Enhancing light extraction efficiency of GaN LED by combining complex-period photonic crystals with doping

The light extraction efficiency (LEE) of GaN-based light-emitting diodes (LEDs) was limited by intense total internal reflection and the photothermal effect. In order to solve this problem, a method to synergistically control the LEE of GaN-based LEDs by ​​combining the complex-period photonic crystals (PhCs) with M (M = Al, In) material doping is proposed. The forbidden band width of two-dimensional (2D) PhC array, three-dimensional (3D) LED model, M doping, and electromagnetic field distribution are investigated respectively. By doping the M, the LED emission wavelength range is regulated to achieve the dual-band emission. Furthermore, a triangular complex-period photonic structure is introduced to establish stacked or etched PhCs models. By combining the plane wave expansion and finite difference time domain algorithm, the structural parameters of PhCs and M concentration dependent LEE are investigated, and the electromagnetic field distribution is explored also. The results show that the optimal LEEs can be achieved are 19.08% and 13.96% for blue light and ultraviolet, respectively, which are larger than that of traditional flat-panel LED (4%). This work provides theoretical results and technical support for the design of LEDs with high luminous efficiency.     

Lattice constant effects of photonic crystals on the extraction of guided mode of GaN based light emitting diodes

We have fabricated a series of square-lattice hole photonic crystal (2PhC) arrays simultaneously at the un-current injection region on a special sample of GaN based light emitting diode (LED) by using focus ion beam milling (FIBM). The lattice constants of the 2PhC arrays vary from 230 to 1500 nm,while the 2PhC arrays have a constant area of about 9 μm×18 μm and a fixed depth of 150±10 nm which approaches but does not penetrate the active layer. Microscopic electroluminescence images and spectral measuremen...     

AlN阻挡层对AlGaN/GaNHEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

Optimization of ohmic contacts for reliable heterostructure GaAs materials

We studied silver barrier ohmic (Ni/AuGe/Ag/Au) contacts to the GaAs based HEMT structures and observed strong dependence of the cleaning procedures on the ohmic con-tact resistance (R_c), its stability and reliability. The chemical profiles of the metal con-tacts before and after alloying were measured by SIMS. Samples cleaned with the com-bined plasma O₂ and NH₄OH process exhibited excellent results:R _c ∼ 0.1–0.12 ohm-mm when alloyed in the temperature range of 440–540° C and remained stable when subjected to a 200° C and 600mA/mm stress condition for 1000 hr.     

A High Performance InP HEMT with Saw-Toothed Source and Drain

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HEMT器件小信号模型研究

提出一种AlGaAs/GaAs HEMT器件沟道电荷新模型,该模型用一个通用解析函数中系数的不同值来描述二维电子气(2DEG)和AlGaAs层中的电子浓度。在小信号特性上,除考虑了2DEG层外,又在考虑了AlGaAs层、速度饱和、饱和区沟道长度调制效应和源、漏串联电阻RS和RD等效应的基础上,推导出直流特性、跨导、输出电导和栅电容的解析表达式。仿真说明,在较大的栅、漏压范围内,该模型的理论值与实验结果符合良好。     

The effects of gate length variation and trapping effects on the transient response of AlGaN/GaN HEMT’s on SiC substrates

In AlGaN/GaN heterostructure field-effect transistors, the surface defects and dislocations may serve as trapping centers and affect the device performance via leakage current. In this paper we report results of our investigation of the trapping characteristics of Al_0.25Ga_0.75N/GaN HEMT using the Conductance Deep Level Transient Spectroscopy (CDLTS). Two deep level electronic defects were observed labeled E₁ and HL₁, with activation energies E_a1 = 1.36 eV and E_a2 = 0.63 eV. The hole-trap HL₁ is characterized for the first time in our studies. We identified the characteristics of the traps at the AlGaN/GaN interface adjoining the channel and the surface along the ungated region between the gate and the drain, as well as the effects of the surface traps.     

Temperature dependence of Al/Ti-based Ohmic contact to GaN devices: HEMT and MOSFET

In this paper two types of Al/Ti-based Ohmic contacts to Gallium Nitride (GaN) based devices are presented; ImplantedN⁺GaN (like the ones found in the Source/Drain of GaN Metal Oxide Semiconductor Field Effect Transistors-MOSFET) and heterojunction (HJ) AlGaN/GaN contacts (Source/Drain of High Electron Mobility Transistors-HEMT). Sheet resistance (R_sh) and contact resistance (R_c) have been investigated in the temperature (T) range of 25-250 °C. It was found that the R_sh (850/700 Ω□) (25/250 °C) and R_c (2.2/0.7 Ωmm) decrease with T for ImplantedN⁺GaN contact and R_sh (400/850 Ω□) and R_c (0.2/0.4 Ωmm) (weakly for R_c) increase with T for HJAlGaN/GaN contact. Numerical computation based models are used to determine the theoretical R_sh and R_c behavior with T and to fit the experimental values.     

最大振荡频率为200 GHz的蓝宝石衬底AlGaN/GaN HEMT

本文报道了fmax为200GHz的基于蓝宝石衬底的AlGaN/GaN 高电子迁移率晶体管（HEMT）。外延材料结构采用了InGaN背势垒层来减小短沟道效应,器件采用了凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaN HEMT。器件饱和电流达到1.1A/mm,跨导为421mS/mm,截止频率（fT）为30GHz,最大振荡频率（fmax）为105GHz。采用了湿法腐蚀工艺将器件的Si3N4钝化层去除后,器件的Cgs和Cgd减小,器件截止频率提高到50GHz,最大振荡频率提高到200GHz。     

Reliability of AllnAs/lnGaAs/lnP HEMT with WSi ohmic contacts

We have investigated the degradation mechanism of Al_0.48In_0.52As/In_0.53Ga_0.47As/ InP high electron mobility transistors (HEMTs) using WSi ohmic electrodes. Cross-sectional transmission electron microscopy (TEM) observation and en-ergy dispersive x-ray (EDX) analysis reveal impurities diffusion of gate electrode (titanium: Ti) and fluorine (F) in the AlInAs layer after a high temperature (T_a = 170°C operating life test for 500 h. The decrease of drain current (I_ds) during life test shows linear dependence on square root of aging time. It suggests that the degradation is controlled by a diffusion mechanism. Hence, the estimated degradation mechanism of this device is related with decrease of carrier concentration in the epitaxial layer by these diffused impurities. On the other hand, TEM and EDX show no degradation of WSi/InGaAs interface after aging. Therefore, the WSi electrode for this type of HEMT demonstrates excellent high stability under the accelerated operating life test.