AlGaN/GaN HEMT高跨导特性的研究

报道了蓝宝石衬底、栅长为0.3 μ m AlGaN/GaN HEMT器件的制备,在未采用散热设备的条件下测得栅宽为100μ m器件的饱和电流为55.9mA,最大源漏电流为92.1mA.对器件的跨导特性进行了对比,得到最大跨导为306mS/mm的器件.同时对器件进行了微波小信号测试,推导出截止频率fT和最高振荡频率fmax分别为18.5GHz和46GHz.     

Lattice constant effects of photonic crystals on the extraction of guided mode of GaN based light emitting diodes

We have fabricated a series of square-lattice hole photonic crystal (2PhC) arrays simultaneously at the un-current injection region on a special sample of GaN based light emitting diode (LED) by using focus ion beam milling (FIBM). The lattice constants of the 2PhC arrays vary from 230 to 1500 nm,while the 2PhC arrays have a constant area of about 9 μm×18 μm and a fixed depth of 150±10 nm which approaches but does not penetrate the active layer. Microscopic electroluminescence images and spectral measuremen...     

AlN阻挡层对AlGaN/GaNHEMT器件的影响

利用低压MOCVD技术在蓝宝石衬底上生长了AlGaN/GaN异质结和AlGaN/AlN/GaN异质结二维电子气材料,采用相同器件工艺制造出了AlGaN/GaN HEMT器件和AlGaN/AlN/GaN HEMT器件.通过对两种不同器件的比较和讨论,研究了AlN阻挡层的增加对AlGaN/GaN HEMT器件性能的影响.     

Optimization of ohmic contacts for reliable heterostructure GaAs materials

We studied silver barrier ohmic (Ni/AuGe/Ag/Au) contacts to the GaAs based HEMT structures and observed strong dependence of the cleaning procedures on the ohmic con-tact resistance (R_c), its stability and reliability. The chemical profiles of the metal con-tacts before and after alloying were measured by SIMS. Samples cleaned with the com-bined plasma O₂ and NH₄OH process exhibited excellent results:R _c ∼ 0.1–0.12 ohm-mm when alloyed in the temperature range of 440–540° C and remained stable when subjected to a 200° C and 600mA/mm stress condition for 1000 hr.     

HEMT器件小信号模型研究

提出一种AlGaAs/GaAs HEMT器件沟道电荷新模型,该模型用一个通用解析函数中系数的不同值来描述二维电子气(2DEG)和AlGaAs层中的电子浓度。在小信号特性上,除考虑了2DEG层外,又在考虑了AlGaAs层、速度饱和、饱和区沟道长度调制效应和源、漏串联电阻RS和RD等效应的基础上,推导出直流特性、跨导、输出电导和栅电容的解析表达式。仿真说明,在较大的栅、漏压范围内,该模型的理论值与实验结果符合良好。     

Temperature dependence of Al/Ti-based Ohmic contact to GaN devices: HEMT and MOSFET

In this paper two types of Al/Ti-based Ohmic contacts to Gallium Nitride (GaN) based devices are presented; ImplantedN⁺GaN (like the ones found in the Source/Drain of GaN Metal Oxide Semiconductor Field Effect Transistors-MOSFET) and heterojunction (HJ) AlGaN/GaN contacts (Source/Drain of High Electron Mobility Transistors-HEMT). Sheet resistance (R_sh) and contact resistance (R_c) have been investigated in the temperature (T) range of 25-250 °C. It was found that the R_sh (850/700 Ω□) (25/250 °C) and R_c (2.2/0.7 Ωmm) decrease with T for ImplantedN⁺GaN contact and R_sh (400/850 Ω□) and R_c (0.2/0.4 Ωmm) (weakly for R_c) increase with T for HJAlGaN/GaN contact. Numerical computation based models are used to determine the theoretical R_sh and R_c behavior with T and to fit the experimental values.     

Room-temperature continuous-wave operation of GaN-based blue-violet laser diodes with a lifetime longer than 1000 h

GaN-based continuous-wave operated blue-violet laser diodes (LDs) with long lifetime are demonstrated, which are grown on a c-plane GaN substrate by metal organic chemical vapor deposition with a 10 × 600 μm² ridge waveguide structure. The electrical and optical characteristics of a blue-violet LD are investigated under direct-current injection at room temperature (25 °C). The stimulated emission wavelength and peak optical power of the LD are around 413 nm and over 600 mW, respectively. In addition, the threshold current density and voltage are as small as 1.46 kA/cm² and 4.1 V, respectively. Moreover, the lifetime is longer than 1000 hours under room-temperature continuous-wave operation.     

AlGaN/GaN HEMT二维静态模型与模拟

考虑AlGaN/GaN材料的自发、压电极化效应和量子效应,通过泊松方程、薛定谔方程和流体力学方程组的数值自洽求解方法,对AlGaN/GaN HEMT的二维静态模型与模拟问题进行了研究,得到了器件区域的导带图、二维电子气分布、电子温度特性、直流输出和转移特性,并对模拟结果进行了分析与讨论.     

Material Growth and Device Fabrication of GaN-Based Blue-Violet Laser Diodes

Studies on first GaN-based blue-violet laser diodes(LDs) in China mainland are reported.High quality GaN materials as well as GaN-based quantum wells laser structures are grown by metal-organic chemical vapor deposition method.The X-ray double-crystal diffraction rocking curve measurements show the fullwidth half maximum of 180″ and 185″ for (0002) symmetric reflection and (10-12) skew reflection,respectively.A room temperature mobility of 850cm2/(V·s) is obtained for a 3μm thick GaN film.Gain guided and ridge geometry waveguide laser diodes are fabricated with cleaved facet mirrors at room temperature under pulse current injection.The lasing wavelength is 405.9nm.A threshold current density of 5kA/cm2 and an output light power over 100mW are obtained for ridge geometry waveguide laser diodes.     

磷化铟基高电子迁移率晶体管欧姆接触工艺

针对磷化铟(InP)基高电子迁移率晶体管(HEMT),进行了Ni/Ge/Au和Ni/Ge/Au/Ge/Ni/Au两种金属结构快速退火(10～40s)和长时间合金(10min)的实验.通过研究比较,得到了更适用于InP基HEMT器件制作的合金方法.利用Ni/Ge/Au/Ge/Ni/Au结构,在270℃下合金10min形成了典型值0.068Ω·mm的接触电阻.