时间常数谱更丰富,得到RC网络更多,进而热传导路径结构分析更精细。结果表明,LOWESS非参数拟合算法能够更好的去除测量数据噪声,保留原始离散数据细微的变化趋势。通过该方法所提取的热时间常数谱能描述AlGaN/GaN HEMTs有源区温度细微变化,帮助研究人员精确分析热传导路径层次构成。