HEMT小信号等效电路提取的仿真软件的研制

该文介绍了一种高电子迁移率晶体管(HEMT)的小信号参数提取及其仿真软件的研制。首先，通过一系列公式推导并提出器件的模型，确定外部参数和内部参数。其次，介绍多偏置点优化算法，并且通过实验证明这种方法的优越性。最后，介绍软件界面设计。     

双层InGaAs沟道InP HEMT

阐述了一种新型的In0.80Ga0.02As／In0.053。Ga0.47 As双沟道InP HEMT结构。采用这种双沟道结构能够有效地提高沟道中电子的迁移率,减小碰撞电离对HEMT性能的影响;从而既显著提高了HEMT的截止频率,又可获得很高的直流输出电流．0．35μ栅长HEMT器件的电流增益截止频率达到120GHz,饱和电流密度、跨导达到790mA/mm、1 050mS／mm,栅极击穿电压和通态击穿电压分别为5V和3．2V。     

基于GaN全桥LLC谐振变换器交错并联系统的损耗分析

为提高全桥LLC谐振变换器交错并联(FBLLC-SP)系统的效率,且使其理论损耗与实际运行损耗更贴近,对比Cascode型GaN HEMT向系统引入单体增强型GaN HEMT,并将其寄生参数引入到损耗模型中,建立了一种适用于单移相(SPS)开环控制和三移相(TPS)双闭环控制的FBLLC-SP系统精准损耗模型;给出最佳...     

Comparison of conventional and pseudomorphic HEMTs performances by drain current transient spectroscopy and L.F. channel noise

This paper describes how in order to evaluate and compare the quality, in terms of trapping mechanisms, of conventional and pseudomorphic HEMTs (S-HEMTs and PM-HEMTs, respectively), isothermal drain current transients and G-R noise analysis have been investigated. The influence of HEMT epitaxial structures, growth techniques (MBE or MOCVD) and surface treatments on electrical performances are then discussed. Finally, the experimental data demonstrates the complementarity of these two techniques.     

Performance assessment and sub-threshold analysis of gate material engineered AlGaN/GaN HEMT for enhanced carrier transport efficiency

The present work explores the features of gate material engineered (GME) AlGaN/GaN high electron mobility transistor (HEMT) for enhanced carrier transport efficiency (CTE) and suppressed short channel effects (SCEs) using 2-D sub-threshold analysis and device simulation. The model accurately predicts the channel potential, electric field and sub-threshold current for the conventional and GME HEMT, taking into account the effect of work function difference of the two metal gates. This is verified by comparing the model results with the ATLAS simulation results. Further, simulation study has been extended to reflect the wide range of benefits exhibited by GME HEMT for its on-state and analog performance. The simulation results demonstrate that the GME HEMT exhibits much higher on current, lower conductance and higher transconductance as compared to the conventional HEMT due to improved CTE and reduced SCEs. This in turn has a direct bearing on the device figure of merits (FOMs) such as intrinsic gain, device efficiency and early voltage. Tuning of GME HEMT in terms of the relative lengths of the two metal gates, their work function difference and barrier layer thickness has further been carried out to enhance the drive current, transconductance and the device FOMs illustrating the superior performance of GME HEMT for future high-performance high-speed switching, digital and analog applications.     

微波半导体功率器件及其应用

本文介绍了微波半导体技术主要特点,功率器件和单片集成电路特性及其应用。     

HEMT的材料结构和二维电子气浓度的关系

给出了ＨＥＭＴ和ＰＨＥＭＴ的数学－物理模型。系统地描述了材料的隔离层、平面调制掺杂层、势垒耗尽层等材料结构尺寸和异质结界面二维电子气浓度及器件沟道电流之间的相互关系。     

Thermal stability of Al0.48In0.52As/Ga0.47In0.53As/InP heterostructure and its improvement by phosphidization

A drastic decrease in the sheet carrier concentration of modulation-doped Al_0.48In_0.52As/Ga_0.47In_0.53As/InP heterostructures has been observed after O₂ plasma treatment followed by thermal treatment up to 350°C. The decrease in sheet carrier concentration, which is speculated to be caused by both plasma damage and impurities penetrating from the surface of the epilayer, can be suppressed substantially by using PH₃ plasma treatment prior to the O₂ plasma and thermal treatments.     

AIGaN／GaN HEMT高温特性的研究进展

回顾了在高温条件下AIGaN／GaN HEMT器件特性的研究进展。发现2DEG的高温特性是影响器件高温性能的根本内在因素，且外延材料的缺陷、衬底及其器件的封装形式也影响器件的高温特性。最后总结了适合高温下工作的AIGaN／GaN HEMT的改进方法。     

不同AlGaN层厚度的AlGaN/GaN高电子迁移率晶体管的静态特性

利用金属有机化合物气相外延技术研究了Al Ga N/ Ga N高电子迁移率晶体管(HEMT)结构的外延生长及器件制作,重点比较了具有不同Al Ga N层厚度的HEMT器件的静态特性.实验发现具有较薄Al Ga N隔离层的结构表现出较好的器件特性.栅长为1μm的器件获得了6 5 0 m A/ m m的最大饱和电流密度和10 0 m S/ mm的最大跨导.