Degradation of NiCr/CuNiMn/NiCr films on alumina substrates

This paper addresses the aging behaviour of NiCr/CuNiMn/NiCr triple layers on Al₂O₃ ceramics at temperatures up to 200°C for film thicknesses d0.5 μm. Investigations of the film structure and the increase of resistance and its temperature coefficient during the annealing process and studies of the dependence of this aging drift on both the film thickness and the storage temperature have been carried out. Furthermore, the film stress and the effect of substrate bending on resistance have been measured. The results can be explained by the irregular film structure (columns and small bridges between them), which causes stress and current concentrations as well as local creeping, cracking and oxidation processes in the micro-bridges. They are compared with such for structurally homogeneous films on silicon wafers.     

柱形颗粒群直径分布的激光衍射测量技术

提出了用激光衍射功率谱方法测量柱形颗粒群直径分布的技术方法，解决了长颗粒随机排列时的功率谱探测，及数据快速优化方法等技术难题。此技术已地应用于由羊毛和化纤截成的柱形颗粒群直径分布的测量，实现结果证明了此技术的可行性和实用性。     

Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect

We have recently developed an optical contactless method for testing the quality of solder joints during accelerated thermal cycling ageing processes.¹ The method was based upon the measurement of the dynamic thermal behaviour of the joint to short bursts of Joule heating. It has proved to be efficient in revealing the formation of cracks at the lead-solder interface. We present a method to evaluate ageing at a much earlier stage in the cycling process. We have observed in earlier work,¹ that before cracks appear, structural changes occur in the solder at the lead-solder interface. The thermal response of the solder joint is recorded over time to a Peltier heat perturbation produced by flowing a current pulse through the interface where structural changes occur. The key point in this method is to discriminate the Peltier effect from the Joule thermal response because both effects generate heat. The variation of the early Peltier response in the thermal cycling ageing tests is seen as a quantitative signature of the structural changes in the lead-solder interface.     

轴端沟槽底部激光强化工艺参数优化研究

分析了选用不同激光能量密度对HT300进行表面强化处理时，材料表面呈现的四种状况；未相变硬化、相变硬化、表面微熔与表面熔凝的金相组织。根据工艺要求，选取相变硬化方法对轴端沟槽底表面进行处理。分析了工件激光处理方法并通过试验研究，寻找轴端沟槽底部激光强化工艺参数；激光功率（P）、光斑直径（D）及扫描速度（V）的优化组合。硬度测试及耐磨性能试验表明：激光相变处理和激光熔凝处理后轴端沟槽底部表面较表面感应淬火硬度分别提高7%和34%，绝对磨损体积分别下降了13%和25%。实践证实，对轴端沟槽底部激光相变硬化处理方法较其他表面处理方法工艺简单，加工工件符合技术要求，试验结果对零件表面处理提供了可靠依据。     

高性能2.5Gb／s用的DFB—LD／EA单片集成器件

报导了采用全ＭＯＣＶＤ生长的１．５５μｍ的单片集成ＤＦＢ＝ＬＤ／ＥＡ组件的 在ＤＷＤＭ系统上的传输测试结果，出纤功率Ｐｆ≥２．５ｍＷ＠Ｉｆ＝７５ｍＡ，边模抑制比ＳＭＳＲ〉３５ｄＢ，调制器反向偏压为２．５Ｖ时的消光比为１４ｄＢ，该发射模块在２．５Ｇｂ／ｓＤＷＤＭ系统上进行了传输试验，传输２４０Ｋｍ后无误码，其通道代价≤１ｄＢ＠ＢＥＲ＝１０＾－１２。     

Improvement of the methods of reproducing and transferring the dimensions of the unit of sound pressure in an aqueous medium under free-field conditions

Methods of reducing the predominant components of uncertainty in standards of sound pressure in an aqueous medium in a free field, and also methods of increasing the accuracy when the dimensions of the unit of a physical quantity are transferred by the means employed in natural measurements are reviewed. __________ Translated from Izmeritel’naya Tekhnika, No. 8, pp. 59–63, August, 2007.     

基于图像处理的炮管轴线直线度检测方法

在分析国内外直线度检测现状和比较了直线度测量的激光准直法、圆度法、杠杆法优缺点的基础上,提出了一种基于图像处理的炮管轴线直线度检测激光反射法.该方法通过激光器发出激光,经准直后射向分光镜,部分反射后射向测量元件.测量元件在炮管内移动并感知炮管实际轴线位置的变化.激光经反射后透射过分光镜到光靶上,CCD摄像机摄得光靶上被测信息的图像.经过图像处理及数据处理得出对应被测截面图像中的激光束中心,按照角度积累的公式计算出轴线直线度误差.同时论述了在Win98和VC++6.0环境下软件实现的步骤.实验结果表明该方法具有灵敏度高、测量速度快,对被测对象尺寸要求较低,适合在工厂内使用等优点.     

激光陀螺随机噪声参数估计和滤波方法研究

激光陀螺(RLG)中随机噪声是影响其精度的一个重要因素,针对其噪声的特殊性质,采用小波方法去除随机噪声,提高激光陀螺的精度。通过小波分析的参数估计方法获得噪声参数,并用小波阈值滤波方法去除噪声,对某型号的RLG的滤波结果表明了该方法的有效性。     

直接成像技术在PCB中的应用

电子产品日趋小型化、轻量化、多功能化，使电路板线路密度增加，从而对电路板的制作技术有了更高的要求，普通的接触曝光成像技术不能满足高密度电路的要求，激光直接成像（LDI）技术正迎合了精细线路的要求，而在PCB制作中得到应用。介绍了LDI的成像原理、存在的优缺点及其在PCB制作中的应用。     

液晶显示器生产中的激光退火和缺陷修复

由于在大面积玻璃基底上制备由多层材料构成的高质量薄膜晶体管象元驱动阵列工艺的复杂性，使有源矩阵液晶显示器（AMLCD）的成品率低、价格高。利用激光对AMLCD进行非晶硅薄膜的退火和电路缺陷的修复，可有效的改善AMLCD的性能，提高成品率和降低成本。本文在介绍了激光对非晶硅薄膜退火和电路缺陷修复常用激光器的特性后，讨论了激光对不同类型缺陷修复的原理和过程。最后，分析比较了不同类型激光退火方法的特点。