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61.
Tertiarybutylarsine (TBA) and teriarybutylphosphine (TBP) are liquid organometallic sources that are a safer alternative to arsine and phosphine. In this work, we have grown high-quality In0.53Ga0.47As/InP quantum wells at a temperature of 590° with TBA and TBP partial pressures of 0.4 and 2.5 Torr, respectively. A low-temperature photoluminescence study indicated optimized column V growth interruption times of 0.5 s for In0.53Ga0.47As wells with InP barriers. Using the optimized growth conditions, we have obtained lattice matched In0.53Ga0.47As/InxGa1-xAsyP1-x single quantum-well lasers emitting at 1.55 μm. Broad-area devices with a length of 3.5 mm exhibit a low threshold current density of 220A/cm2. Broad-area lasers containing four quantum wells had a threshold current density of 300A/cm2 for a 3.0 mm cavity length and CW powers of 40 mW per facet for an as-cleaved 4 × 750 μm device.  相似文献   
62.
Hot carrier magnetophonon resonances of n-type Si, short channel InP and p-type InSb were investigated in pulsed high magnetic fields up to 40 T. Using a recently developed high resolution technique in pulsed high fields, many new features of the hot carrier-phonon interactions in high magnetic fields were found.  相似文献   
63.
We explore conditions for achieving laser liftoff in epitaxially grown heterojunctions, in which single crystal thin films can be separated from their growth substrates using a selectively absorbing buried intermediate layer. Because this highly non‐linear process is subject to a variety of process instabilities, it is essential to accurately characterize the parameters resulting in liftoff. Here, we present an InP/InGaAs/InP heterojunction as a model system for such characterization. We show separation of InP thin films from single crystal InP growth substrates, wherein a ≈10 ns, Nd:YAG laser pulse selectively heats a coherently strained, buried InGaAs layer. We develop a technique to measure liftoff threshold fluences within an inhomogeneous laser spatial profile, and apply this technique to determine threshold fluences of the order 0.5 J cm?2 for our specimens. We find that the fluence at the InGaAs layer is limited by non‐linear absorption and InP surface damage at high powers, and measure the energy transmission in an InP substrate from 0 to 8 J cm?2. Characterization of the ejected thin films shows crack‐free, single crystal InP. Finally, we present evidence that the hot InGaAs initiates a liquid phase front that travels into the InP substrate during liftoff.
  相似文献   
64.
The uniformity of deep levels in semi-insulating InP wafers, which have been obtained by multiple-step wafer annealing under phosphorus vapor pressure, was studied using the thermally stimulated current (TSC) and photoluminescence (PL) methods. Only three traps related to Fe, T0 (ionization energy Ei=0.19 eV), T1 (0.25 eV), and T2 (0.33 eV), probably forming complex defects, were observed in the wafer and they exhibited a relatively uniform distribution. PL spectra relating to phosphorus vacancies observed in some regions of the wafer are correlated with a small TSC signal having an ionization energy of 0.43 eV.  相似文献   
65.
Millimeterwave transistor technology is very important for MMIC design and fabrication.An InP HEMT with sawtoothed source and drain is described.The pattern distortion due to the proximity effect of lithography is avoided.High yield InP HEMT with good DC and RF performances is obtained.The device transconductance is 1050mS/mm,threshold voltage is -1.0V,and current gain cut off frequency is 120GHz.  相似文献   
66.
An InP/InGaAs single heterojunction bipolar transistor (SHBT) with high maximum oscillation frequency (fmax) and high cutoff frequency (ft) is reported. Efforts have been made to maximize fmax and ft simultaneously including optimizing the epitaxial structure, base–collector mesa over-etching and base surface preparation. The measured ft and fmax both reached 185 GHz with an emitter size of 1 × 20 μ m2, which is the highest fmax for SHBTs in mainland China. The device is suitable for ultra-high speed digital circuits and low power analog applications.  相似文献   
67.
通过合理的外延层材料结构设计和改进的器件制备工艺,制备出功率增益截止频率(fmax)为183GHz的晶格匹配InP基In0.53Ga0.47As-In0.52Al0.48As HEMT.该fmax为国内HEMT器件最高值.还报道了器件的结构、制备工艺以及器件的直流和高频特性.  相似文献   
68.
MOVPE-preparation of highly ordered InP(100) and GaP(100) surfaces was monitored with in-situ reflectance difference spectroscopy (RDS). Specific ordered P-terminated and ordered cation-terminated surface reconstructions were identified with specific structured RD spectra with the highest peaks. After contamination-free transfer of the samples to UHV, RDS measurements were performed also at 20 K. The experimental RD spectrum for the In-terminated, (2×4) reconstructed InP(100) surface shows a remarkable similarity to a recently published theoretical spectrum, whereas there is only moderate similarity between the experimental RD spectrum for the (2×4) reconstructed Ga-terminated GaP(100) surface and a recently proposed theoretical spectrum.  相似文献   
69.
We report the organometallic vapor phase epitaxial (OMVPE) growth of InP and Ga0.47In0.53As using a new organometallic indium source, ethyldimethylindium (EDMIn), rather than the traditional sources triethylindium (TEIn) or trimethylindium (TMIn). EDMIn is a liquid at room temperature and its vapor pressure at 17° C was found to be 0.85 Torr using thermal decomposition experiments. The growth results using EDMIn were compared to those using TMIn in the same atmospheric pressure reactor. For InP, use of EDMIn resulted in a high growth efficiency of 1.3 × 104 μm/ mole, which was independent of the growth temperature and comparable to the growth efficiency obtained with TMIn. The high growth efficiency is consistent with the observation of no visible parasitic gas phase reactions upstream of the substrate. The 4K photoluminescence (PL) spectra consist of a peak due to bound excitons and an impurity related peak 38 meV lower in energy. This impurity peak is ascribed to conduction band to acceptor transitions from carbon, due to the decreasing relative intensity of this peak with increasing V/III ratio. The relative intensity of the C impurity peak decreases by five times when the growth temperature is increased from 575 to 675° C, with a corresponding increase in the room temperature electron mobility from 725 to 3875 cm2/ Vs. For GalnAs lattice-matched to InP, use of EDMIn also resulted in a temperatureindependent high growth efficiency of 1.0 x 104 μm/mole, indicating negligible parasitic reactions with AsH3. The In distribution coefficient was nearly constant at a value of 0.9, however the run to run composition variation was slightly higher for EDMIn than for TMIn. The 4K PL showed donor-acceptor pair transitions due to C and Zn. The C impurity peak intensity decreased dramatically with increasing growth temperature, accompanied by an increase in the room temperature electron mobility to 5200 cm2/Vs. Overall, the growth of both InP and GalnAs using EDMIn was qualitatively similar to that using TMIn, although the room temperature electron mobilities were lower for the new source than for our highest purity bottle of TMIn.  相似文献   
70.
Tin as a donor dopant in OMVPE epilayers of InP has been studied for its dependence on growth parameters to assess the nature of the dopant incorporation from a tetraethyltin (TESn) source and to establish reproducible conditions for tailoring carrier concentrations. Free carrier concentrations depend linearly on Sn/In ratio and are independent of PH3 concentration consistent with the impurity incorporation on In-lattice sites. The carrier concentration saturates at 3 × 1019 cm3 and is accompanied by excess Sn accumulation on the layer surface. X-ray diffraction shows an expansion of the lattice proportional both to the measured free carrier concentration and to the TESn gas concentration up to solid saturation. The lattice expansion is larger than expected from Sn for In radius substitution. SIMS profiles for abrupt turn-on and turn-off of the dopant source show transient changes of Sn concentration consistent with a Sn surface layer buildup.  相似文献   
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